![]() SENSOR DEVICE WITH MAJORITY CURRENT AND CURRENT CONTROL CIRCUITS
专利摘要:
A majority-current-assisted detector device comprising a semiconductor layer of a first conductivity type, a plurality of control regions of the first conductivity type, at least a detection region of a second conductivity type opposite to the first conductivity type, and a first source for generating a majority carrier current associated with an electric field, characterized in that it further comprises control circuits adapted to control the first source and control individually at least one of said first majority carrier currents. 公开号:BE1024389B1 申请号:E2017/5016 申请日:2017-01-12 公开日:2018-02-12 发明作者:Der Tempel Ward Van;Nieuwenhove Daniel Van 申请人:Softkinetic Sensors Nv; IPC主号:
专利说明:
(30) Priority data: 01/15/2016 EP 16151588.7 (73) Holder (s): SOFTKINETIC SENSORS NV 1050, BRUXELLES Belgium (72) Inventor (s): VAN DER TEMPEL Ward 3140 KEERBERGEN Belgium VAN NIEUWENHOVE Daniel 1981 HOFSTADE Belgium (54) DETECTOR DEVICE WITH MAJORITY CURRENT AND CURRENT CONTROL CIRCUITS (57) The invention relates to a majority current assisted detector device, comprising a semiconductor layer of a first type of conductivity, a plurality of control regions of the first type of conductivity, at least one region of detection of a second type of conductivity opposite to the first type of conductivity, and a first source for generating a current of majority carriers associated with an electric field , characterized in that it further comprises control circuits designed to control the first source and individually control at least one of said first majority carrier currents. BELGIAN INVENTION PATENT FPS Economy, SMEs, Middle Classes & Energy Publication number: 1024389 Deposit number: BE2017 / 5016 Intellectual Property Office International Classification: G01S 7/486 G01S 17/89 Date of issue: 02/12/2018 The Minister of the Economy, Having regard to the Paris Convention of March 20, 1883 for the Protection of Industrial Property; Considering the law of March 28, 1984 on patents for invention, article 22, for patent applications introduced before September 22, 2014; Given Title 1 “Patents for invention” of Book XI of the Code of Economic Law, article XI.24, for patent applications introduced from September 22, 2014; Having regard to the Royal Decree of 2 December 1986 relating to the request, the issue and the maintenance in force of invention patents, article 28; Given the patent application received by the Intellectual Property Office on January 12, 2017. Whereas for patent applications falling within the scope of Title 1, Book XI of the Code of Economic Law (hereinafter CDE), in accordance with article XI. 19, §4, paragraph 2, of the CDE, if the patent application has been the subject of a search report mentioning a lack of unity of invention within the meaning of the §ler of article XI.19 cited above and in the event that the applicant does not limit or file a divisional application in accordance with the results of the search report, the granted patent will be limited to the claims for which the search report has been drawn up. Stopped : First article. - It is issued to SOFTKINETIC SENSORS NV, Boulevard de la Plaine 11, 1050 BRUXELLES Belgium; represented by OFFICE KIRKPATRICK S.A., Avenue Wolfers 32, 1310, LA HULPE; a Belgian invention patent with a duration of 20 years, subject to payment of the annual fees referred to in article XI.48, §1 of the Code of Economic Law, for: DETECTOR DEVICE WITH MAJORITY CURRENT AND CONTROL CIRCUITS CURRENT. INVENTOR (S): VAN DER TEMPEL Ward, Piervenshoek 19, 3140, KEERBERGEN; VAN NIEUWENHOVE Daniel, Heymansstraat 17, 1981, HOFSTADE; PRIORITY (S): 01/15/2016 EP 16151588.7; DIVISION: divided from the basic application: filing date of the basic application: Article 2. - This patent is granted without prior examination of the patentability of the invention, without guarantee of the merit of the invention or of the accuracy of the description thereof and at the risk and peril of the applicant (s) ( s). Brussels, 02/02/2018, By special delegation: BE2017 / 5016 DETECTOR DEVICE WITH MAJORITY CURRENT AND CURRENT CONTROL CIRCUITS Technical field of the invention The invention relates to a current assisted detector device. majority for detecting electromagnetic radiation incident on a semiconductor layer, a current of majority carriers being generated between two control regions and minority photogenerated carriers being directed towards a detection region under the influence of an electric field generated between the control regions. The invention can be used in imagers, in particular time of flight imagers. Invention background Nowadays, more and more detection devices use time-of-flight technologies (DDT) to obtain depth information. A basic time-of-flight (DDT) camera system 3 is illustrated in Figure 1. DDT camera systems capture 3D images of a scene 15 by analyzing the time-of-flight of light from a light source 18 to an object. A DDT camera system 3 comprises a camera, with a dedicated lighting unit 18 and data processing means 4. The operating principle of a DDT camera system consists in actively lighting scene 15 with modulated light 16 at a predetermined wavelength using the dedicated lighting unit, for example 2 BE2017 / 5016 with certain light pulses of at least a predetermined frequency. The modulated light is reflected back by objects in the scene. A lens 2 collects the reflected light 17 and forms an image of the objects on an imaging sensor 1 of the camera. According to. distance of objects from. camera, a delay appears between the emission of the modulated light, for example said light pulses, and the reception at the level of the camera of these light pulses. A distance between reflective objects and the camera can be determined based on the observed time delay and the constant value of the speed of light. In another more complex and reliable embodiment, a plurality of phase differences between the emitted reference light pulses and the captured light pulses can be determinedestimate by measureinformation correlation ands deep. used for The determined ion of differences live can be realized e in particular by demodulator irs photoni . that s current assisted i ÎCAPD). The principle CAPD East explained in EP1513202 and. illustrated by Figures 2A-C. It is based on demodulation nodes, the so-called "leads". The CAPD shown in Figures 2A — C has two leads. Each lead comprises a control region 61, 62 and a detection region 63, 64. By controlling a potential applied between the control regions 61 and 62, it is possible to control the detection capacity of the associated lead. When a photon is incident on the. photosensitive area of a pixel, an electron-hole pair e- / h + can be generated at a certain location. The electron-hole pair will be separated by an electric field which is present and BE2017 / 5016 which is associated with the majority current in circulation. This electric field will bring. the photogenerated minority carriers 66, 69 to drift in the direction opposite to the majority current in circulation, that is to say towards the detection regions 63, 64, respectively. When a pixel comprises several leads and when a positive potential is applied to a lead compared to the other leads, this lead is. activated and. will receive it. majority of the photogenerated minority carriers in the pixel, as illustrated by FIGS. 2B and C. By applying appropriate control signals to the control regions, correlation measurements can be made. be carried out and. depth perception can be obtained. A challenge regarding time of flight sensors based on CAPD pixel devices aims to. optimize the system and. the TOF sensor for the needs of situations and use cases encountered. It is preferable that these optimizations can be carried out without hardware changes and. in a dynamic way. The first optimization aims to adjust the resolution of the sensor to the needs of the situation. By when a strong ambient light is present situation, this light adds ative amounts of noise to the TOF and measurement. the TOF system of these spatial example, in the s i cm i f .i c could choose to lower the spatial resolution by means of TOF pixel partitioning (adding together individual pixel information) to obtain a more precise depth estimate. The disclosed invention presents a way to obtain this resolution control in the field of BE2017 / 5016 charge. This means that reading noise can be reduced compared to compartmentalization techniques in the digital domain. The present invention relates to a sensor comprising collaborative pixels on the basis of a CAPD principle according to claim 1. In the prior art, the optical area of each unique pixel in a sensor is assigned to the N leads (or detection regions) of the pixel. Control regions (implantations p in the case of CAPD devices, polysilicon grids in the case of PMD devices, etc.) allow the leads to intermittently collect the minority carriers generated in the optical zone during the active window of each lead . In the case where the pixel is constructed with only one derivation, a discharge or drainage node is provided in the pixel to discharge the minority carriers generated in the time window outside the active window of the derivation. This is the classic DDT pixel architecture of the prior art, in which each pixel is a closed system in theory if non-idealities, such as hyperluminosity and crosstalk, are not taken into account. The present invention introduces the concept of collaborative pixels, each pixel operating in conjunction with surrounding pixels. The principle mainly applies to DDT pixels comprising a BE2017 / 5016 single derivation, but may extend to more than one. t i ο n s p a. r p i x e 1, Each pixel can now share at least a portion or portion of its optical area, said optical area also being called by volume, with surrounding pixels and, similarly, surrounding pixels can share at least a portion or portion of their optical area with at least the optical area of at least one other pixel. The pixel control region controls the activity window of the detection (or bypass) region. In the activation state, the detection region gathers minority carriers generated in its optical zone, but also gathers from shared optical zones surrounding pixels in an inactive or stopped state. In the stopped state, the optical zone becomes available for the gathering of minority carriers by the nearest active neighbors. By careful control of the individual bypass control signals, the pattern created by the collaborative pixels in the sensor can be adjusted. Likewise, using the correct command signal, a pixel could become entirely inactive (for example with an unconnected command signal) and bypassed in the collaboration. This allows adjustment of the actual sensor resolution since the entire image sensor area is now distributed over fewer functional leads. Such careful control allows the creation of overlapping virtual pixel areas. (200) by sharing one or more parts of the associated volume of a pixel with one or more pixels BE2017 / 5016 neighbors, but it also allows the change of the optical area. The pixel detector device of the present invention may include control circuits adapted to control the first source and individually control at least one of said first majority carrier currents. Thanks to this individual control, a larger pixel is artificially created and the functional pixel structure is. enlarged to a larger virtual pixel area, similar to what would happen if the pixel data was compartmentalized together during post-processing. This individual command has the advantage of requiring only one reading for the artificially larger pixel. Thanks to individual control, both problems of reading time and high reading noise are solved. Preferably, the detector device further comprises a plurality of adjacent leads, each lead comprising at least one detection region and at least one control region, and the control circuits are further adapted to place two adjacent leads in a state nondetection, by reducing or eliminating a first current of associated majority carriers, to allow redirection of the minority carriers generated on the nearest detection region. Thanks to this feature, compartmentalisation is carried out in real time and "on a chip". A selector is preferably implemented in the detector device of the present invention BE2017 / 5016 to select a predetermined voltage V r „ ix to be applied to the regions of control by the first source. Selectors can also be implemented on a column level to assign orders at from s g- roups of pixels. This 11 th def .i n i t .i ο n dynamic mo t i f may be obtained by order of column level selectors. The first source may also be able to supply a direct current (DC) voltage, making it possible to obtain only vertical fields. Brief description of the drawings The present invention should be better understood in the light of the following description and of the s s i n s a η n e s. Figure 1 illustrates the basic operating principle of a DDT system; Figure 2A shows a top view of a device according to the prior art, Figure 2B and Figure 2C show a cross-sectional view of the device of Figure 2A with two different current conditions; Figure 3 shows an example of the detector device according to the present invention; Figure 4 shows a further example of the detector device according to the present invention; Figure 5 shows a possible family of signals to be used by the first source in Figure 3; BE2017 / 5016 Figure 6 to Figure 9 show different phase configurations of pixels in the dispositi f of detector according to the present inv you gold·. f- ή r ·. " x x U -i- _ · x x f the Figure 10 represents a other example of dispositi f of detector of invention r ia Figure 11 represents a other example of dispositi f of detector including dei 3 f ilt optical res according to present invent 1 / * ·>. ΤΊ »± i> the Figure 12 represents a other example of dispositi f of detector by means of which s voters of column level allow different patterns and / or modes of compartmentalization; FIG. 13 represents another example of the detector device by means of which column level selectors allow different patterns and / or modes of compartmentalization. Description of 1 / invention The present invention will be described with reference to a detection device 300 also called SENSOR. The detection device 300 contains PIXELS 125 also designated by PIXEL. Generally, the Pixel 125 contains at least 1 DERIVATION, comprising at least 1 detection region and at least 1 control region also designated by DERIVATION. The invention will also be. explained with reference to a substrate and a p-type epitaxial layer, but the present invention comprises, within its framework, a complementary device by which regions p and n become regions n and. p, respectively. Those skilled in the art can make such a modification without departing from the spirit of the invention. BE2017 / 5016 it should also be understood that the terms n, p, n +, p + and p-, well n, well p, deep n well and deep p well are well known to man of career . The term s n, p, n +, i and P - s e referent at beaches of level doping ix in my holidays GG s e m. i - c ο n du cte u r good known by the i man from the mete .er. The terms n and p refer to n-doped and p-doped regions, generally regions of arsenic and boron, respectively. n +, p + refer to shallow highly doped contact regions for WELLS N and WELLS P, respectively, p- refers to a lightly doped p-type region such as WELLS P. The present invention relates to embodiments relating to both front side lighting (FSI) and rear side lighting (BSI) devices. Front side lighting devices. and rear side lighting are defined by reference to the location of the circuits on the chip by comparison with the incident light. FSI means a device where the. light is incident on the same side as the circuits. With FSI, light falls on the front side of the circuits, and passes through the reading circuits and interconnects before being collected in the photodetector. On the contrary, BSI means a device where the light is incident on the other side, where the circuits are not present, that is to say on the rear side. The main idea behind using a BSI structure is that no light is lost during the passage through the circuits. BE2017 / 5016 Li Figure r shows in ex eng d / ur ositif detector according to the present invention. The detector device 300 of the present invention is assisted by majority current to detect electromagnetic radiation. The radiation can be any type of radiation, but preferably light in the visible range or infrared radiation. The detector device 300 comprises a radiation s generate, at ..nterreur of it, majority and minority pairs of carriers 121. The semicircle - "/ * ·>, ΤΊ, <- S j j C f J J ν ' r 106 on lacquer lie to be inc ident in. c .i f G. Θ s bread his ; area 121. The horn with a c lopant from i praising ρ in 1 'e of semi -condr icte of conductivity, a Figure 3. This layer preferably doped p. the The dispos it if in addition to less two governed in the. layer of semi· ordered 100, 115 are realize! we as of: 100, 115 formed nducteur 106. The regions of rented p in the mode of can include a diffusion region p + 100 and a well p 115, so that the diffusion region pt 10 0 and the well p 115 form together the command region. Uni first source turns there to generate at mo i n s a first current. of carriers maj oritarians 104 in the layer of semi conduc their 106 between p. areas of regions of ordered, the first BE2017 / 5016 majority carrier currents 104 being associated with a respective first electric field. This source V ïnix can be a current, alternating (AC) voltage source or a direct current (DC) voltage source, as will be explained later. This source V æix is defined in this document as a voltage source, but can also be implemented as a current source. All the voltage sources described in the rest of this document (110, 111) could also be replaced by current sources. Although voltage sources are preferred, current sources have advantages over their output impedance and, therefore, may also have advantages. The detector device further comprises at least one detection region 101, 116 formed in the semiconductor layer 10 6 and which. is doped with a dopant of a second type of conductivity opposite to the first type of conductivity, that is to say a dopant n here, to form a junction and collect the minority carriers generated. In Figure 3, two detection regions 101, 116 are shown, but the invention is not limited to these and could be implemented with only one detection region, for example. Minority carriers are directed towards the detection region 101, 116 under the influence of the first electric field respectively associated with. the at least one first current of majority carriers 104. The detection regions can comprise an n + 101 and diffusion region. a well n 116 so that the diffusion region n + 101 and the well n 116 together form la. detection region. BE2017 / 5016 The detection regions and the control regions are associated in leads, a lead comprising at least one detection region and at least one control region. In the present disclosure, it will be assumed that each pixel 125 of the detector device 300 comprises a bypass. In practice, the pixel 125 can comprise more than one derivation (for example 2 leads, 4 leads, ...). A pixel includes all the elements encircled by the dotted line 125 in Figure 3. Each pixel 125 may further have the property that one or more parts of its associated volume are shared with one or more neighboring pixels, and, similarly, at least one or more parts of the associated volume of one or more neighboring pixels are also shared with said pixel. The result is that virtual pixels with an area of virtual pixels are formed, whereby the limit of the virtual pixel is the edge of the total volume that can be associated with each pixel. Due to the existence of volume sharing between pixels, the volume of the virtual pixel is generally larger than the volume of pixel 125. This volume sharing property depends on the control signals applied and may change with the C O U. T S Cl LI temp s since different signals from ordered are applied during how the dispositi f. .-X V-, x-,ly a i i S this invention, pixels can work together to obtain a modulated detection capacity. Majority carrier currents flowing between on and off state pixel control regions form electric fields BE2017 / 5016 between these pixels which, depending on the polarity of the current and the field, push minority carriers opposite the detection region and outside the optical zone of the stop pixel; or, in the activation state, attract minority carriers in the optical zone and towards the region of detection of the state pixel. same state NC (Not Connected) eg which the pixel does not influence the field in the substrate can be considered, for example, by forcing the current of majority carriers of control region to 0, making the pixel transparent, whereby the optical zone of this pixel is used by and shared with a current conch of majority carriers of passage created by other groups of pixels of activation / stop in interact: From jKiDreux: states can be considered to perform variations of sensitivity using the current flexibility of majority carriers, the rest of this document will be limited to the explanation of the state, activation / stop / NC . By means of the control regions, the pixels can be in an on / off / NC state, but also in an intermediate state element of a continuous set of states. In the case where the pixel has more than 1 lead, each lead will have a state. The pixel control regions of the detector device 300 can be organized into groups of at least 1 pixel, forming a pattern, the pixel control regions in the same group having the same control state. BE2017 / 5016 Each group of pixels, comprising at least one pixel, may further comprise control circuits for applying the desired state to the control regions of the group. The applied state is generally a dynamic signal. The detector device 300 may also comprise isolation means 103, formed in the semiconductor layer 106 to increase the path resistance by deflecting the first current of majority carriers 104 generated by the first source V ^ x between pixels with on and off command regions and therefore first The amplitude maj oritaires 104 could consequently current, reauire of carriers reduce the energy consumption of the detector device 300. These isolation means can comprise at least one region of isolation box 103, which can be arranged at various locations between the pixels. Box regions; olal .03 isolation barriers can be implemented in many different ways, for example by etching techniques, such as deep or shallow trench engraving, or by implementing barriers of insulation applied before an epitaxial growth. The t, tp U. c. r-} I i T q important is qi increase the resistance of the carrier current path: majority between a c t i v a t i ο n / stop. ie: .xel groups: barrier 103 may be in a number of ways to avoid leakage along the barrier in the form of surface states and BE2017 / 5016 engraved surface with leak. To avoid this, the insulation box 103 can be, for example, a deep etching, with an insulator 1001 between the silicon surface of the etching. It could be, for example, but without there 1 i m i t e r, from a n oxide of silicon and for example (But > without limitation) of a kh <5 1 Kv v. ichon of polysilicon 1002 in the engraving box é, qu 1. polarizes the potential of the polysilicon plug to avoid formation of channel on the surface of g- r avu r e, like illustrated on 1 a Figure 4 . The means of isolation ation 103 are preferably polarized ci V Θ C a potential. The region of isolation box or the deep isolation box area can be filled with a semiconductor or electrically conductive material so that a voltage can be applied. The detector device 300 of the present invention may include at least one additional isolation box region 150 formed at the rear side of the semiconductor layer 106, as illustrated in Figure 4. The function of these regions Additional insulation box 150 is to prevent deeper penetrating light beams from entering adjacent pixel regions by adjusting the refractive index of the box filler material relative to the refractive index of silicon. The isolation box regions 103, 150, formed in the front side of the semiconductor layer or both in the front side and in the back side of the semiconductor layer, may include box regions deep insulation and / or very deep insulation box regions. BE2017 / 5016 Preferably, the thickness of the semiconductor layer is suitable for back side lighting (BSI) and the detection region 101, 116, the control regions 100, 115 (and the isolation means 103, s' they are present) are formed in the front side of the semiconductor layer 106. More preferably, a second source V bi3S 111 is implemented in the detector device 300 to generate a second current of majority carriers 105 in the semiconductor layer 106 between at least one control region 100, 115 formed in the front side of the semiconductor layer 106 and the rear side of the semiconductor layer 106. Said second current of majority carriers 105 is associated with a respective second electric field. The minority carriers generated are directed to the side before. of the layer of semiconductor 106 sub The infl U. θ ΓΊ ru i i LL of second field é 1 e c t r i qu respect i v eme n t. associated é have f u mo i n s a. s econd current of carriers my i ori your ires 10 5. The co rear tee e from detector device 300 may include a passivation layer 107 formed on the rear side of the semiconductor layer 10 6 and which is doped with a dopant of the first type of conductivity, for example a p + 107 doped layer. This helps to diffuse the field applied to using source 111. Another possibility is. to have a lightly doped epitaxial layer on top of a highly doped substrate. This substrate can then also be used BE2017 / 5016 to diffuse the applied voltage using the source .11 and could be amine r-} n i T r · recmirc qu The detector device 300 can also comprise at least one contact region 108 formed on the rear side of the semiconductor layer 10 6 and with a dopant of the first type of The second current of carriers is generated by the second source 111 in the semiconductor layer 106 between .1 'at least one control region 100, 115 formed in the front side of the semiconductor layer 106 and said contact region 108. is doped c ο n c t i v i t e. na ί o r i t a i r e s 10 5 Another way to contact the rear side could be a deep p-structure at the front side, deep enough to connect to the passivation layer. Therefore, this well p can be biased from the front side and. allows the intensity of the second electric field to be applied and controlled. Thus, the passivation layer 107 can be brought into contact using a deep well formed in the front side of the semiilayer should be understood that, even without using such elements 107, 108 and 111, operation of the detector device 300 in a BSI configuration is possible, since an integrated electric field is generally present vertically in the device 300. These elements are possibly used to improve the second electric field. L-: voltage rces V r , 110 and V bi invoke field guidance in the semiBE2017 / 5016 layer ΪΊ t ’T ' carrier and a e s se c ο n d of the worm r. Vjnix is applied to adjacent pixels as shown, while V blas induces a voltage delta between the front side and the rear side of the semiconductor layer 106. These voltage sources 110 and 111 induce first majority currents 104 between pixels, majority carrier currents 105 from the rear, respectively. An electric field is induced in opposition to the current detection. When light reaches the semiconductor layer 106 from the rear side, electron-hole pairs 121 are generated. The hole flows with the induced majority current towards the rear side, while the electron is guided towards the front side. Once near the front side, the electron will be driven to the pixel with the most polarized p + scatter 100, where it will enter the adjacent i + diff reading 101 and enter the pixel circuit 120 for processing additional. This circuit 120 can be a 3T, 4T or other pixel read circuit. The processing circuits 120 can be designed to sample a value linked to the charge of minority carriers collected by the detection regions and to process said value and deliver time of flight data. The invention allows an intelligent organization of pixel structures and allows the improvement of compartmentalization methods in DDT imagers. Partitioning is the aggregation of individual pixel information, generally to improve the signal-to-noise ratio of the compartmentalized information. Information can, for example, be represented in electrons, current, voltage or digital numbers. BE2017 / 5016 only possible family of 110 in Figure 3. the state of the region. Figure 5 represents signals to be used by the source In this case, the signal oscillates, controlling between an activation state and stop with a certain frequency and a certain phase. Alternatively, the control signal could switch between other predefined states, hv and d (se: uixel : 1s than NC (not shown enté). detector associated cha ± i Lt cl LJ. signals from order from . pixel nants. Bi in that beach se / time (in seconds or 0 - (sinusoidal On, PRES, in . teeth 5 used, we use will be 360) and of forms of saw sign, square, can be in this description of the square waves and. combinations of phase delays of 0 ° / 90 ° / 180 ° / 270 °, the 0 ° signal is generally modulated light. used for gns Figure 6 shows a diagram on how to organize the pixel in a detector device, for example a DDT imager, a checkerboard pattern being used, applying phase shifted signals of 0 ° and 180 °. Pixels marked with a 0 are linked to. a terminal of the V mix 12 0 source shown in Figure 3, while pixels marked with 180 are connected to the other side. In typical operation, two measurements are taken: one with a phase delay of 0 and. 180 degrees, then one with a phase shift of 90 and 270 degrees. It can be noted that, for this particular configuration, each control region is at all times surrounded by control regions with another control signal. For example, as shown in the drawing, each control region polarized with a phase shift of BE2017 / 5016 degree is surrounded with 4 pixels with a phase shift of 180 degrees, therefore, in this embodiment, each control region is surrounded with control regions with a control signal in phase opposition. In other words, when a pixel is in the surrounding pixels are moved to the stopped state, and vice versa. Many other configurations can be envisaged, for example where all the columns or rows have the same control signal (for example, phase shift of 0 degrees) and each other row or column changes phase shift (for example, phase shift of 180 degrees) or other configurations as shown in the following drawings (for example, Figure 7, as will be described below). For a pixel, the virtual pixel area 200 is shown, which extends beyond an individual cell. This virtual pixel area is similar for all pixels in the array and results from field lines extending outside the pixel boundaries when close to the sensitive surface, as shown in Figure 3. Therefore , the virtual pixel area of one pixel overlaps the virtual pixel area of one or more neighboring pixels. As all the acquired information overlap, one may wish to carry out a postprocessing to calculate the data phase shifted from 0, 90, 180, 270 degrees isolated by pixel. This can usually be done using data from surrounding pixels in time and space, for example, by performing simple interpolation, using median values, or choosing combinations of data;> u means BE2017 / 5016 based on additional information, such as gradients / edges or detected movement. In conventional color sensors, similar concepts exist for obtaining color data per pixel, called demosaicing, where they are generally used for obtaining Red, Green, Blue data per pixel, as is known to man. of career. Organizing a DDT imager in such a way allows all of the incident light to be used, since it is captured at all times in a detector node, but does not require a high number of leads in each pixel, which would require, a larger pixel structure. This ability to configure the virtual pixel area is obtained by rearranging the electric fields in the CAPD as discussed above. In summary, it may be preferred to design an image sensor comprising a plurality of detector devices, the image sensor being designed to perform this additional demosaicing step to calculate individual pixel data from overlapping pixel data obtained. Another diagram is shown in Figure 7, where. the data associated with 0, 90, 180, 270 degrees are obtained in parallel by driving the different phase-shifted Vïnix signals to different pixels in the imager. In order to increase the signal-to-noise ratio, it is important to have flexible mechanisms to compartmentalize pixel data together, creating a BE2017 / 5016 larger pixel. The detector device 300 of the present invention solves this specific problem, from the bottom up. In Figure 8, a diagram is shown, on which several pixels are placed in an Unconnected state (= NC), thus interacting as little as possible with the current of majority carriers and the electric field associated with the remaining functional pixels. Consequently, minority carriers created by the incidence of light or other generation phenomena are transported by the present electric field. The optical area of the NC pixels then forms part of the groups of functional activation / deactivation pixels whose electric field passes through the pixel NC. Therefore, the functional pixel structure is enlarged to a virtual pixel area 202, similar to what would happen if pixels were compartmentalized together on the charge domain, thus requiring fewer pixel readings. To better illustrate the concept, in Figure 9, an even larger pixel with a virtual pixel area 203 is obtained by placing more pixels in the NC state. Concretely, any form or structure of NC with respect to connected pixels can be produced, the light entering above the. pixel structure NC being distributed equally over the surrounding connected pixels. These compartmentalization states can be decided at runtime by configuring pixels in the NC state, while others are kept in operation. This allows an approach to BE2017 / 5016 very flexible compartmentalisation, configurable during 1 / execution. The configurations of s me s u r e s obtained in the example diagram as Figures 8 and 9 show measurements at 0 and 180 degrees. Obviously, 90 and 270 degrees could be further measurements again, or by configuring pixel to get it in parallel, shown in Figure 7. The NC state might not be connected, but could also be minimally connected with a lower voltage or a different voltage. The idea of this state is to place pixels in a nondetection state and to allow the redirection of the minority carriers generated in these pixels, here electrons, to the nearest detection region. The state of non-detection of said pixels can be obtained by disconnecting their control regions so that the first associated majority carrier current (104) is eliminated. Alternatively, the state of non-detection of said pixels can be obtained by connecting their control regions to a predetermined voltage so that the first associated majority carrier current (104) is reduced, the predetermined voltage being less than a voltage used in a detection state. In other words, instead of placing the pixel in an NC state in which it would not participate, the pixel can be placed in a state, in which it would still participate, but would receive less signal, thus creating a pixel with a reduced sensitivity. This can be BE2017 / 5016 advantageous for creating a more dynamic range or allowing robustness of ambient light. In addition, additional control of individual pixels or groups of pixels may be necessary and / or beneficial in the case of enlarging the virtual pixel area by deactivating the pixels in the middle. For example, an additional reset line command may be provided at the point where the unused pixel detectors are left saturated so that they can no longer trap minority carriers. Essentially, this then serves as an alternative for placing a pixel in the NC state. This command can be implemented by pixel, or groups of pixels, or on column level or row level, in groups of rows or columns or on a chip level. The detector device 300 of the present invention may include control circuits designed to control the first source (110) and individually control at least one of said first majority carrier currents (104). Additionally, the detector device 300 of the present invention may include a plurality of adjacent pixels, each pixel comprising at least one detection region and at least one control region. The control circuits can furthermore be designed to place groups of at least 1 pixel in an activation, stop, NC or other detection or non-detection state, by reducing, eliminating or reversing a first current of associated majority carriers (104) to allow redirection of the generated minority carriers to the nearest detection region. BE2017 / 5016. The control circuits can also be designed to temporally cancel at least one of said first currents of deviated majority carriers 104 by controlling the source appropriately. The control circuits can also be designed to reduce or eliminate the associated derivations participating in the detection of the generated minority carriers, as explained. > U3 Figure 10, another: xemp. dt detector device 300 of the present invention is shown. Figure 10 explains the practical implementation of DDT and. data partitioning. In this embodiment, in each pixel, a selection switch 16C is mi: in use> OUj select a predetermined voltage V m after marking mx control regions 115,: ce 110. Grace Cf 17 ci C Θ ci voter: 160, ra premiere lor: dr DDT operation of the device, several different modulation signals can operate the regions via the voltage sources V ir 110, to obtain the sigr inar oxcmo œ 0 °, 90 °, 180 ° (for example u, yu, selector 160 is m ux of DDT reqc correlation ! i s 270 °) . In each pixel, the artwork to select ie to 1 .a order region of guidance, or select the node NC, allowing the compartmentalization operation as presented in Figures 8 and 9. If a memory element is present in each pixel to allow selection by pixel of the channel, arbitrary compartmentalization patterns must be m: n work. BE2017 / 5016 When the lighting of specific areas can be turned on / off at runtime, a system could be constructed in which the lighting of specific areas is turned on / off in conjunction with the sensor areas that are turned on / off. One type of lighting that could achieve this is a VCSEL network, In addition, certain areas in which light is only detected and not demodulated could be envisaged, by selecting a DC voltage (not shown). This creates a non-DDT operating mode, attracting light in a continuous mode, The control circuits or the selector switches can also be arranged on a column and / or row level, be per unit or groups of units or on a global level. Figure 12 shows an embodiment of the invention by means of which, via the column level selector control, the arrangement of the detector device can be changed. In this example shown in FIG. 12, it is possible, by modifying the state of the selectors, to switch from a checkerboard arrangement of DDT 0/180 detectors to a columnar arrangement of DDT 0/180 detectors. Figure 13 shows another embodiment of the invention by means of which, through the control of column level selectors, the arrangement of the detector device can be changed. In this example shown in the BE2017 / 5016 Figure 13, it is possible by modifying the state of the selectors to pass from a checkerboard arrangement with a virtual pixel pitch of X to a lower resolution checkerboard layout with a virtual pixel pitch of X * 2 with compartmentalized optical zones, by means of selector adjustment. In Figure 11, another example of the detector device of the present invention is shown. An RVBZ implementation is shown, in which certain optical filters are applied on top of the front side or the back side of the semiconductor layer, depending on the FSI or BSI configuration, to only pass, for example, light Red + IR (represented by R in Figure 11), la. Green light + IR (represented by V in Figure 11), Blue light + IR (represented by B in Figure 11), IR light (represented by D in Figure 11). After the normal DUT operation acquiring the Z data as described above and which. can be performed at. at a different time or in different pixels, the invention can also be optimized for regular imaging. To this end, the. first source 110 is able to connect all the control zones to the same potential, deactivating the DUT operation and allowing RGB and IR intensity data to be better isolated by pixel. This makes it possible to obtain only vertical fields, induced by integrated fields and. a voltage source 111. This helps to induce only vertical movement relative to the electrons and to maintain the lateral position in which the electron-hole pair has been photogenerated. This avoids mixing the electrons generated under the different filters which could be applied on top of each cell BE2017 / 5016 individual (Red, Green, Blue, IR, Red + IR, Green + IR, Blue + iR, ...). BE2017 / 5016 FIGURES Figure 1 T i m .i n g G e n e r a t o r CPU Generate a y of c h r o n i s a t i ο n Central processing unit Figure 3 Light Pixel circuit Light Pixel circuit Figure 4 Light Lumière ïigure c Time time Figure 10 Light Pixel circui Light Pixel circuit iigure R G V B B D D BE2017 / 5016
权利要求:
Claims (15) [1] CLAIMS S 1 - Device detector (300) assisted by shift current oritary for the detection of a radiation electromagnetic ethics understand unt: - a layer < ie semiconductor (106) on which u n radiation é 1 e c t r o m a gné t ic may be incident to generate, therein, majority and minority carrier pairs (121) and which is doped with a dopant of a first type of c ο n of c t i v i t e; doped with uï - at least two pixels (125), each comprising: - at least one control region (100, 115) formed in the semiconductor layer (106), which is doped with a dopant of the first type of conductivity; - at least one detection region (101, 116) formed in the. semiconductor layer (106) and which is dopant of a second type of affixing to the first type o onuctivity to form a · “r ··, n pi r · tivivZZ junction and collect minority carriers generated; - a first source (110) for generating a plurality of first majority carrier currents (104) in the semiconductor layer (106) between control regions (100, 115), the first majority carrier currents (104) being associated with a respective first electric field; - the minority carriers being distributed between the detection regions (101, 116) of the at least two pixels under the influence of the first electric field respectively associated with the at least one first current, of majority carriers (104), the device for detector further being characterized by the fact that one or more parts of the BE2017 / 5016 associated volume of a pixel are shared with one or more neighboring pixels creating overlapping virtual pixel areas (200). [2] 2 - Detector device according to claim 1 which is further characterized in that the associated volume of a pixel changes over time. [3] 3 - Device according to claim 2 further characterized in that the control regions are organized such that a control region comprises, among its neighboring control regions, at least one control region with a different control signal .. [4] 4 - Device according to claim 3, wherein the control regions are organized so that each row or column of control regions has the same control signal. [5] 5 - Device according to claim 3, wherein the control regions are organized so that each control region is surrounded by control regions in phase opposition. [6] 6 - Device according to claim 1, wherein the detector device (300) further comprises control circuits designed to control the first source (110) and individually control at least one of said first majority carrier currents (104) . BE2017 / 5016 [7] 7 - Device according to claim 1, further comprising a plurality of adjacent branches, each branch comprising at least one detection region and at least one control region; and wherein the control circuits are further designed to place a lead in a state of non-detection or reduced sensitivity, by reducing, eliminating or reversing a first carrier current my. j o r i t a i r e s partner (104), to allow redirection carriers ; minority generated to the region of detection the closer. 8 - D i s p o s i t i f d e detector (300) according to one any of the preceding claims, further comprising multiple selectors (160) for selecting a predetermined voltage V : illx to be applied to one or more control regions (115) by the first source (110). [8] 9 - A detector device (300) according to claim 8, wherein the selector is shared between multiple pixels. [9] 10 - Detector device (300) according to claim 8, wherein the selector is shared by column or row. [10] 11 - Detector device (300) according to claim 8, wherein each pixel has a selector. 12 - Device from deteof their (300) according to the .T Θ V θ n Cl 1. C cl 11.0 Ώ 11, in which one sign ad. of comma nde s u p p 1 é me n t: a i r e is planned per pixel or by multiple of BE2017 / 5016 pixels, the additional control signal being the pixel reset signal. [11] 13 - Sensor device consisting of detector devices (300) according to any one of the preceding claims, in which the control region control wires are connected in a way allowing dynamic switching between modulation pixel patterns. [12] 14 - Detector device (300) according to any one of claims 1 to 13, further comprising processing circuits (120) designed to sample a value associated with the charge of minority carriers collected by at least one detection region ( 101, 116) and for processing said value and delivering flight time data. [13] 15 - Detector device (300) according to any one of claims 1 to 14, further comprising optical filters (R; G; R; D) on the top of the front side or of the rear side of the semiconductor layer ( 10 6). [14] 16 - Detector device (300) according to any one of claims 1 to 15, in which the first source (110) is designed to supply a current, direct voltage. revenaicai [15] 17 - Image sensor comprising a plurality of detector devices according to any one of> ns 1 to 16, in which the image sensor is. implement an additional demosaicing step to calculate pixel data BE2017 / 5016 individual from pixel data se c h e v a u c h a n t o b t e n u s. BE2017 / 5016 BE2017 / 5016
类似技术:
公开号 | 公开日 | 专利标题 BE1024389B1|2018-02-12|SENSOR DEVICE WITH MAJORITY CURRENT AND CURRENT CONTROL CIRCUITS BE1023562B1|2017-05-04|A SENSOR DEVICE ASSISTED BY A MAJORITY CURRENT. BE1024783B1|2018-07-02|Detector device with majority current and isolation means FR3060250B1|2019-08-23|IMAGE SENSOR FOR CAPTURING A 2D IMAGE AND DEPTH BE1022490B1|2016-05-04|METHOD FOR CONTROLLING A TIME-OF-VOL. BE1025050B1|2018-10-12|DEMODULATOR HAVING CARRIER GENERATOR PINCED PHOTODIODE AND METHOD OF OPERATION THEREOF EP2503596B1|2013-12-18|Electron multiplication imaging device FR3046494A1|2017-07-07|PIXEL FLIGHT TIME DETECTION US20130293871A1|2013-11-07|Sensor for spectral-polarization imaging US20160073093A1|2016-03-10|Imaging circuits and a method for operating an imaging circuit FR3030885A1|2016-06-24|COLOR IMAGE SENSOR WITH WHITE PIXELS AND COLOR PIXELS FR2971084A1|2012-08-03|MULTILINEAR IMAGE SENSOR WITH CHARGE INTEGRATION FR2662853A1|1991-12-06|Image detector with charge coupled device FR2961347A1|2011-12-16|ELECTRON MULTIPLICATION IMAGE SENSOR EP2846357A1|2015-03-11|Photodetector device with semiconductor regions divided by a potential barrier FR2476916A1|1981-08-28|DEVICE FOR DETECTING AND PROCESSING ELECTROMAGNETIC RADIATION EP1061732A1|2000-12-20|Method for biasing the photodiodes of a matrix sensor through their associated diodes/photodiodes FR2980641A1|2013-03-29|VERTICAL GRID ELECTRON MULTIPLICATION IMAGE SENSOR FR3030884A1|2016-06-24|PIXEL STRUCTURE WITH MULTIPLE PHOTOSITES FR3071102A1|2019-03-15|PHOTOSENSITIVE PIXEL AND IMAGE SENSOR FR3108784A1|2021-10-01|Charge Coupled Device FR2969390A1|2012-06-22|IMAGING DEVICE WITH INFRARED RADIATION FILTRATION. FR3008230A1|2015-01-09|MATRIX COLOR IMAGE SENSOR, WITHOUT COLOR FILTERS FR2690565A1|1993-10-29|Charge coupled detector for target tracking - includes crenellated passivation layer on light incident surface of detector to form heterojunction to modify absorption band. FR2773253A1|1999-07-02|Control system for multiple element optical detector for reading data
同族专利:
公开号 | 公开日 BE1024389A1|2018-02-05| EP3193190A1|2017-07-19| WO2017121820A1|2017-07-20| US20190025414A1|2019-01-24| US11221401B2|2022-01-11|
引用文献:
公开号 | 申请日 | 公开日 | 申请人 | 专利标题 US20030223053A1|2000-12-11|2003-12-04|Xingiao Liu|Methods and devices for charge management for three-dimensional and color sensing| EP2290393A2|2009-08-14|2011-03-02|Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.|Concept for optical distance measurement| DE102011089629A1|2010-12-22|2012-06-28|PMD Technologie GmbH|Light running time camera, has evaluation unit arranged such that removal values are determined for pixel blocks based on output signals of running time pixels, where running time pixels are summarizable temporary to pixel blocks| US20150001664A1|2012-01-10|2015-01-01|Softkinetic Sensors Nv|Multispectral sensor| EP2960952A1|2014-06-27|2015-12-30|Softkinetic Sensors N.V.|Majority current assisted radiation detector device| US5831719A|1996-04-12|1998-11-03|Holometrics, Inc.|Laser scanning system| US7082171B1|1999-11-24|2006-07-25|Parkervision, Inc.|Phase shifting applications of universal frequency translation| US6466961B1|2000-08-16|2002-10-15|The Board Of Trustees Of The Leland Stanford Junior University|Methods for adapative spectral, spatial and temporal sensing for imaging applications| US7352454B2|2000-11-09|2008-04-01|Canesta, Inc.|Methods and devices for improved charge management for three-dimensional and color sensing| ES2339643T3|2003-09-02|2010-05-24|Vrije Universiteit Brussel|ELECTROMAGNETIC RADIATION DETECTOR ASSISTED BY CURRENT OF MAJOR CARRIERS.| DE602004021251D1|2004-08-04|2009-07-09|Suisse Electronique Microtech|Solid state image sensor with electronic aperture control| EP2116864A1|2008-05-09|2009-11-11|Vrije Universiteit Brussel|TOF range finding with background radiation suppression| GB2474631A|2009-10-14|2011-04-27|Optrima Nv|Photonic Mixer| US20120127301A1|2010-11-18|2012-05-24|Canon Kabushiki Kaisha|Adaptive spectral imaging by using an imaging assembly with tunable spectral sensitivities| US8619179B2|2011-03-28|2013-12-31|Canon Kabushiki Kaisha|Multi-modal image capture apparatus with a tunable spectral response| US8836808B2|2011-04-19|2014-09-16|Canon Kabushiki Kaisha|Adaptive color imaging by using an imaging assembly with tunable spectral sensitivities| GB2492848A|2011-07-15|2013-01-16|Softkinetic Sensors Nv|Optical distance measurement| US9060110B2|2011-10-07|2015-06-16|Canon Kabushiki Kaisha|Image capture with tunable polarization and tunable spectral sensitivity| EP2729826B1|2012-01-10|2017-04-26|Softkinetic Sensors N.V.|Improvements in or relating to the processing of time-of-flight signals| US8717457B2|2012-08-14|2014-05-06|Canon Kabushiki Kaisha|Adaptive spectral imaging for video capture| EP2703836B1|2012-08-30|2015-06-24|Softkinetic Sensors N.V.|TOF illuminating system and TOF camera and method for operating, with control means for driving electronic devices located in the scene| KR102003496B1|2013-03-06|2019-10-01|삼성전자주식회사|Image Sensor and Image Pick Up Apparatus| EP2874388B1|2013-11-15|2019-05-15|Sony Depthsensing Solutions|Method for avoiding pixel saturation| EP3792662A1|2014-01-13|2021-03-17|Sony Depthsensing Solutions SA/NV|Time-of-flight system for use with an illumination system| DE102014115310A1|2014-10-21|2016-04-21|Infineon Technologies Ag|Image forming apparatus and a runtime image forming method| US20200249328A1|2019-02-04|2020-08-06|Omnivision Technologies, Inc.|Pixel for time-of-flight applications|EP3567848B1|2017-08-09|2021-10-27|Sony Semiconductor Solutions Corporation|Solid-state imaging device, electronic device, and control method for solid-state imaging device| US10840284B2|2017-09-28|2020-11-17|Sony Semiconductor Solutions Corporation|Imaging element with a first and second converging portion for converging light between a first and second signal extraction portion of adjacent pixels| DE102018100571A1|2018-01-11|2019-07-11|pmdtechnologies ag|Transit Time pixels| DE102018108379A1|2018-04-09|2019-10-10|pmdtechnologies ag|Transit Time pixels| JP2020013907A|2018-07-18|2020-01-23|ソニーセミコンダクタソリューションズ株式会社|Light receiving element and distance measuring module| CN110739322A|2018-07-18|2020-01-31|索尼半导体解决方案公司|Light receiving element and distance measuring module| CN110739325A|2018-07-18|2020-01-31|索尼半导体解决方案公司|Light receiving element and distance measuring module| KR20200037698A|2018-10-01|2020-04-09|삼성전자주식회사|3D image sensor comprising polarizer, and depth calibrating method and 3D image generating method based on the 3D image sensor| JPWO2020121705A1|2018-12-14|2021-11-04|ミラクシアエッジテクノロジー株式会社|Imaging device| DE102019113597B3|2019-05-22|2020-08-06|pmdtechnologies ag|Pixel array for a camera, camera and time-of-flight camera system with such a camera| TW202111350A|2019-08-29|2021-03-16|日商索尼半導體解決方案公司|Distance measuring sensor, driving method therefor, and distance measuring module| JP2021150402A|2020-03-17|2021-09-27|ソニーセミコンダクタソリューションズ株式会社|Light-receiving element and control method| DE102020119941A1|2020-07-29|2022-02-03|Valeo Schalter Und Sensoren Gmbh|Optical detection device, vehicle with at least one optical detection device and method for operating an optical detection device|
法律状态:
2018-03-07| FG| Patent granted|Effective date: 20180212 |
优先权:
[返回顶部]
申请号 | 申请日 | 专利标题 EP16151588.7A|EP3193190A1|2016-01-15|2016-01-15|A detector device with majority current and a circuitry for controlling the current| EP16151588.7|2016-01-15| 相关专利
Sulfonates, polymers, resist compositions and patterning process
Washing machine
Washing machine
Device for fixture finishing and tension adjusting of membrane
Structure for Equipping Band in a Plane Cathode Ray Tube
Process for preparation of 7 alpha-carboxyl 9, 11-epoxy steroids and intermediates useful therein an
国家/地区
|