Sputtering device with moving target

专利摘要:
tweede aandrijfmiddel (145) voor het aanbrengen van fig. i een translatie beweging op het ten minste ene eindblok (120) in een tweede richting, waarbij de doelwitas tijdens ten minste een aanzienlijk gedeelte van de bewegingsbaan langs de tweede richting parallel wordt gehouden. Het eerste en het tweede aandrijfmiddel zijn aangepast om, tijdens het sputteren, gelijktijdig in de vacuümkamer operationeel te zijn. De beweging van het eerste aandrijfmiddel heeft geen invloed op de uniformiteit van de laag gesputterd op het substraat in de richting op het oppervlak van het substraat corresponderend met een loodrechte projectie van de tweede richting op het substraat (170). A sputtering device (100) for depositing a layer on a substrate in a vacuum chamber, the layer having a layer property at each point of the substrate surface. The sputtering device comprises at least one end block (120) adapted to each contain a cylindrical target (160) with a longitudinal axis in a first direction. The sputtering device further comprises a first drive means (190) for providing rotational movement of the at least one cylindrical target (160) about its longitudinal axis. The sputtering device also comprises one second drive means (145) for applying Fig. i a translational movement on the at least one end block (120) in a second direction, the target axis being held parallel during at least a substantial part of the trajectory along the second direction. The first and second drive means are adapted to be operational simultaneously in the vacuum chamber during sputtering. The movement of the first drive means does not affect the uniformity of the layer sputtered on the substrate in the direction on the surface of the substrate corresponding to a perpendicular projection of the second direction on the substrate (170).
公开号:BE1022358B1
申请号:E2015/5433
申请日:2015-07-08
公开日:2016-03-24
发明作者:Bosscher Wilmert De；De Putte Ivan Van
申请人:Soleras Advanced Coatings Bvba；
IPC主号:

专利说明:

Sputtering device with moving target. Field of the invention
The present invention relates to the field of sputtering devices. More particularly, it relates to sputtering devices for use in sputtering systems for coating large area surfaces that contain large area substrates or a series of smaller substrates that together form a large area.
BACKGROUND OF THE INVENTION
When sputtering 2-dimensional surfaces, for example, for fabricating displays (e.g., TFT displays) or electronic devices, typically multiple layers are deposited, at least some of which include different materials.
In order to achieve this, in prior art solutions, the substrate is physically moved from one sputtering chamber where one or more layers of a first material are deposited on the substrate to another sputtering chamber on which one or more layers of another material are deposited. the same substrate.
Within one sputtering chamber, the substrate is typically kept substantially static during sputtering, although this is not required. The substantially static configuration has the advantage that fewer contaminating or defect-producing particles are introduced into the coating, but it requires a number of targets or a large single target for which the two-dimensional format of the sputtering device containing this number of targets or this large single target is comparable is with or larger than the two-dimensional format of the substrate. Contaminating or defect-producing particles in the sputtered coating produce defects in the structure of the sputtered coating and must therefore be avoided. It is known that moving the substrate while sputtering increases the concentration of contaminating particles in the substrate. Typically, the size of the contaminating particles is between 10 and 30 µm.
A problem that occurs with cluster coaters for sputtering large area surfaces is the uniformity of the resulting coating. Typically, the spread in thickness of the coating over the surface of the substrate is about 10% or even more of the thickness of the coating.
Given the above requirements, there is still room for improvement in sputtering systems for sputtering surfaces of large areas.
Summary of the invention
It is an object of embodiments of the present invention to provide a good sputtering system, in particular a good sputtering system for sputtering large surface areas. A large-area surface can be a single, large-area substrate, or it can include a series of smaller substrates that together form a large-area surface, and which are provided to be coated together. The latter can be useful, for example, if the substrate, once coated, would no longer be suitable for cutting into smaller substrates, whereas such smaller substrates are needed in an end product. A large surface area, and therefore also a large surface substrate, can be defined as being at least 300 mm x 400 mm, for example 1100 mm x 1300 mm, 1500 mm x 1800 mm and now up to a maximum of 2900 mm x 3200 mm.
The above object is achieved by a method and device according to embodiments of the present invention.
In a first aspect, the present invention provides a sputtering device for depositing a layer on a substrate in a vacuum chamber, the layer having a length in a length direction and a width in a width direction, the length direction and the width direction being non-parallel. The longitudinal direction and the width direction can be orthogonal to each other. For a substrate that moves within the sputtering chamber during the sputtering process, the longitudinal direction can typically be the transport direction. For a static substrate that substantially does not move within the sputtering chamber during the sputtering process, the longitudinal direction is the direction along which a target moves to substantially coat the entire substrate surface with target material. The final deposited layer has, at any point of the substrate, a layer property such as, but not limited to, thickness. The sputtering device comprises: - at least one end block adapted to each contain a cylindrical target with a longitudinal axis in a first direction. The cylindrical target is intended for spatial particle emission distribution in an average emission direction. The longitudinal axis can substantially cover the width of the substrate. - a first drive means for providing rotational movement of the at least one cylindrical target about its longitudinal axis, - a second drive means for applying a translational movement to the at least one end block in a second direction, whereby the target axis during at least a substantial part of the path of movement is kept parallel along the second direction. The first and the second drive means are adapted to be operational simultaneously in the vacuum chamber during sputtering.
The movement by the second drive means can be driven such that the layer property of the deposited layer on the substrate along a curve on the substrate, defined by a projection of a sputter location of the target on the substrate under a relative movement between target and substrate, is less then a predetermined layer property deviation margin deviates. In specific embodiments of the present invention, where either the target moves in the second direction along the longitudinal direction of the substrate, or the substrate itself moves along the longitudinal direction, the above-mentioned curve corresponds to a perpendicular projection of the second direction onto the substrate. In that case, the layer property along a considerable part in the longitudinal direction of that projection deviates less than a predetermined layer property deviation margin. By "a substantial portion in the longitudinal direction" is meant at least 80% of the longitudinal direction, for example at least 90% of the longitudinal direction, such as at least 95% of the longitudinal direction, or even the entire longitudinal direction. The layer property deviation margin determines the degree of uniformity of the sputtered layer.
The second driving means moves the at least one end block along a path of movement that can take any shape in 3D. This 3D moving power of the at least one end block, driven by the second drive means, provides a practical solution for coating a larger-width substrate with a smaller-sized target, for example by having a number of passages along the substrate length while the target is positioned at various positions of the substrate width. In such embodiments, the movement of the at least one end block driven by the second drive means may be, for example, repeating a sequence of a movement in the width direction of the substrate, to position the target at a specific width position of the substrate, followed by a movement along the second direction (e.g., along the longitudinal direction of the substrate, or transversely to the substrate or to the substrate movement direction).
In specific embodiments, the path of movement is preferably in a plane, although the invention is not limited thereto. In practical embodiments, it is very likely that the trajectory of motion will be in a horizontal plane, although the present invention is not limited thereto. The longitudinal direction can be defined as a direction along a dimension of the substrate, defined by an intersection of an intersection plane parallel to the movement plane containing a portion of (according to) the movement applied by the second drive means. In specific embodiments, the path of movement imposed by the second drive means may have a component along the first direction, for example, may be in the first direction.
In typical embodiments, the target may be vertically upright and the substrate may also be vertically upright. In embodiments of the present invention, the width direction of the substrate may then correspond to the vertical direction. In such embodiments, if the second drive means makes a movement on the at least one end block in a horizontal plane, the longitudinal direction of the substrate is a horizontal line on the substrate defined by the intersection between the substrate and a horizontal intersection plane, parallel to the plane of movement defined by the movement of the at least one end block arranged by the second drive means. In alternative embodiments, still with the substrate vertically upright, the target may be placed in a horizontal position, and the second drive means may apply a movement to the at least one end block in a vertical plane. In that case, the width direction of the substrate corresponds to the horizontal direction and the length direction of the substrate corresponds to the vertical direction.
In alternative embodiments, the target may be placed at an angle different from the position vertically upright or horizontal. Even in such positions, the path of movement can for instance lie in a horizontal or a vertical plane, respectively, and the longitudinal direction can be defined on the substrate along a horizontal or a vertical line, respectively.
The second direction may, but need not be, perpendicular to the first direction. The first direction can, but does not have to, be vertical.
It is an advantage of embodiments of the present invention to provide efficient methods and systems for sputtering a uniform coating on large surface surfaces, for example large surface substrates or series of smaller substrates. With a uniform coating is meant a coating that has a uniform distribution of the layer property, for example thickness, or an optical or electrical characteristic. Therefore, the applied coating has a layer property which, on the substrate, deviates along a substantial portion in the longitudinal direction less than a predetermined layer property deviation margin. The layer property deviation margin determines the degree of uniformity of the sputtered layer and may be, for example, less than 10%, less than 5%, less than 2%, even less than 1%. A suitable layer property deviation margin depends on the type of layer property under consideration; specific layer properties allow greater deviations than others, without harming the quality of the applied coating.
It is an advantage of embodiments of the present invention to provide systems and methods that allow sputtering of large surface areas with a uniform distribution of a layer property such as, for example, thickness, an optical or electrical characteristic, resistance or transmittance; and a minimized amount of contaminating or defect-producing particles. It is an advantage of embodiments of the present invention that the uniform distribution of such layer property over one dimension of the entire substrate can be controlled by controlling the second drive means and without the first drive means having significant influence on it.
In specific embodiments of the present invention, for example where the substrate is fixed, the movement in the second direction allows for moving a target along the substrate, for example, but not limited to, parallel to the substrate. It is an advantage of embodiments of the present invention that the direction of the spatial particle ejection distribution is maintained while its position can be changed to at least one dimension. This makes it possible to uniformly sputter target material along a curve on the substrate defined by a projection of a sputter location of the target on the substrate, under the relative movement between target and substrate. In specific embodiments, this makes it possible to sputter target material uniformly onto the substrate in a direction corresponding to a perpendicular projection of the second direction onto the substrate, also referred to as the fourth direction. By moving the target along the substrate in the second direction, the target material is integrated across the substrate surface in the fourth direction. In alternative embodiments of the present invention, for example where the substrate moves within a sputtering chamber, the movement of the target in the second direction allows the movement of a target transverse to the substrate movement. In specific embodiments, this makes it possible to keep the distance between substrate and target fixed, so that sputtering material can be uniformly deposited on the substrate in a longitudinal direction of the substrate.
It is an advantage of embodiments of the present invention that the first drive means does not substantially change the spatial particle ejection distribution from the target; neither in position nor in direction, and therefore has no influence on the uniformity of the distribution of the layer property in, for example, the longitudinal direction, e.g. the fourth direction, of the sputtered layer on the substrate. The first driver provides rotational movement of the target about its axis, but without movement of the magnetic system, nor of the plasma. Consequently, there is no influence of the rotational movement of the first driver on the electromagnetic field that the plasma generates, and consequently there is no influence of the rotational movement of the first driver on the sputter distribution. In embodiments of the present invention, target use can be increased by rotating the target with the first drive means. It is therefore an advantage that the first drive means has no influence on the uniformity of the distribution of the layer property along the longitudinal direction of the substrate, e.g. the fourth direction. As an example, when sputtering is performed in accordance with embodiments of the present invention, the spread in thickness of the coating over the surface of the substrate may be less than 10%, preferably less than 5%, more preferably less than 3 % of the coating thickness. Variations in coating thickness cause artifacts, for example variations in resistivity. That is why it is an advantage if coatings with a uniform thickness can be realized. In embodiments of the present invention, the concentration of contaminating or defect-producing particles (e.g., particles in the micrometer range) is smaller than in systems where the substrate is moved. Whether a particle of a certain size influences the quality of the coating depends on the application (eg for TFT motherboards).
It is an advantage of embodiments of the present invention that it is not required to move the substrate. Moving the substrate can be a major cause of appearance of contaminating or defect-producing particles in the deposited coating on the substrate. It is not required to shift nor rotate the substrate to obtain a uniform coating over the entire substrate. However, according to embodiments of the present invention, it is not excluded that the substrate is moved.
It is an advantage of embodiments of the present invention that cylindrical targets, also called tubular or rotatable targets, can be used. Such targets are advantageous because of their efficiency compared to flat-lying targets. A typical flat-lying target without magnet movement has a material use between 20 and 35%. A flat-lying microwave with moving magnets can reach anywhere between 40 and 55% use of materials. In this specific case, however, the effect of magnet movement in such flattened microwave systems may correspond to the effect of the first drive means with respect to the present invention. In the case of magnet movement in planar microwave systems, the effect of the movement in the second direction will be disturbed by the movement of the magnets and the second drive means alone cannot control the uniformity of the layer in the second direction. This is different from the present invention, where the movement of the target by the first drive means has no influence on the uniformity of the layer in the longitudinal direction of the substrate.
A cylindrical microwave oven, due to the drive by the first drive means, which imposes rotational movement about its longitudinal axis, typically has more than 70% target material use and goes up to 90%. Other benefits of rotatable targets are: - no change in angle material flux during target lifetime (because no groove formation), so the target can be used much longer before maintenance is required by replacement; - more efficient cooling and with each target surface in the hot plasma zone for only a limited time can leave room for higher power levels and therefore faster deposition; which yields more processing capacity for a given coater investment; - having a larger inventory of materials on comparable dimensions of target width due to the availability of material; - more stable in reactive processes because there is no redeposition on the target; - more efficient as an anode with alternating current sputtering.
It is an advantage of embodiments of the present invention, in particular, for example, embodiments with fixed substrates, that the distance over which the end block can be moved in the second direction, if this second direction is substantially in the longitudinal direction of the substrate, is between 200 mm and 6000 mm, preferably between 500 mm and 3000 mm. The typical width of a single microwave is around 200 mm. The largest glass length standard is 6000 mm. Therefore, a movement in the second direction substantially along the longitudinal direction of the substrate, wherein the movement is up to more than 6000 mm, allows movement of the target over and beyond the largest standard glass length. If the cylindrical target in the second direction can be moved substantially along the longitudinal direction of the substrate over a distance of 500 mm, a Gen 3 glass substrate can be traversed. If the cylindrical target in the second direction can be moved substantially along the longitudinal direction of the substrate over a distance of 3000 mm, a Gen 8 glass substrate can be traversed. It is an advantage of embodiments of the present invention that the movement of the end block in the second direction substantially along the longitudinal direction of the substrate is not necessarily a linear movement. In embodiments of the present invention, with a fixed substrate, it may be advantageous if the second direction is curved. In some embodiments, such curvature can be parallel to the curvature of a curved substrate. In these embodiments, the distance between the target and the substrate is always the same when the target is moved along the second direction. Even with flat substrates, however, it can sometimes be advantageous if the movement of the at least one end block is curved or comprises a curved portion. Alternatively, the second direction need not be along the longitudinal direction of the substrate, but may also be along the width direction of the substrate, for example. In specific embodiments, the movement in the second direction can be a combination of movements along the length and width direction of the substrate.
It is an advantage of embodiments of the present invention, in particular for example embodiments with moving substrates, that the distance over which the end block can be moved in the second direction is sufficient to obviate all substrate shape variations in depth, so that the distance between the substrate and the target can be kept constant, to facilitate deposition of a layer on the substrate, with uniform layer property along the longitudinal direction. It is an advantage of embodiments of the present invention, particularly if a target is too small to cover the entire substrate width, that the distance over which the end block can be moved in the second direction is sufficient to, in different passages, cover the entire width of the substrate.
In embodiments of the present invention, the second drive means in its movement along the second direction can apply a constant speed to the cylindrical target. In alternative embodiments, the speed of the cylindrical target in the second direction need not be constant. The variable speed applied by the second drive means can be an interesting way of influencing uniformity in the longitudinal direction. The speed of movement applied by the second drive means can be variable depending on the shape and curvature of the substrate to be sputtered and / or on the distance between the substrate and the target.
In a sputtering device according to embodiments of the present invention, in specific embodiments with a fixed substrate, the second drive means may be adapted to apply movement to the at least one end block in the second direction over more than twice the width of an end block. The second drive means may be adapted to apply movement to the at least one end block in the second direction over substantially the entire length of the substrate.
In embodiments of the present invention, "a substantial portion of the trajectory along the second direction" can be defined as at least 50%, for example at least 70%, at least 80%, at least 90% of the trajectory. In embodiments with a fixed substrate, this may correspond to at least 50%, for example at least 70%, at least 80%, at least 90% of the dimension in the longitudinal direction, e.g. fourth direction, of the surface to be coated.
In a sputtering device according to specific embodiments of the present invention, the second drive means may be adapted to apply movement to the at least one end block in the second direction such that the target axis is held parallel to the entire 100% movement in the second direction. its original position. In alternative embodiments, the second drive means may be adapted to apply a movement to the at least one end block in the second direction that the target axis is held parallel to the movement in the second direction when the end block is in front of the substrate, but not necessarily when it is in a position aside from the substrate. Therefore, the direction of the target axis that is held in parallel along at least a substantial portion of the path of movement along the second direction need not necessarily be parallel to the original position of the target axis, nor to its end position, but it can be.
In a sputtering device according to embodiments of the present invention, the first drive means may operate under vacuum conditions or the first drive means may be provided within a sealed casing that can be moved by the second drive means together with the at least one end block.
It is an advantage of embodiments of the present invention that the first actuator can operate in vacuum conditions and therefore can be moved within the vacuum chamber together with the at least one end block while a rotational movement is provided to the cylindrical targets that are on the one or more end blocks are confirmed.
It is an advantage of other embodiments of the present invention that no expensive drive means are required that can operate in vacuum. This advantage is realized by providing the first drive means in a sealed casing.
It is an advantage of embodiments of the present invention that, with respect to the uniformity of the sputtered coating, the rotational movement of the target through the first drive means does not interfere with the movement of the target in the second direction. In embodiments of the present invention, the first drive means is configured to substantially not change the spatial particle ejection distribution from the target, while the second drive means is configured to maintain the direction of the spatial particle ejection distribution.
A sputtering device according to embodiments of the present invention may comprise at least one cylindrical target, the at least one cylindrical target being mounted on the at least one end block comprising closures for closing between the end block and the cylindrical target. It is an advantage of embodiments of the present invention that the cylindrical target can be rotated by the first drive means while maintaining a vacuum in the sputtering chamber.
A sputtering device according to embodiments of the present invention may furthermore comprise a sputtering chamber with a wall, and a substantially statically positioned substrate may be provided in the sputtering chamber, the first direction being substantially parallel, for example parallel, to the substrate. The sputtering device may comprise a second closure for closing between the sputtering chamber wall and a means for moving the end block in the second direction, wherein the means for moving the end block may be adapted to be driven by the second drive means. It is an advantage of embodiments of the present invention that the second closure permits movement of the end block in the second direction while maintaining a vacuum in the sputtering chamber. A sputtering device according to alternative embodiments of the present invention may comprise a sputtering chamber with a wall and within the sputtering chamber a substrate may be moved, the first direction being substantially parallel, for example parallel, to the width direction of the substrate.
A sputtering device according to embodiments of the present invention may comprise a number of end blocks, wherein at least one first end block is adapted to contain at least one first cylindrical target and a second end block is adapted to contain at least one second cylindrical target.
It is an advantage of embodiments of the present invention that a coating comprising two or more different materials can be sputtered onto the substrate or substrates. It is an advantage of embodiments of the present invention that multiple materials can be coated in one process step, i.e. without having to break the vacuum in the vacuum chamber. For example, in specific embodiments of the present invention, it is not required to move the substrate or substrates from one sputtering device to another sputtering device, as is the case with cluster coaters. However, embodiments of the present invention do not preclude the use of cluster coaters for applying different layers in a stack. Furthermore, many applications, however, have a coating stack consisting of multiple layers (more than two), which contains a specific material that must be repeated at least once in the stack. Typical non-reflective coating stacks consist of four or more layers with two materials being repeated in the stack with varying thicknesses.
A sputtering device according to embodiments of the present invention may comprise a third driving means for driving a longitudinal magnet configuration that can be placed in a cylindrical target. In embodiments of the present invention, the third drive means makes it possible to define the uniformity of the layer sputtered on the substrate in a direction on the surface of the substrate corresponding to a perpendicular projection on the substrate of the first direction.
The longitudinal magnet configuration, when placed in the cylindrical target, is oriented in the first direction. The longitudinal magnet configuration may comprise a plurality of magnet structures along the length of the magnet configuration, wherein the magnet structures can be moved in translation by the third drive means, bringing them closer to or further away from the target surface. This translation movement can be applied to one or more magnet structures of the number of magnet structures along the length of the magnet configuration. The translational movement of the magnet structures can only be applied to one or more restricted portions along the first direction, or to a larger portion, or even along the entire magnet configuration. Along the first direction, different magnet structures can be moved individually or several magnet structures can be moved together. Different translation movements can be made on different magnet structures in parallel on individual portions of the magnet configurations along the first direction. In this way the magnetic configuration can be changed locally so that the spatial particle ejection distribution at a certain zone on the target along the first direction can be changed, e.g. changed in amplitude. The third drive means can change the local flux intensity, but it can also be changed locally change the angle distribution in any other way. It is an advantage of embodiments of the present invention that the uniformity of the substrate in the direction of the perpendicular projection from the first direction to the substrate can be modified by moving individual magnet structures using the third drive means.
It is an advantage of embodiments of the present invention that in addition to a translational movement of the magnet structures also a rotational movement of the magnet structures is possible, imposed by a fourth drive means. This makes it possible to rotate the magnet structure around a longitudinal axis of a target. The fourth drive means generally change the magnetism so that the direction of the spatial particle ejection distribution can be changed, e.g., rotationally along an axis parallel to the first direction. Rotation of the magnet structure changes the plasma orientation, so the sputtering behavior of the target. The rotational movement can be applied to one or more magnet structures of the number of magnet structures along the length of the magnet configuration. The rotational movement of the magnet structures can only be applied to one or more restricted portions along the first direction, or to a larger portion, or even along the entire magnet configuration. Along the first direction, different magnet structures can be rotated individually or several magnet structures can be rotated together. Different rotational movements can be arranged on different magnet structures in parallel on individual portions of the magnet configuration along the first direction. Combinations of translation and rotational movements can also be applied to the magnet structures, individually or in combination.
The translation movement of the magnet structures and the rotational movement of the magnet structures can both be applied to the same magnetic rod, or only one of the movements can be applied.
It is an advantage of embodiments of the present invention that the plasma orientation and / or strength can be modified while sputtering on the substrate. This can be done by modifying the position of the magnet structures along the magnet configuration during sputtering.
It is an advantage of embodiments of the present invention that the uniformity of a layer property, e.g., thickness, of the sputtered coating on the substrate in the fourth direction can be modified using the third and / or fourth drive means, provided that this is done in combination with and synchronized with a movement generated by the second drive means. In any case, in accordance with embodiments of the present invention, the movement applied to the at least one target by the first drive means does not affect the uniformity of the layer property, e.g., thickness, in the longitudinal direction.
A sputtering device according to embodiments of the present invention may comprise a cathode assembly adapted to contain one or more end block (s), each adapted to attach a cylindrical target, in an array configuration, e.g. a merry-go-round configuration. The one or more specific cylindrical targets can be oriented towards a substrate and can be selected to be driven during sputtering.
It is an advantage of embodiments of the present invention that multiple different materials can be sputtered onto the substrate in one process step (ie without the necessity of opening the sputtering chamber and releasing the vacuum to be able to change the target material) . Furthermore, very relatively complex coating stacks can be deposited on a relatively large 2D surface without the necessity of moving the surface.
A sputtering device according to embodiments of the present invention may comprise a controller adapted to control - the speed of the at least one end block in the second direction and / or - the power applied to the at least one cylindrical target and / or - the rotational speed of the at least one cylindrical target and / or - the position of a magnetic rod within the at least one cylindrical target, and / or - the gas flow and / or partial pressure distribution of the different types of gas close to the at least one cylindrical target and / or the substrate.
It is an advantage that the control parameters for controlling the uniformity of a specific property of the coating layer or stack of layers, e.g., thickness, can be controlled from a centralized controller.
It is an advantage of embodiments of the present invention that the movement of a first cylindrical target can be synchronized with the movement of a second cylindrical target by means of a single controller.
In a sputtering device according to specific embodiments of the present invention, the movement of the at least one end block in the second direction provided by the second drive means may be a linear movement.
In a sputtering device according to specific embodiments of the present invention, the speed of the at least one end block along the second direction can be constant.
In a second aspect, the present invention provides a method for sputtering a substrate in a vacuum chamber. The substrate has a length in a longitudinal direction and a width in a width direction. The substrate can be substantially statically positioned, or the substrate can move during sputtering. The method includes the step of rotating a cylindrical target around its longitudinal axis oriented in a first direction while moving the cylindrical target in a second direction. The movement in the second direction is such that a layer property of the deposited layer on the substrate along a curve on the substrate defined by a projection of a sputter location of the target on the substrate under the relative movement between target and substrate, less than one predetermined layer property deviation margin differs. The second direction can, but does not have to be, perpendicular to the first direction. The second direction may, but need not be, along the longitudinal direction of the substrate. The movement in the second direction can be such that the distance between the target and the substrate is constant during sputtering. The movement in the second direction defines the uniformity of a layer sputtered on the substrate in the fourth direction on the surface of the substrate, the movement through the first drive means having no influence on the uniformity of the layer sputtered on the substrate in one direction wherein the second drive means influences the uniformity (the fourth direction) of the fixed substrate.
It is an advantage of specific embodiments of the present invention where the method is applied to a fixed substrate, i.e., a substrate that does not move during sputtering, that a large surface can be coated without moving the substrate by means of a cylindrical target. . Moving the substrate can be a major cause of the presence of contaminating or defect-producing particles in the sputtered coating. It is an advantage of specific embodiments of the present invention that the target can be sputtered with high efficiency with respect to the use of sputtered target material by the rotation of the cylindrical target. Even if the target is smaller than the substrate width, since the end block is movable in a 3D path along the substrate width, the entire substrate can be coated, in different passages, by successively locating the target at other positions along the substrate width. .
It is an advantage of alternative embodiments of the present invention where the method is applied to a moving substrate, i.e., a substrate that moves during sputtering, that a layer with uniform layer properties can be sputtered, even on substrates with a difficult shape or that are transported along a non-linear movement or which have a variable space between the substrate surface and the (optionally fixed) target surface.
A method according to embodiments of the present invention may furthermore comprise moving magnet structures within the cylindrical target. The movement of the magnet structures within the cylindrical target can be a translational movement, whereby different magnet structures are shifted "up or down" along a magnet rod to bring them closer to or further away from the target surface. It is an advantage of embodiments of the present invention that in this way the uniformity of a property of the coating can be controlled along a first dimension. The translation movement can be applied to one or more magnet structures of the number of magnet structures along the length of the magnet configuration. The translational movement of the magnet structures can only be applied to one or more restricted portions along the first direction, or to a larger portion, or even along the entire magnet configuration. Different magnet structures can be moved individually along the first direction or several magnet structures can be moved together. Different translation movements can be applied to different magnet structures in parallel on individual parts of the magnet configurations along the first direction.
The movement of the magnet structures within the cylindrical target can be a rotational movement about a longitudinal axis of a cylindrical target. This allows reorientation of the magnetic field, thus changing sputter parameters. The rotational movement can be applied to one or more magnet structures of the number of magnet structures along the length of the magnet configuration. The rotational movement of the magnet structures can only be applied to one or more restricted portions along the first direction, or to a larger portion, or even along the entire magnet configuration. Along the first direction, different magnet structures can be rotated individually or several magnet structures can be rotated together. Different rotational movements can be applied to different magnet structures in parallel on individual parts of the magnet configuration along the first direction.
The translation and rotational movement of the magnet structures within the cylindrical target can be applied separately or simultaneously.
In a method according to embodiments of the present invention, in a first step, a set of at least one first cylindrical target is moved in a second direction of the sputtering chamber and, in a second step, a set of at least one second cylindrical target moved in the second direction of the sputtering chamber. It is an advantage of specific embodiments of the present invention that a stack of many layers can be deposited on the substrate without the necessity of moving the substrate and without the necessity of breaking the vacuum in the vacuum chamber. It is an advantage of embodiments of the present invention that the set comprising the at least one first cylindrical target can be moved in the second direction under the same or different path and / or velocity conditions as the set comprising the at least one second cylindrical target.
In a third aspect, the present invention provides a controller for controlling movement of at least one cylindrical target in a vacuum chamber of a sputtering device, the movement being a first component being a rotational movement about its longitudinal axis oriented in a first direction, and a simultaneous second component being a translation movement in a second direction, whereby the target axis is held parallel during at least a substantial part of the path of movement along the second direction. The cylindrical target is configured for spatial particle emission distribution in an average emission direction. The rotational movement essentially does not change the spatial particle ejection distribution from the target. At the same time, the second movement maintains the direction of the spatial particle emission distribution, the position of which is changed in at least one dimension. In accordance with embodiments of the present invention, such simultaneous rotational and translational movement of the target allows a layer to be deposited on the substrate with a layer property along a curve on the substrate defined by a projection of a sputter location of the target on the substrate below the relative movement between target and substrate, which deviates less than a predetermined layer property deviation margin. The second direction can, but does not have to be, perpendicular to the first direction. The second direction may, but need not be, along the longitudinal direction of the substrate. The second direction can be substantially perpendicular to the width direction of the substrate.
Specific and preferred aspects of the invention are included in the appended independent and dependent claims. Features of the dependent claims can be combined with features of the independent claims and with features of other dependent claims as appropriate and not merely as explicitly stated in the claims.
These and other aspects of the invention will be apparent from and elucidated with reference to the embodiment (s) described below.
BRIEF DESCRIPTION OF THE FIGURES FIG. 1 schematically shows a side view of a sputtering device in accordance with embodiments of the present invention, comprising two end blocks to which a cylindrical target is each attached. FIG. 2 schematically shows a top view of a sputtering device in accordance with embodiments of the present invention. FIG. 3 shows a schematic diagram of a sputter in accordance with alternative embodiments of the present invention. FIG. 4 shows a schematic diagram of a sputtering device comprising two end blocks in accordance with yet other embodiments of the present invention. FIG. 5 shows a schematic diagram of a sputtering device comprising bellows in accordance with embodiments of the present invention. FIG. 6 shows a schematic diagram of a sputtering device according to embodiments of the present invention in which a number of targets can be moved simultaneously in the second direction. FIG. 7 shows the same diagram as in FIG. 6, but where the targets are positioned differently in accordance with embodiments of the present invention. FIG. 8 shows a schematic diagram comprising a cathode assembly to which a number of end blocks can be mounted in accordance with embodiments of the present invention. FIG. 9 shows a schematic diagram of a sputtering device including a controller and computer for controlling the sputtering device in accordance with embodiments of the present invention. FIG. 10 shows a schematic diagram of a sputtering device in accordance with yet other embodiments of the present invention. FIG. 11 schematically shows a path of movement of an end block in front of a substrate in accordance with embodiments of the present invention. FIG. 12 schematically shows a path of movement of an end block in front of a substrate in accordance with alternative embodiments of the present invention. FIG. 13 shows a schematic diagram of a sputtering device in accordance with embodiments of the present invention. FIG. 14 is a schematic 3D illustration of an embodiment of the present invention for use with moving substrates. FIG. 15 illustrates an embodiment of the present invention with moving substrates, wherein the target is illustrated in successive different positions. FIG. 16 and FIG. 17 illustrate absolute and relative values for a layer thickness measurement for specific configurations of distance from target to substrate in an arrangement as in FIG. 14. FIG. 18 illustrates various embodiments of a batch coater that may be used in accordance with embodiments of the present invention. FIG. 19 illustrates various arrangements and corresponding longitudinal directions, width directions, first, second and fourth directions.
The drawings are only schematic and not restrictive. In the drawings, the dimensions of some elements may be increased for illustrative purposes and not drawn to scale.
Reference numbers in the claims may not be interpreted to limit the scope of protection.
In the various figures, the same reference numbers refer to the same or similar elements.
Detailed description of illustrative embodiments
The present invention will be described with reference to particular embodiments and with reference to certain drawings, however, the invention is not limited thereto but is only limited by the claims. The described drawings are only schematic and not restrictive. In the drawings, the dimensions of some elements may be increased for illustrative purposes and not drawn to scale. The dimensions and the relative dimensions sometimes do not correspond to the current practical embodiment of the invention.
Furthermore, the terms first, second, third and the like in the description and in the claims are used to distinguish similar elements and not necessarily for describing a sequence, neither in time, nor spatially, nor in ranking, or in any other manner. It is to be understood that the terms used in this way are suitable under interchangeable conditions and that the embodiments of the invention described herein are capable of operating in a different order than described or depicted herein.
Moreover, the terms upper, lower and the like in the description and claims are used for description purposes and not necessarily to describe relative positions. It is to be understood that the terms so used may be interchanged under given circumstances and that the embodiments of the invention described herein are also suitable to operate in other orientations than described or shown herein.
It is to be noted that the term "comprises," as used in the claims, is not to be construed as limited to the means described thereafter; this term does not exclude other elements or steps. It can therefore be interpreted as specifying the presence of the listed features, values, steps or components referred to, but does not exclude the presence or addition of one or more other features, values, steps or components, or groups thereof. Thus, the scope of the expression "a device comprising means A and B" should not be limited to devices that consist only of components A and B. It means that with regard to the present invention, A and B are the only relevant components of the device.
Reference throughout this specification to "one embodiment" or "an embodiment" means that a specific feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, occurrence of the expressions "in one embodiment" or "in an embodiment" at various places throughout this specification need not necessarily all refer to the same embodiment, but can do so. Furthermore, the specific features, structures, or characteristics may be combined in any suitable manner, as would be apparent to those skilled in the art based on this disclosure, in one or more embodiments.
Similarly, it should be appreciated that in the description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together into a single embodiment, figure, or description thereof for the purpose of streamlining disclosure and assisting in understanding one or several of the various inventive aspects. This method of disclosure should not be interpreted in any way as a reflection of an intention that the invention requires more features than explicitly mentioned in any claim. Rather, as the following claims reflect, inventive aspects lie in less than all the features of a single prior disclosed embodiment. Thus, the claims following the detailed description are hereby explicitly included in this detailed description, with each independent claim as a separate embodiment of the present invention.
Furthermore, while some embodiments described herein include some, but not other, features included in other embodiments, combinations of features of different embodiments are intended to be within the scope of the invention, and constitute different embodiments, as would be understood by those skilled in the art . For example, in the following claims, any of the described embodiments can be used in any combination.
Numerous specific details are set forth in the description provided here. It is, however, understood that embodiments of the invention can be practiced without these specific details. In other cases, well-known methods, structures and techniques have not been shown in detail to keep this description clear.
Specific embodiments of the present invention are described below, with the second direction adopting specific orientations. It should be noted, however, that the invention is not limited to the described embodiments and that embodiments that are not described in detail, for example where the second direction is parallel to the first direction, or has a component along the first direction, also form part of the present invention, and also included in the appended claims.
Embodiments of the present invention relate to a sputtering device for use in a sputtering system. The sputtering system can be a sputter coater, for example a cluster coater type. A cluster coater is a coating system in which different process modules can be placed in a central processing or treatment room in any desired way.
A target in the context of the present invention is what corresponds to the customary term "target". By this is meant a plate or cylinder containing the raw material that is consumed during the sputtering process by bombardment of ions in order to form a layer on a substrate.
Where in embodiments of the present invention reference is made to "a static seal", reference is made to a means that makes it possible to close the contact between two surfaces that do not move relative to each other.
Where in embodiments of the present invention reference is made to "a dynamic closure", reference is made to a means that makes it possible to close the contact between two surfaces moving relative to each other.
Both types of closure make it possible to maintain a vacuum on one side of the closure and an atmospheric pressure on the other side of the closure.
Where in embodiments of the present invention reference is made to the "first direction", reference is made to the direction of the longitudinal axis of a cylindrical target mounted on an end block. In embodiments of the present invention, the first direction is parallel to the substrate. The corresponding direction on the surface of the substrate, i.e. the perpendicular projection of the first direction on the surface of the substrate, is called the "third direction." The first direction can be a vertical direction.
Where in embodiments of the present invention reference is made to the "second direction", reference is made to the direction of a translational movement of the target. The movement in the second direction can be a movement along the substrate, for example in the case of a substantially static substrate (substantially not moving during sputtering), but also in the case of a moving substrate. In embodiments of the present invention, the second direction is parallel to the substrate, e.g., along the length or width of the substrate (e.g., also when the substrate is curved in the second direction). However, the present invention is not limited thereto, as will be explained below. Alternatively, the movement in the second direction may be a movement transverse to the substrate or, for example, in the case of a substrate moving within the sputtering chamber during sputtering, e.g. perpendicular to the substrate movement direction. Such movement across the substrate or the substrate movement direction can be implemented to keep the distance between the target and the substrate constant. In embodiments of the present invention, the movement in the second direction can be a combination of a movement along the substrate and a movement transversely of the substrate or the substrate movement direction. In specific embodiments of the present invention, while the present invention is not limited thereto, the second direction is perpendicular to the first direction. If the second direction is along the substrate, then the corresponding direction on the surface of the substrate, i.e. the perpendicular projection of the second direction on the surface of the substrate, is called the "fourth direction." The fourth direction can be a horizontal direction. If the second direction is transverse to the substrate or the substrate movement direction, then the perpendicular projection of a movement in this second direction, on a moving substrate, is also a curve along the fourth direction on the substrate. The curve on the substrate can be defined by projecting a specific sputter location of the target on the substrate under the relative movement between target and substrate.
The second drive means moves the at least one end block along a path of movement that can lie substantially in a plane, but that is not necessary; in the case that it is in one plane, the second direction will be in that plane. In practical embodiments, it is very likely that the trajectory of motion will be in a horizontal plane, although the present invention is not limited thereto. The "longitudinal direction" of a substrate can be defined as a direction along a dimension of the substrate, defined by an intersection of an intersection plane parallel to the motion plane as defined by the motion applied by the second drive means. In specific embodiments, while the present invention is not limited thereto, the longitudinal direction may correspond to a horizontal line on the substrate defined by the intersection between the substrate and a horizontal intersection plane, parallel to the movement plane defined by the movement of the at least one end block provided by the second drive means.
Where in embodiments of the present invention reference is made to "a width direction," reference is made to a direction substantially covered by the longitudinal axis of the target. In FIG. 19 for illustrating width direction [width direction] W and length direction L, as well as first, second and fourth directions, different arrangements of substrates and targets are shown; however, the present invention is not limited thereto. The very first embodiment illustrates a horizontally placed substrate and a horizontally placed target. The following three embodiments illustrate a vertically attached substrate, once with a vertically placed target, once with a target at an angle different from vertical and once with a horizontally placed target. The very last embodiment illustrates a vertically attached substrate that, however, is curved in the horizontal direction, and a vertically placed target.
In embodiments of the present invention there is a relative movement between the target and the substrate. This can be obtained by keeping the substrate static and moving the target along a longitudinal direction of the substrate, or it can be obtained by moving a substrate within a sputtering chamber and keeping the target at a fixed location. Combinations are also possible in which both the target and the substrate move within the sputtering chamber.
Where in embodiments of the present invention reference is made to "an end block", reference is made to a means for rotatably containing a target tube to cause it to reverse and electrically feed the target tube while a coolant is fed thereto and removed therefrom . In addition, the end block must maintain vacuum integrity since the sputtering process normally takes place at low pressures.
Where in embodiments of the present invention reference is made to "the thickness of the coating," reference is made to the thickness at a point on the substrate, measured in the direction orthogonal to the substrate surface. Where in embodiments of the present invention reference is made to "the uniformity of the coating or layer in the third / fourth direction," reference is made to a coating with a controlled uniformity of a property of the coating in the third / fourth direction. This corresponds to the layer property of the deposited layer on the substrate along a substantial longitudinal portion, of a perpendicular projection of the second direction to the substrate, less deviating than a predetermined layer property deviation margin. The "perpendicular projection of the second direction on the substrate" refers to the curve formed on the substrate surface by projecting a point on the target, which undergoes movement in the second direction during a sputtering operation, on the static or moving substrate.
The property can for example be thickness, an optical or electrical characteristic, resistance, transmittance. The variation can be 10% or less, e.g. 5% or less, such as 2% or less. Where in embodiments of the present invention reference is made to "the uniformity of the coating," this is intended to be equivalent to "the uniformity of the distribution of a property of the coating."
Where in embodiments of the present invention reference is made to a "substrate", any type of surface to be coated is intended. The substrate can be flat or curved, in which case the curvature can be in one or more dimensions. The present invention is particularly useful for large surfaces to be coated, although the present invention is not limited thereto. The surface to be coated can consist of the surface of a single, for example large, substrate; or it may comprise the surfaces of a number of smaller substrates arranged in an array. The series can be regular or irregular. In the description, "substrate" and "series of substrates" are used as synonyms for "surface to be coated."
In a first embodiment of a first aspect, the present invention relates to a sputtering device 100 for sputtering large surface areas, such as large surface substrates or series of smaller substrates. The first embodiment of the first aspect of the present invention may relate to systems for use with a substantially static substrate, i.e., a substrate that substantially does not move during sputtering. The sputtering device 100 can be used in, and thus can be part of, a sputtering system 101. In embodiments of the present invention, the length of the surface, and thus of the large-area substrate, or of the series of smaller substrates, e.g. 300 mm and 3210 mm. The width of the substrate or series of substrates can be between 300 mm and 2400 mm. Embodiments of the present invention can be used, while the present invention is not limited thereto, for sputtering glass plates, for example glass plates for displays such as, for example, TFT screens or electronic devices. Alternatively, while the present invention is not limited to, embodiments of the present invention can be used for sputtering pre-cut smaller glass plates in a series, for example if the coating to be applied would be such that the glass plates, once coated, were too difficult to be cut.
According to embodiments of the present invention, the sputtering device 100 comprises at least one end block 120 adapted to each contain a cylindrical target 160. The cylindrical target 160 is configured for spatial particle ejection distribution in an average ejection direction. If the cylindrical target 160 is mounted on the end block 120, its axis 161 is oriented in a first direction that extends from the end block 120. In use, when the sputtering device 100 is provided with a target, and for sputtering in a sputtering system 101 is attached, the first direction is preferably parallel to a direction in the surface of the substrate 170 or array of substrates. This direction is hereinafter referred to as the third direction. If the first direction is not parallel to a direction in the surface of the substrate 170, the corresponding third direction is the direction of a perpendicular projection of the first direction on the substrate surface. For example, the first direction may be, but need not be, a vertical direction, in which case the third direction corresponds to the width direction of the substrate 170 or array of substrates.
The sputtering device 100 further comprises a first drive means 190 for providing rotational movement of the at least one cylindrical target 160 about its longitudinal axis 161. The first drive means, when it drives the target for rotation, substantially does not change the spatial particle ejection distribution from the target. The sputtering device 100 also comprises a second drive means 145 for applying a movement to the at least one end block 120 in a second direction. The second drive means drives the end block in such a translational movement that the direction of the spatial particle ejection distribution is maintained while its position can be changed to at least one dimension. The first and second drive means are adapted to be operational simultaneously in the vacuum chamber during sputtering. As a result, both the rotational movement of the target and the translational movement of the end block carrying the target (and therefore of the target) take place simultaneously.
In embodiments of the present invention, the second direction can be defined in a plane of movement, for example, in a horizontal plane. A longitudinal direction of the substrate can be defined as a direction along a dimension of the substrate, defined by an intersection of an intersection plane parallel to the motion plane as defined by the motion applied by the second drive means. The movement made in the second direction can be more than once the width of the end block 120. In the embodiments such as the ones illustrated in FIG. 1, the movement in the second direction can be applied over substantially the entire length, even over the entire length or even over the entire length of the substrate or series of substrates. A fourth direction is defined on the surface of the substrate, corresponding to the perpendicular projection of the second direction on the surface of the substrate. This fourth direction may typically correspond to the length of the substrate 170 or array of substrates.
In use, when the sputtering device 100 is provided with a target, and is mounted for sputtering in a sputtering system 101, the second direction may be a direction along the length of the substrate 170. The second direction may, but need not be, parallel to the surface of the substrate 170. The second direction can, but does not have to be, perpendicular to the first direction. If the substrate 170 is curved, the second direction may, but need not, follow the curvature of the substrate 170. In alternative embodiments, the second direction may be along the first direction, or a component may have parallel to the first direction.
When the end block 120 is moved in the second direction, the target axis 161 remains parallel for at least a substantial part of the path of movement along the second direction, for example more than at least 50% of the dimension in the fourth direction of the surface to be coated, which corresponds to the longitudinal direction of the substrate. The target axis 161 can, but does not have to, remain parallel to its original position. In accordance with embodiments of the present invention, the movement of the end block 120 by the second drive means defines the uniformity in the fourth direction, corresponding to the longitudinal direction, of a layer sputtered onto a fixed substrate 170. The substrate 170 or array of substrates can be a flat substrate or a curved substrate, and if a curved substrate, the curvature can be in one or two dimensions. According to embodiments of the present invention, the movement of the at least one cylindrical target 160 around its rotational axis 161 induced by the first drive means 190 does not affect the uniformity in the fourth direction corresponding to the longitudinal direction of the on the substrate 170 sputtered layer. This is because the rotational movement of the target does not substantially change the spatial particle ejection distribution from the target.
In embodiments of the present invention, the movement of the end block 120 in the second direction is a movement parallel to the substrate 170 or array of substrates. This may be a linear motion in the case that a flat substrate 170 or array of substrates is sputtered or it may be a curved motion in the case that the substrate 170 or array of substrates is curved or piecemeal in the third or fourth direction, corresponding to the width and length direction of the substrate, respectively. In embodiments of the present invention, the movement of the at least one end block 120 in the second direction is not necessarily parallel to the surface of the substrate 170 or array of substrates. Examples thereof are illustrated in FIG. 11 and FIG. 12, which are simplified schematic plan views of sputtering systems. The motion path 1110, 1111 of the at least one end block 120 is shown in dotted lines and the substrate 170 is shown as a solid line. In the embodiment shown in FIG. 11, the substrate is a flat-lying substrate and the path of movement 1111 deviates from a straight line, particularly at the level of the ends of the substrate 170. In the embodiment shown in FIG. 12, the substrate is a curved substrate and the path of movement 1111 deviates from being parallel to the curved surface of the substrate 170, particularly at the level of the ends of the substrate 170. In specific embodiments, it is dependent on the actual curvature of the substrate, allowing the trajectory 1111 to be a straight line. In embodiments of the present invention, the cylindrical target 160 is oriented in the first direction that is parallel to the substrate surface and that remains parallel to the substrate or array of substrates while the end block 170 is moved in the second direction. An alternative embodiment is illustrated in FIG. 14, where the second direction is transverse to the direction of movement of the substrate.
The uniformity of the sputtered coating in the longitudinal direction of the substrate could be controlled by changing the distance between the cylindrical target and the substrate or series of substrates, e.g. by the movement in the second direction. However, in accordance with embodiments of the present invention, it is not affected by the movement induced by the first drive means, i.e., the rotation about the target axis 161 in the first direction. Alternatively or in combination with it, the uniformity of the sputtered layer in the fourth direction, corresponding to the longitudinal direction, could be controlled by controlling the translation speed along the second direction of the at least one end block 160. Yet another control means for controlling the uniformity of the sputtered layer in the fourth direction could be the control of the power level on the at least one target 16 while traversing the substrate 170 or series of substrates. These techniques can all be used as such to control the uniformity of the sputtered layer in the fourth direction, corresponding to the longitudinal direction, or they can be used in combination. In the layer sputtered onto the substrate in accordance with embodiments of the present invention, a layer property, e.g., thickness or an electrical or optical property, deviates from the deposited layer on the substrate along a substantial longitudinal portion less than a predetermined layer property deviation margin. The predetermined layer property deviation margin determines the degree of uniformity of the sputtered layer.
In embodiments of the present invention, the translation speed of the end block along the second direction, when moving in front of the substrate 170 or array of substrates, may be constant. The end block 120 carrying the target 160 could move beyond the substrate 170 or array of substrates, ie, a length greater than the length of the substrate 170 or array of substrates, such that the speed of movement when the target 160 is in front of the substrate 170 or series of substrates, is constant and such that the speed is only reduced after being moved past the substrate 170 or series of substrates. Similarly, the translation speed can be increased to a constant level that is reached before the end block 120 carrying the target 160 is positioned in front of the substrate 170 or array of substrates.
In a further embodiment of the first aspect, the present invention also relates to a sputtering device for sputtering large surface areas, such as large surface substrates or series of smaller substrates. This next embodiment of the first aspect of the present invention may relate to systems for use with moving substrates, i.e. where a substrate is moved within the sputtering chamber during sputtering. The sputtering device can be used in, and thus can form part of, a sputtering system. In embodiments of the present invention, the length of the surface, and thus of the large-area substrate, or of the series of smaller substrates, may be, for example, between 300 mm and 6000 mm. The width of the substrate or series of substrates can be between 300 mm and 3210 mm. Embodiments of the present invention can be used, while the present invention is not limited thereto, for sputtering glass plates, for example glass plates for displays such as, for example, TFT screens or electronic devices. Alternatively, while the present invention is not limited to, embodiments of the present invention can be used for sputtering pre-cut smaller glass plates in a series, for example if the cutting operation would have a negative effect on the coated glass plates.
According to embodiments of the present invention, the sputtering device comprises at least one end block 120 adapted to each contain a cylindrical target 160. If the cylindrical target 160 is mounted on the end block 120, its axis 161 is oriented in a first direction that extends from the end block 120. In use, when the sputtering device 100 is provided with a target and for sputtering in a sputtering system 101, the first direction is preferably parallel to a direction in the surface of the substrate 170 or series of substrates. This direction is hereinafter referred to as the third direction. If the first direction is not parallel to a direction in the surface of the substrate 170, the corresponding third direction is the direction of a perpendicular projection of the first direction on the substrate surface. For example, the first direction may be, but need not be, a vertical direction, in which case the third direction corresponds to the width direction of the substrate 170 or array of substrates.
The sputtering device further comprises a first driving means 190 for providing rotational movement of the at least one cylindrical target 160 about its longitudinal axis 161. The sputtering device 100 also comprises a second driving means 145 for applying a movement to the at least one end block 120 in a second direction. The applied movement in the second direction can be in a direction transverse to the substrate or to the substrate movement direction, such as in the embodiment shown in FIG. 14 illustrated embodiment. The movement in the second direction can be such that the distance between the target 160 and the substrate 170 is substantially constant.
When the end block 120 is moved in the second direction, the target axis 161 remains parallel during at least a substantial portion of the trajectory along the second direction, and preferably during the entire trajectory. The target axis 161 can, but does not have to, remain parallel to its original position. According to embodiments of the present invention, the movement of the end block 120 by the second drive means defines the uniformity of a layer sputtered on the moving substrate 170, in the fourth direction, on the substrate. In the layer sputtered onto the substrate in accordance with embodiments of the present invention, a layer property, e.g., thickness or an electrical or optical property, of the deposited layer on the substrate along a substantial longitudinal portion, deviates from a perpendicular projection of the second direction the moving substrate, less than a predetermined layer property deviation margin. The predetermined layer property deviation margin determines the degree of uniformity of the sputtered layer.
The substrate 170 or array of substrates can be a flat substrate or a curved substrate, and if a curved substrate, the curvature can be in one or two dimensions. According to embodiments of the present invention, the movement of the at least one cylindrical target 160 around its rotational axis 161 induced by the first driver 190 does not affect the uniformity in the fourth direction of the layer sputtered onto the substrate 170.
In embodiments of the present invention, the movement of the end block 120 in the second direction is a movement transverse to the substrate 170 or array of substrates, or transverse to the substrate movement direction, so that the distance between the target and the substrate 170 or array of substrates is constant is being held.
The uniformity of the sputtered coating in the fourth direction of the substrate could be controlled by changing the distance between the cylindrical target and the substrate or array of substrates. However, in accordance with embodiments of the present invention, it is not affected by the movement induced by the first drive means, i.e., the rotation about the target axis 161 in the first direction. Alternatively or in combination with it, the uniformity of the sputtered layer in the fourth direction could be controlled by controlling the translation speed along the second direction of the at least one end block 160. Yet another control means for controlling the uniformity of the sputtered layer in the fourth direction could be the regulation of the power level on the at least one target 16 while traversing the substrate 170 or series of substrates. These techniques can all be used as such to control the uniformity of the sputtered layer in the fourth direction, or they can be used in combination.
In embodiments of the present invention, the translational movement of the end block along the second direction could go in one direction. Alternatively, the translation movement of the end block could go back and forth.
In embodiments of the present invention, a cylindrical target 160 is mounted on the at least one end block 120.
According to embodiments of the present invention, the sputtering device 100 can be used in a larger sputtering system 101 that includes a sputtering chamber 110. In the sputtering chamber 110, a substrate holder 180 can be provided for attaching and containing a substantially statically positioned substrate 170 or array of substrates. The sputtering device 100 according to embodiments of the present invention can be designed to fit into existing sputtering systems 101. The entire sputtering device 100 may, for example, also comprise a wall that can be mounted on an opening in the wall of the sputtering chamber 110 of the sputtering system 101. Prior art sputtering chambers typically have an opening in the wall that is larger than the substrate dimensions. Prior art sputter chambers typically have a cavity large enough to allow a number of targets to extend beyond the substrate to achieve a uniform coating on the substrate.
A sputtering device 100 also includes tubes 113 for applying and removing cooling fluid and tubes 115 for supplying gas (both represented in FIG. 1 in a simplified manner). These tubes 113, 115 enter the sputtering chamber 110 through closures 112, 114 and allow cooling water and power to be supplied to the at least one end block 120 and in this way to the targets 160.
In embodiments of the present invention, the first drive means 190 for providing rotational movement to the cylindrical target 160 can be any suitable drive means, e.g., an electric motor or a hydraulic system that utilizes the cooling water flow. In embodiments of the present invention, the first driver 190 can operate in vacuum conditions. In this case, the first driver 190 must be specifically designed and adjusted to do this. Suitable vacuum motors are available on the market. Since in this embodiment of the invention both the first drive means 190 and the second drive means 145 for driving the end block 120 operate simultaneously in the vacuum environment of the sputtering chamber 110, no closure is required around the axis of the first drive means.
In alternative embodiments, the first drive means 190 is a drive means designed for operation under pressure conditions, e.g., under atmospheric pressure conditions. In this case, the first actuator 190 cannot simply be placed in the vacuum chamber 110, since the low pressure available there for sputtering activity would be detrimental to proper operation of the first actuator 190. In these embodiments, the first actuator 190 can be enclosed by a sealed casing 195 maintained under conditions of suitable pressure, for example under atmospheric pressure, to provide proper ambient conditions for the first actuator to function properly. The gas pressure in the sealed jacket 195 may differ from the vacuum in the sputtering chamber 110. The jacket 195 must then, of course, be sealed from the vacuum chamber 110 to maintain the correct pressure values. A first seal 130 between the sealed sheath 195 and the at least one end block 120 isolates the gas pressure in the sealed sheath 195 from the vacuum in the sputtering chamber 110. Cooling of the sealed sheath 195 and / or the first drive means 190 could be provided (not illustrated in FIG. 1). Various closures could be present, for example for establishing suitable lubrication of the bearing means that support the rotational movement of the first drive means. Other closures may be required to support proper electrical transfer between electric brushes and a commutator for transmitting the electrical current to the rotating target. In embodiments of the present invention, the sealed casing 195 is non-deformable, more particularly non-deformable under the difference between the pressure in the chamber and the vacuum outside the chamber (but within the vacuum chamber). In embodiments of the present invention, the sealed casing 195 includes closures to maintain the inside of the sealed casing 195 at the desired pressure, e.g., atmospheric pressure. Such closures are adapted to allow passage of cabling (e.g., sputtering electric cable, electric power cable for first drive means) and tubes (e.g., water cooling, detection lines, e.g., for measuring partial pressures between successive closures, or, for example, for measuring water leaks at the dynamic cooling shutdowns).
In embodiments of the present invention, a mechanical means 150 (e.g., but not limited to, a rod, link, timing chain, piston, cable, chain, worm, ...) may be provided for moving the end block 120 along the second direction, e.g. along a longitudinal direction of the substrate, or transversely of the substrate or the substrate movement direction, or a combination thereof. In embodiments of the present invention, this means for moving the end block 120 from outside the sputtering chamber 110 may be driven by the second drive means 145. A second barrier 140 between the end block moving means 150 and the wall of the sputtering chamber 110 closes the inside of the sputtering chamber from the outside of the sputtering chamber so that a vacuum can exist within the sputtering chamber. The second seal 140 can be a dynamic seal (FIG. 3) or more generally a static seal in case a flexible sleeve or bellow is used (FIG. 5). Additional barriers for passage of electricity cables and pipes for cooling water may also be present in the wall of the sputtering chamber 110 or may be combined with the second barrier 140.
In embodiments of the present invention, the means 150 (e.g., rod, link, distribution chain, piston, cable, chain, worm, ...) for moving the end block 120 from within the sputtering chamber 110 is driven by the second drive means 145. In these embodiments, just as for the first actuator 190, the second actuator 145 is either capable of operating under vacuum conditions or the second actuator 145 is encapsulated by an enclosure in which vacuum pressure levels, e.g., atmospheric pressure, can be maintained. In the latter case, a seal between the inside and outside of the enclosure makes it possible to maintain the pressure within the enclosure while the end block is moved within the enclosure by a second drive means. FIG. 1 schematically shows the front view of an exemplary embodiment of a sputtering system 101 comprising a sputtering device 100 according to the present invention. FIG. 2 shows the top view of the same embodiment. This illustrated embodiment relates to a system with a substantially fixed substrate, and a second direction along the longitudinal direction of the substrate to be coated. It is obvious to those skilled in the art how to improve this system for building a system where the second direction is transverse to the substrate or to the substrate movement direction.
Two sealed casings 195 are each attached to an end block 120 using first closures 130. A first drive means 190 is mounted in each of these sealed jackets 195, making it possible to rotate cylindrical targets 160 mounted on the end blocks 120. Third closures 125 allow this rotation while maintaining the vacuum in the sputtering chamber 110. Cooling fluid and power are made available to the at least one end block 120 through cooling housings 113 entering the sputtering chamber 110 by means of closures 112 and via an electricity cable 115 entering the sputtering chamber by means of closure 114. In embodiments of the present invention, alternating current power applied to the targets. In the embodiment shown in FIG. 1, the means 150 for moving the at least one end block 120 in the second direction is a chain that can be moved by a second drive means 145 that can be located inside or outside the sputtering chamber 110. If the second drive means 145 is located outside the sputtering chamber 110, the axis of rotation can enter the sputtering chamber via second closures 140. FIG. 1 and FIG. 2 also illustrate that the axes 161 of the targets 160 oriented in the first direction are parallel to the substrate 170. The substrate 170 or array of substrates is mounted on a substrate holder 180. Compared with FIG. 1 are in FIG. 2 the end blocks 120 and thus the targets 160 attached thereto are moved to the other side of the sputtering chamber 110 along the length of the substrate 170 or series of substrates in the second direction. FIG. 3 shows a schematic representation of a sputtering device 100 according to an exemplary embodiment of the present invention, in a sputtering system 101 for sputtering a substantially fixed substrate. It shows an end block 120 (a single end block) adapted to contain a cylindrical target 160 with a longitudinal axis 161 in a first direction. The figure also shows a first drive means 190 for providing a rotational movement of the cylindrical target 160 about its longitudinal axis 161. The sputtering device 100 also comprises a second drive means 145 for applying a movement to the end block 120 in a second direction, which may, but need not be, perpendicular to the first direction, whereby the target axis 161 is held in parallel along at least a substantial portion of the path of movement along the second direction, so that the movement of the end block 120 in the second direction defines a layer sputtered on a substrate 170 or series of substrates in a longitudinal direction of the substrate. In the illustrated embodiment, the second direction is along the longitudinal direction of the substrate 170. The movement of the first drive means 190 does not affect the uniformity in the longitudinal direction of the layer sputtered onto the substrate 170.
In embodiments of the present invention, the sputtering device further comprises a device also shown in FIG. 3 sputtering chamber 110. This sputtering chamber 110 comprises a cylindrical target 160 mounted on the end block 120. The shaft 161 of the end block 120 is thereby oriented in the first direction. The end block 120 is operatively coupled to the first drive means 190 for rotating the cylindrical target 160 about its axis 161. The figure also illustrates that the end block 120 can be moved in a second direction, which in the illustrated case is perpendicular to the first direction and is along the longitudinal direction of the substrate, while the present invention is not limited thereto. It will be apparent to those skilled in the art how to locate the second drive means in the sputtering chamber 110 for providing movement to the end block 120 that is transverse to the substrate or to the substrate movement direction. Therefore, a means 150 for moving the end block 120 is provided. In embodiments of the present invention, this end block moving means 150 is a rod 150 which moves through the wall of the sputtering chamber 110 and wherein the space between the wall of the sputtering chamber 110 and the rod 150 is closed off by a second closure 140. In FIG. 3, the second seal 140 is a dynamic seal. The rod 150 could also be shielded to prevent material from being sputtered on the rod. By means of this closure, it is possible to maintain a vacuum inside the sputtering chamber 110 and an atmospheric pressure outside the sputtering chamber. The second direction in FIG. 3, i.e. the driven direction of movement of the end block 120 in the sputtering chamber 110, is from left to right or vice versa. In alternative embodiments of the present invention, the second direction would be substantially perpendicular to the one shown in FIG. 3 may be the direction illustrated. The exemplary embodiment of the present invention illustrated in FIG. 3 makes it possible to move the target 160 in a second direction in front of the substrate 170 in the longitudinal direction thereof and to simultaneously rotate the cylindrical target 160. The substrate 170 is mounted in a substrate holder 180. In the embodiment of the present invention, but not necessarily, the second direction may be parallel to the substrate 170. In embodiments of the present invention, a first barrier 130 is provided for sealing between the end block 120 and the first drive means 190 or between the end block 120 and the sealed casing 195. In embodiments of the present invention, this seal is a static seal. In embodiments of the present invention, additional closures are provided that allow the coolant to pass through to the cylindrical target 160 and allow the rotation of the cylindrical target 160 while maintaining the vacuum in the sputtering chamber 110.
In embodiments of the present invention, the length of a cylindrical target 160 may be between 500 and 3000 mm, preferably between 750 and 2200 mm. The length of the cylindrical target 160 can be substantially equal to or longer than the width of the substrate 170 (measured in the first direction). Therefore, the cylindrical target 160 sputters over the full width of the substrate 170. By moving the cylindrical target 160 in the second direction, the full length of the substrate 170 can also be covered. Flierto the cylindrical target 160 can be moved longitudinally in front of a static substrate, or the cylindrical target 160 can be moved transversely to a moving substrate or transversely to the direction of movement of a moving substrate, or the second movement applied to the cylindrical target 160 can be a combination of longitudinal movement and a transverse movement to the substrate or to the substrate movement direction. The thickness of the coating can be controlled via the electrical power applied to the cylindrical target 160 and / or by controlling the speed of the end block 120, and thus of the target 160, in the second direction. In embodiments of the present invention, the power applied to the cylindrical target extends between 1 kW and 100 kW, preferably between 5 kW and 60 kW. In embodiments of the present invention, the power level for a given target length can vary between 4 kW / m and 30 kW / m. In embodiments of the present invention, the speed of the target in the second direction can be between 2 mm / s and 400 mm / s.
In embodiments of the present invention, the tubular target is powered by rotary connection. Compared to sputtering systems with a static, flat-lying target, the present invention uses rotating cylindrical targets. Therefore, instead of a static electrical connection to the target, rotating connections are required to transfer the electrical power to the target. This can be achieved, for example, by using brushes.
In specific embodiments of the present invention, the sputtering device comprises a number of end blocks, for example, a first end block 120 and a second end block 220. A first cylindrical target 160 may be mounted on the first end block 120 and a second cylindrical target 260 may be on the second end block 220. are confirmed. An example thereof has already been shown in and discussed with reference to FIG. 1 and FIG. 2, where a plurality, e.g., two, end blocks 120 are driven for simultaneous movement in the second direction, in the illustrated example, although the present invention is not limited thereto, along the longitudinal direction of the substrate. Another example thereof is shown in FIG. 4, where a number, e.g., two, end blocks 120 are driven for successive movement in the second direction. In the embodiment shown in FIG. 4 is again the second direction along the length of the substrate, but the present invention is not limited thereto, and the second direction could also be transverse to the substrate or to the substrate movement direction. In this case where a number of end blocks 12 are driven for successive movement in the second direction, the material of the first cylindrical target 160 may differ from the material of the second cylindrical target 260. By alternating sputtering with the first and the second cylindrical target, respectively a coating comprising different materials is sputtered onto the substrate 170. In the example of FIG. 4, the substrate 170 is mounted on a substrate holder 180. The first closures, not visible in this figure, close the first drive means against the end block. Second closures 140, 240 allow movement of the first end block 120 and the second end block 220 in the second direction while maintaining a vacuum in the sputtering chamber 110. Third closures 125, 225 allow rotation of the cylindrical targets 160, 260 with the first actuator 190 while maintaining a vacuum in the sputtering chamber 110. A means (e.g., a rod) 150 for moving the first end block 120 and a means 250 for moving the second end block 220 are also shown in FIG. 4 shown.
In the exemplary embodiment of the present invention illustrated in FIG. 5, the sputtering device 100 includes a bellows 141 mounted against the wall of the sputtering chamber 110 to allow the at least one end block 120 to move without requiring the presence of the means 150 for moving the at least one end block 120 within the vacuum chamber 110. The means 150 for moving the at least one end block 120 can now be placed outside the vacuum chamber 110, which offers the advantage that no material will be sputtered on it. The pressure in the bellows 141 is the atmospheric pressure. The first drive means 190 can be provided within the bellows and therefore does not need to be encapsulated in a sealed casing 195 such as, for example, in the embodiment shown in FIG. 1 illustrated embodiment. The means 150 for moving the end block 120 in the second direction can also be provided within the bellows 141. The bellows 141 permits the movement of the end block 120 from left to right and vice versa. The exemplary means 150 for moving the device shown in FIG. 5 is a rod, although the present invention is not limited thereto, and is driven by a second actuator 145 outside the sputtering chamber 110. In embodiments of the present invention, cooling housings 113 and electrical cables 115 as illustrated in FIG. 5 may be inserted into the rod, or may be provided adjacent the rod 150 within the bellows 141. Third closures 125 on the end block 120 allow the target 160 to rotate while maintaining the vacuum in the sputtering chamber 110. The in FIG. The illustrated embodiment is for moving the end block in a second direction along the length of a substantially static substrate, but in accordance with embodiments of the present invention, similar measures can be taken for moving the end block in a second direction substantially transversely to a moving substrate or transverse to the direction of movement of the moving substrate. FIG. 6 illustrates a similar arrangement as in FIG. 3, except that in this embodiment of the present invention a plurality of end blocks 120, in the illustrated embodiment four end blocks 120, are mounted on the means 150 for moving the end blocks 120 in the second direction. In this embodiment, the second direction is along the longitudinal direction of the substrate. The end blocks 120 move simultaneously in the second direction when the means 150 for moving the end blocks 120 is driven correspondingly. A number of end blocks 120 would also be in an arrangement similar to the one illustrated in FIG. 4 can be provided, i.e. where multiple means 150, 250 are provided for moving end blocks 120, 220 in the second direction. In such an embodiment, a first set of at least one end block could be driven to move in the second direction independently of the movement in the second direction of a second set of at least one end block. In specific embodiments, the second direction in which a first set of end blocks is driven and the second direction in which a second set of end blocks is driven does not even have to be the same direction. For example, the second direction in which a first set of end blocks is driven may be along the longitudinal direction of the substrate, while the second direction in which a second set of end blocks is driven may be transverse to the substrate or to the substrate movement direction. The number of end blocks in the first set and the number of end blocks in the second set need not be the same. FIG. 7 shows the same embodiment as FIG. 6, but with end blocks 120 that move to the left in the second direction. In embodiments of the present invention, the end blocks 120 can be moved much more to the left, for example, to a position where all end blocks are moved beyond the left edge of the substrate 170 or of the array of substrates. A similar movement to the right is also possible. In alternative embodiments, the movement in the second direction is limited, both to the left and to the right in the illustrated embodiment, so that substantially no overlap occurs between a first zone on the substrate or series of substrates sputtered by a first target and a second, neighboring one , zone on the substrate or series of substrates sputtered by a second, neighboring, target. Such motion allows to cover the entire substrate 170 or array of substrates without moving the substrate or array of substrates themselves. By using a number of targets, the movement of the targets in the second direction can be reduced.
In embodiments of the present invention, both in embodiments for use with substantially fixed substrates and for use with moving substrates, the end block includes a magnetic rod so that it is located substantially in the center of the cylindrical target 160 oriented in the first direction. In embodiments of the present invention, the magnetic rod is divided into different segments along the length of the cylindrical target 160 (first direction), each comprising separate magnet structures, and each of these segments can be individually oriented in translation and / or rotational.
A translation change of the position of the magnet structures in the different magnetic bar segments involves positioning the magnet structures closer or further away from the target surface. This allows the operator to control a property of the coating, for example the thickness of the coating or an electrical or an optical property, along the third direction (width direction of the substrate) by individually orienting the segments of the magnetic rod.
A rotational change in the orientation of the magnetic rod around the central axis of the cylindrical target 160 induces orientation of the plasma in a particular direction. Thus, the operator has additional freedom to operate the sputtering device 100 and to influence the uniformity of the sputtered layer, e.g., the thickness of the coating, in a direction on the substrate perpendicular to the third direction. This can be, but does not have to be, the fourth direction. Fourth drive means can be provided for this purpose.
In embodiments of the present invention, a third and fourth drive means are provided for driving the movement of the magnetic rod, respectively for translation and / or rotational movement. Using the third and / or fourth driving means, it is possible to position at least one magnetic structure of a number of magnetic structures of a longitudinal magnetic rod. The longitudinal magnetic bar can be positioned in the center of a cylindrical target. The magnet structures are located along the longitudinal direction (first direction) of the longitudinal magnet rod. This makes it possible to influence the uniformity of the coating in the fourth direction of the substrate by independently controlling the position of the individual magnet structures of the magnetic rod. The third drive means could, for example, move one or more of the magnet structures farther away from the substrate or closer to the substrate. The fourth drive means could rotate one or more, for example all, of the magnet structures about an axis parallel to the first direction. This rotation also has an influence on the uniformity, for example the thickness, of the coating in the fourth direction.
The third and / or fourth drive means could comprise a positioning system for each of the magnet structures, individually and / or jointly. The third and / or fourth drive means could be controllable from outside the sputtering chamber 110, so that the position of the magnetic rod and / or magnet structures can be controlled during sputtering. This makes it possible to control the uniformity, e.g. the thickness, of the sputtered coating in the fourth direction. If the third and fourth drive means are synchronized with the position of the end block in the second direction, the uniformity, e.g., the thickness, of the coating in the fourth direction can also be influenced.
In embodiments of the present invention, the first drive means 190 allows the cylindrical target 160 mounted on an end block 120 to rotate about its longitudinal axis 161. This has the advantage that target use can be increased. The second drive means 145 allows the at least one end block 120 to move in the second direction, which, in embodiments of the present invention, allows the uniformity of a property, e.g., the thickness, of a coating provided on a substrate 170 or array of substrates in the fourth direction. The uniformity of a property, for example of the thickness, of the coating in the third direction can be controlled by the third drive means by moving the magnet structures as such, their position (distance) with respect to the target surface along the magnet configuration in the first direction is adjusted. By synchronizing the rotational movement of the magnetic rod around the axis 161 of the cylindrical target 160, induced by the fourth actuator, with the translational movement of the end block 120 induced by the second actuator 145, the fourth actuator can also be used to uniformity for example, the thickness of the coating in the fourth direction.
In embodiments of the present invention, such as illustrated in FIG. 8, a cathode assembly 330 may include a plurality of end blocks 120. Each end block 120 can contain at least one target 160. Each end block 120 can be mounted on the cathode assembly 330 and a cylindrical target 160 can be mounted on each end block, thus realizing a merry-go-round of cylindrical targets in parallel with each other. In embodiments of the present invention, each of these cylindrical targets is in parallel with the substrate 170 or array of substrates. Each of these cylindrical targets can be rotated about its axis by a first drive means 190. The cathode assembly 330 can be rotated to orient one set of the targets, including one or more targets (preferably, for example, 2 targets), toward the substrate 170. The cathode assembly 330 can be moved in a second direction by means 150 for moving the end block 120 or in this embodiment the cathode assembly 330. This means is driven by a second drive means 145. The second direction may, but need not be, perpendicular to the first direction. In the embodiment shown in FIG. 8 is the second direction along the longitudinal direction of the substrate. In alternatives to the ones shown in FIG. In the illustrated embodiment, not illustrated in the figures, the cathode assembly can also be rotated to orient one set of targets toward the substrate, and the cathode assembly can be moved in a second direction that is, for example, transverse to the substrate or to the substrate moving direction. FIG. 8 schematically shows an exemplary embodiment of the present invention including a merry-go-round of cylindrical targets 160. The upper part of the figure shows a substrate 170 (but the same configuration can be used for a series of smaller substrates assembled to form a larger surface to be coated) (similar to a larger substrate), which is essentially static during a sputtering operation. This substrate is placed in three different positions in FIG. 8 illustrated: - position I: before entering the sputtering chamber 110 - position II: in the sputtering chamber 110 between two valves 320 - position ll: after leaving the sputtering chamber 110.
In alternative configurations, not illustrated in the figures, zone I before entering the sputtering chamber 110 and zone III after leaving the sputtering chamber 110 may be physically the same location.
In still alternative configurations, not illustrated in the figures, the substrate could move continuously within the sputtering chamber and the second direction could be transverse to the substrate surface or to the substrate movement direction.
A means 150 for moving the cathode assembly 330 including a plurality of end blocks 120 in FIG. 8 is driven by a drive means 145 outside the sputtering chamber 110. In the embodiment shown in FIG. In the illustrated embodiment of the present invention, the means 150 for moving the cathode assembly 330 in the second direction is a threaded rod, while the present invention is not limited thereto, and any suitable driving means that forms embodiments of the present invention. A second seal 140, in this case a dynamic seal, between the threaded rod 150 and the wall of the sputtering chamber 110 allows rotation of the threaded rod 150 while maintaining a vacuum in the sputtering chamber 110. The cathode assembly 330 can be rotated about its axis to position the preferred target or targets in front of the substrate 170. The at least one cylindrical target 160 positioned in front of the substrate 170 can be rotated by a first drive means 190 about its axis 161 (not illustrated in FIG. 8). Via the valves 320, the substrate 170 can enter or leave the sputtering chamber 110. These valves 320 make it possible to create a vacuum in the sputtering chamber 110. In operation, the cathode assembly 330, and thus the at least one cylindrical target 160 oriented towards the substrate 170, moves back and forth in the second direction within the sputtering chamber 110, driven by the second drive means 145. This movement can, for example, pass along the be in the longitudinal direction of a substantially static substrate, or transverse to a moving substrate or to its direction of movement. As a result, the at least one cylindrical target 160, positioned in front of the substrate 170, is rotated about its axis, driven by the first drive means 190. When the desired property, for example the desired thickness, of the sputtered material on the substrate is achieved, the cathode assembly 330 are rotated to start sputtering another material. To this end, the cathode assembly 330 can be driven in an opposite direction along the second direction in front of a substantially static substrate. This sputtering method allows sputtering of a coating consisting of a complex stack of different materials uniformly over a large 2D surface, for example a large 2D substrate or a series of smaller 2D substrates, without the need for moving or transporting of this substrate or series of substrates during the deposition process. In alternative embodiments, the moving substrate can be moved in the opposite direction, such as during a previous passage.
In another exemplary embodiment of the present invention, illustrated in FIG. 10, the second drive means 145 is an electric motor fixed with the end block 120. The second drive means is encapsulated by a sealed casing 195. A seal 140 is provided, which is a seal between a shaft of the second drive means 145 and the sealed casing 195. This closure 140 makes it possible to have a pressure other than vacuum, for example an atmospheric pressure, and a vacuum in the sputtering chamber 110 within the sealed casing 195 while the shaft of the second drive means 145 is being rotated. This shaft is a key axis capable of running over a means 150 for moving the end block 120 in the second direction, while the means 150 is in the form of a toothed rod, the teeth and grooves of which fit into each other with the grooves and wedges in the key axis. The toothed bar is oriented in the second direction. Instead of using a motor as the first driving means 190, in this embodiment of the present invention, the shaft 191 which drives the rotation of the cylindrical target is also slotted and also runs over a second toothed rod 192. The end block 120 and the closed casing 195 are fixed together. By driving the end block 120 for movement in the second direction, by means of the second drive means 145, the cylindrical target 160 is thereby also forced to rotate. In the embodiment shown in FIG. The illustrated embodiment is the second direction along the longitudinal direction of the substrate, but in alternative embodiments, not illustrated in the figures, similar means can be provided where the second direction is transverse to the substrate or to its direction of movement.
A similar but alternative embodiment is illustrated in FIG. 13. Again, this embodiment can be used with a substantially static substrate, such as in the embodiment shown in FIG. 13 illustrated embodiment. Alternatively, this embodiment can be adapted for use with a moving substrate, wherein the second direction is substantially transverse to the substrate or to the substrate moving direction. In these embodiments, a sealed casing 195 is secured by means of closures 130 to an end block 120. The first actuator 190 is an electric motor within the sealed sheath 195. Terminations 125, between the end block 120 and the shaft of the first actuator 190, allow to rotate the cylindrical target 160 while maintaining a vacuum in the sputtering chamber 110 and a different pressure atmospheric pressure, for example, is maintained in the sealed casing 195. The second drive means 145 is activated in that a key axis of the first drive means 190 runs over a toothed bar 150 (the means for moving the end block 120 in the second direction). Rotation of the target 160 about its axis automatically induces movement of the end block in the second direction.
Specific embodiments of the present invention, for use with a substrate that moves substantially in the longitudinal direction of the substrate, are illustrated with reference to FIG. 14 and FIG. 15. FIG. 14 shows a series of substrates 170 that are moved within a sputtering chamber (not illustrated). An end block 120 is provided in the sputtering chamber that contains a cylindrically rotatable target 160. The target 160 has a longitudinal axis 161 in a first direction. A width direction W is defined on the substrate, which corresponds to a perpendicular projection of the first direction onto the substrate. The width direction of the substrate may or may not be parallel to the first direction. In the illustrated embodiment, the target 160 is vertically upright and the width direction is a vertical direction. In alternative embodiments (not illustrated), the target could be angled with respect to the vertical direction, in which case also the width direction on the substrate could be defined other than the vertical direction. The illustrated substrates 170 move within a sputtering chamber from left to right, as indicated by the large arrow pointing to the right. In the illustrated embodiment, each of the substrates 170 is slightly curved about an axis in the vertical direction. During sputtering, the target 160 is driven by a first drive means 190 that provides rotational movement of the target 160 about its longitudinal axis 161. At the same time, a second drive means 145 applies a movement to the end block 120 in a second direction. In the illustrated embodiment, the second direction is transverse to the substrate surface or to the substrate movement direction. The movement in the second direction can be such that the distance between the target 160 and the substrate 170 that passes along it is constant. The second direction is defined in a plane of movement, for example in a horizontal plane. The second direction may or may not be perpendicular to the first direction. A longitudinal direction of the substrate can be defined as a direction along a dimension of the substrate, defined by an intersection of an intersection plane parallel to the movement plane according to the movement applied by the second drive means.
By keeping the distance between the target 160 and the substrate 170 constant, a layer property, e.g., thickness or an electrical or optical property, of the deposited layer on the substrate along a substantial longitudinal portion may deviate less than a predetermined layer property deviation margin . FIG. 15 shows a top view of an embodiment according to embodiments of the present invention, wherein a number of substrates 170 are moved within a sputtering chamber, sequentially. In the illustrated embodiment, the number of substrates 170 within the sputtering chamber is moved from right to left, but the present invention is not limited thereto. An end block (not illustrated) is provided in front of the substrates 170 for containing a cylindrical target 160. The cylindrical target 160 has a longitudinal axis in a first direction which, in the embodiment illustrated in plan view, is the direction out of the plane of the drawing is coming. First drive means (not illustrated in FIG. 15) are provided for providing rotational movement of the cylindrical target 160 about its longitudinal axis. Second drive means (not illustrated in FIG. 15) are provided for applying movement to the end block 120 in a second direction, wherein the target axis is held parallel during at least a substantial portion of the path of movement along the second direction. The movement in the second direction, as illustrated in FIG. 15, is such that the distance between the substrate 170 and the target 160 is kept constant.
It will be appreciated that, due to the specific shape of the device shown in FIG. 15 illustrated substrates 170, it is not sufficient to keep the distance between substrate and target constant. In addition to the movement of the target 160 in a second direction transversely to the substrate or to the substrate movement direction, the magnetic system in the target 160 should be rotated along an axis in the first direction such that the generated trail on the target surface is always below a controlled angle with respect to the substrate 170. This movement of the magnetic system can be realized by means of fourth drive means, by providing a swinging movement of the magnetic system with respect to the end-block system or a rotational movement of the end-block with respect to of the vacuum system.
By appropriately driving the end block and / or the magnetic system as described above, a layer property of the deposited layer on the substrate along a substantial portion in the longitudinal direction of the substrate may deviate less than a predetermined layer property deviation margin, thus a sputtered layer with providing at least one uniform layer property, e.g., thickness and / or an electrical property and / or an optical property.
In specific embodiments of the present invention, not illustrated in the figures, the target can be driven for rotation along its longitudinal axis and can be simultaneously driven in a rotating motion around the end block, so that the end of the target is far away from the end block direction or moved away from the substrate surface. This can be combined with a further statically positioned target (and thus end block) as the substrate moves, or with a translational movement of the target along the longitudinal direction of the substrate if the substrate is statically positioned or with a translational movement of the target transverse to the substrate or on the substrate movement direction if the substrate is moved. Also the third movement of the magnet configuration, during which magnets are moved closer to or further away from the target surface, and / or the fourth movement of the magnetic structure about an axis parallel to the first direction, can be implemented in such embodiments.
If the substrate has an irregular shape in the width direction, there is a difference in distance from target to substrate over the width direction of the substrate. It can be shown that as the distance between target and substrate becomes larger, there is more deviation in the uniformity of the sputtered layer at the level of the ends of the target. This is illustrated in FIG. 16 and FIG. 17. The configuration underlying these line diagrams is as follows: there is a vertical target configuration as shown in FIG. 14. The substrate width is 1000 mm (corresponding to the values from -500 mm to +500 mm in FIG. 16 and FIG. 17. The target length is 1560 mm (from -780 mm to +780 mm in FIG. 16 and FIG. Fig. 17) and is represented by the horizontal axis Fig. 16 and Fig. 17 show respectively absolute and relative results for uniformity of a layered property of the deposited layer, for different substrate target distances (wherein the distances are 80 mm, 140 mm and 200 mm) and displayed on the vertical axis.
The absolute results of FIG. 16 illustrate the ratio in% of material arrival flux density (= deposition rate on the substrate) to material departure flux density (= sputter rate out of the target). FIG. 16 illustrates that increasing the distance from target to substrate allows more material flux to "leak" and be deposited adjacent to the substrate, causing the uniformity of the layer sputtered to be lower at the level of the ends of the target.
The relative results of FIG.17 provide a relative deposition profile on the substrate along the target axis. It can be seen that for a distance of target from substrate of 80 mm the layer thickness at the lower and upper edge of the substrate is about 1.5% lower than in the middle, while for a distance of target from substrate of 140 mm 4% and for a distance of 200 mm this is approximately 7%. From the absolute results of FIG. 16 it can be seen that increasing the space between target and substrate from 80 mm to 200 mm results in a reduction of the deposition rate in the center of the substrate by about 2.6% (from 99.5% to 96.9 %). Providing a sputter power control algorithm that is dependent on the space between target and substrate can make it possible to compensate for this fluctuation of the central thickness for a curved substrate.
After correction of the power signal, synchronized with the substrate movement and periodically with the substrate size and transport speed, results such as the relative results illustrated in FIG. 17 can be achieved. This case still suffers from a variation in uniformity distribution on the substrate in a direction along the target length that results from the varying space between target and substrate. The latter constant variation of layer thickness over the surface of a curved substrate (worst uniformity for largest space between target and substrate) can only be reduced by increasing the target length. However, this would require the use of extra long targets, which would mean a significant increase in variable costs (target material), a significant increase in investment costs (larger vacuum chambers) and a significant increase in energy consumption (more power for longer targets and more power for vacuum pumps and gas distribution).
A complete solution to all of these issues can be provided by implementing a sputtering device in accordance with embodiments of the present invention, including at least the second drive means, and optionally also the third and / or fourth drive means.
The exemplary embodiment of the present invention is schematically illustrated in FIG. 9 includes a controller 410. The controller is shown only in FIG. 9, but can be applied to all embodiments of the present invention. The dotted lines indicate the features that can be controlled in this embodiment: (a) The rotational speed of the cylindrical target 160 by controlling the first drive means, (b) The power applied to the cylindrical target 160 by controlling a power source, (c) The speed of the at least one end block 120 in the second direction by controlling the second drive means, (d) Location-dependent alignment of the magnetic rod and / or magnet structures by controlling the third drive means for translational movement of magnet structures along the first direction and / or the fourth drive means for rotational movement of the magnetic rod about a target axis.
The speed of the at least one end block 120 in the second direction can be controlled by controlling the second drive means 145 which drives the rod 150 for moving the end block 120. The controller 410 can thus control the speed in the second direction of the cylindrical target 160 in front of the substrate 170 or array of substrates mounted in the substrate holder 180. The rotational speed of the cylindrical target 160 can be controlled by controlling the first drive means 190 coupled to the end block 120. The position of the magnet structures along the first direction and / or the rotation of the magnet rod about a target axis can be controlled by the third and / or fourth drive means. In embodiments of the present invention, the controller 410 can be operated by software running on a computer 420.
In embodiments of the present invention, the controller 410 may also control other parameters such as the pressure within the vacuum chamber 110, location-dependent gas distribution, and flows. In embodiments of the present invention, an additional driver means (not illustrated in the figures) makes it possible to increase or decrease the distance between the target and the substrate or array of substrates.
In embodiments of the present invention, the controller 410 can be controlled via a computer 420. A user interface on the computer 420 can allow an operator to control the sputtering process via the computer 420 and controller 410. Automation software on the computer 420 and / or on the controller 410 can automate the sputtering process. For example, it may be possible for the speed of the end block 120 in the second direction and the power on the cylindrical target 160 to be automatically controlled by the software to obtain uniformity in a coating property, e.g., thickness, specified by the operator. As an example, in embodiments of the present invention, software on the computer 420 allows the operator to specify a stack of layers with a preferred property distribution, for example, a preferred thickness, for each layer. Based on these specifications, the software on the computer determines the optimum parameters (e.g., parameters for controlling the first, second, third, and fourth drive means, parameters for controlling the electrical power on the target) for controlling the sputtering device 100 .
In embodiments of the present invention, a control loop for controlling the sputtered coating can be closed by measuring a property or multiple properties of the provided coating. This property can be fed back to close the control loop. A possible property that can be measured is the thickness of the coating, another property could be the resistivity of the coating, optical properties could also be taken into account. These properties can be measured at various locations on the substrate or array of substrates and they can be measured in the first direction as well as in the second direction. Based on the measurement results and certain deviations from desired values, control signals can be generated to adjust parameters of the sputtering process, such as, for example, the drive parameters of the first, second, third and fourth drive means, electrical power supplied to the target, gas flow, etc. .
While prior art batch coaters have a circular drum covered with samples to be coated, as illustrated in FIG. 18 (a), embodiments of the present invention make it possible to use drums that have a different cross-sectional shape, such as, for example, but not limited to, a triangular shape as illustrated in FIG. 18 (b) and FIG. 18 (c). In accordance with embodiments of the present invention, the at least one target 160, comprised by an end block 120, can be driven in a second direction transversely to the substrate or substrates on the coater drum, as illustrated in FIG. 18 (b). However, given the triangular shape of the drum, during rotation of the drum, the distance from target to substrate would be different for different angular positions of the drum. In accordance with embodiments of the present invention, during rotation of the drum, the end blocks containing the targets can be moved transversely to the substrates in a second direction, and at the same time the end blocks and / or the magnetic configurations can be moved by means of fourth drive means, are rotated within the targets so that the trail is at a controlled angle with respect to the substrate.
In a second aspect, embodiments of the present invention relate to a method for sputtering, in a vacuum chamber, large surface areas with a length in a longitudinal direction and a width in a width direction, for example large surface substrates or series of smaller substrates which together form a surface of large surface. The method includes the step of rotating a cylindrical target about its longitudinal axis that is oriented in a first direction. In embodiments of the present invention, the first direction is parallel to a substrate. At the same time, the cylindrical target is moved in a second direction, the target axis being held parallel during at least a substantial portion of the path of movement along the second direction. The movement in the second direction is such that a layer property of the deposited layer on the substrate along a curve on the substrate defined by a projection of a sputter location of the target on the substrate under the relative movement between target and substrate, less than one predetermined layer property deviation margin differs. In embodiments of the present invention, the second direction may be along the longitudinal direction of the substrate. The second direction can have a component along the first direction. In alternative embodiments of the present invention, or combined with it, the second direction may have a component transverse to the substrate surface or to the substrate movement direction. The second direction may, but need not be, perpendicular to the first direction. The second direction can be defined in a plane of movement, for example, but not limited to, a horizontal plane. A longitudinal direction of the substrate can be defined as a direction along a dimension of the substrate, defined by an intersection of an intersection plane parallel to the motion plane as defined by the motion applied by the second drive means. The translational movement of the cylindrical target in the second direction is such that the longitudinal axis of the target does not change direction along at least a substantial part of the path of movement along the second direction, ie remains parallel to itself in different positions in the second direction .
In embodiments of the present invention, the method further comprises the translational movement of individual magnet structures and / or the rotational movement of a magnetic rod about a target axis, or the rotational movement of an end block relative to the vacuum chamber. The individual magnet structures are positioned along a longitudinal magnet configuration in the first direction.
In embodiments of the present invention, the method further comprises synchronizing the translation movement of the target along the second direction with the translation or rotational movement of a magnet configuration about a target axis. This synchronization of movements can take into account the shape of the substrate.
In embodiments of the present invention, the method is applied to multiple targets. The embodiment of the present invention illustrated in FIG. 4 can be operated, for example, by first moving the first cylindrical target 160 in the second direction along the length of a substrate 170. This can be done once or repeated several times. Next, the second cylindrical target 260 can be moved in the second direction along the length of the same 2D surface consisting of a large substrate 170 or a series of smaller substrates. This can also be done once or repeated several times. The process of alternating sputtering with the different targets 160, 260 can be continued until the coating on the 2D surface, e.g. substrate 170, has reached the desired parameter distribution, e.g. the desired thickness and composition. Using this method, a stack of many layers can be obtained with one process step, i.e. without breaking the vacuum. It is not required to replace a particular cylindrical target, nor to move the 2D surface, e.g., substrate 170, from one sputtering device to another sputtering device. While one of the cylindrical targets is moved in the second direction, that cylindrical target is also rotated about its axis.

权利要求:
Claims (23)
[1]
Conclusions
A sputtering device (100) for depositing a layer on a substrate in a vacuum chamber, the sputtering device comprising: - at least one end block (120) adapted to each contain a cylindrical target (160), the target (160) ) has a longitudinal axis in a first direction, - a first drive means (190) for providing rotational movement of the at least one cylindrical target (160) about its longitudinal axis, - a second drive means (145) for applying a translation movement on the at least one end block (120) in a second direction, wherein the target axis is held parallel during at least a substantial portion of the path of movement along the second direction, and wherein the first and second drive means (190, 145) are adapted to be operational simultaneously in the vacuum chamber during sputtering.
[2]
The sputtering device (100) of claim 1, wherein the first drive means (190) is configured to substantially not change the spatial particle ejection distribution from the target, while the second drive means (145) is configured to maintain the direction of the spatial particle emission distribution.
[3]
Sputtering device according to one of the preceding claims, wherein the movement by the first driving means is not intended to influence the uniformity of the layer sputtered on the substrate along a curve on the substrate defined by a projection of a sputtering location of the target on the substrate under the relative movement between target and substrate.
[4]
Sputtering device according to one of the preceding claims, wherein the movement through the second drive means is such that the layer property of the deposited layer on the substrate along a curve on the substrate, defined by a projection of a sputtering location of the target on the substrate under the relative movement between target and substrate, deviates less than a predetermined layer property deviation margin.
[5]
Sputtering device (100) according to one of the preceding claims for depositing a layer on a substrate with a length in a longitudinal direction and a width in a width direction, the first direction being positioned along the width direction and the second direction along the longitudinal direction of the substrate (170).
[6]
The sputtering device (100) according to any of the preceding claims, wherein the second drive means (145) is adapted to apply movement to the at least one end block (120) in the second direction over more than twice the length of a end block (120).
[7]
The sputtering device (100) of claim 6, wherein the second drive means (145) is adapted to apply movement to the at least one end block (120) in the second direction over substantially the entire length of the substrate (170) ).
[8]
The sputtering device (100) of any preceding claim, wherein the second direction has a component transverse to the substrate surface or to a direction of movement of the substrate.
[9]
The sputtering device (100) of any preceding claim, wherein the second direction has a component along the first direction.
[10]
The sputtering device (100) according to any of claims 1-8, wherein the second direction is oriented perpendicular to the first direction.
[11]
The sputtering device (100) according to any of the preceding claims, wherein the second drive means (145) is adapted to apply a movement to the at least one end block (12) in the second direction such that the target axis extends over the entire movement. is kept parallel in the second direction.
[12]
The sputtering device (100) according to any of the preceding claims, wherein the first drive means (190) is operable under vacuum conditions or wherein the first drive means is provided within a sealed casing (195) which together with the at least one end block (120) can be moved by the second drive means.
[13]
A sputtering device (100) according to any preceding claim, wherein the sputtering device comprises a plurality of end blocks, at least a first end block (120) adapted to contain at least one first cylindrical target and a second end block (220) adapted for containing at least one second cylindrical target.
[14]
The sputtering device (100) according to any of the preceding claims, wherein the sputtering device (100) comprises a third driving means for driving a longitudinal magnet configuration that may be placed in a cylindrical target (160), the third driving means being adapted to define uniformity of the layer sputtered on the substrate (170) in a direction corresponding to a perpendicular projection on the substrate of the first direction.
[15]
A sputtering device (100) according to any one of the preceding claims, comprising a fourth drive means for rotating a longitudinal magnet configuration that may be disposed in a cylindrical target (160) along an axis parallel to the first direction.
[16]
The sputtering device (100) of claim 15, wherein the fourth drive means is adapted to support a controlled sputtering flux angle on the surface of the substrate on which the layer is to be deposited.
[17]
A sputtering device (100) as claimed in any preceding claim, comprising a cathode assembly (330) adapted to contain one or more end block (s) (120), each adapted to attach a cylindrical target (160), in a array configuration and wherein one or more specific cylindrical targets can be oriented toward a substrate (170) and selected to be driven during sputtering.
[18]
The sputtering device (100) according to any of the preceding claims, wherein the sputtering device comprises a controller (410) adapted to control - the speed of the at least one end block (120) in the second direction and / or, - the power applied to the at least one cylindrical target (160) and / or - the rotational speed of the at least one cylindrical target (160) and / or - the position of a magnetic rod within the at least one cylindrical target (160) ) and / or, - the gas distribution along the at least one cylindrical target.
[19]
The sputtering device (100) according to any of the preceding claims, wherein the movement of the at least one end block (120) in the second direction provided by the second drive means (145) is a linear movement.
[20]
The sputtering device (100) of any preceding claim, wherein the speed of the at least one end block (120) is constant along the second direction.
[21]
A method of sputtering a substrate in a vacuum chamber, the method comprising the step of rotating a cylindrical target around its longitudinal axis oriented in a first direction while moving the cylindrical target in a second direction, the target axis is held parallel during at least a substantial part of the path of movement along the second direction.
[22]
The method of claim 21, wherein, in a first step, a set of at least one first cylindrical target is moved in a second direction of the sputtering chamber and wherein, in a second step, a set of at least one second cylindrical target is moved in the second direction of the sputtering chamber.
[23]
23.- Controller for controlling movement of at least one cylindrical target in a vacuum chamber of a sputtering device, the movement comprising a first component that is a rotational movement about its longitudinal axis oriented in a first direction, and, simultaneously, a second component which is a translation movement in a second direction, wherein the target axis is held parallel during at least a substantial part of the path of movement along the second direction.

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法律状态:
2020-08-21| PD| Change of ownership|Owner name: SOLERAS ADVANCED COATINGS BV; BE Free format text: DETAILS ASSIGNMENT: CHANGE OF OWNER(S), CESSION Effective date: 20200512 |

优先权:

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申请号 | 申请日 | 专利标题

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EP14176303.7A|EP2966192A1|2014-07-09|2014-07-09|Sputter device with moving target|

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EP14176303.7|2014-07-09|

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EP15166011|2015-04-30|

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