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    • 专利摘要:
    It is an object of the invention to provide a coated sawing wire with excellent grinding resistance which contains an organic film or an inorganic film coated on the surface of a base wire and which is used for cutting during the blowing of abrasive grains. Furthermore, it is another object of the invention to provide a coated saw wire with which the accuracy of the saw surface can be made excellent. In a coated saw wire containing an organic film or an inorganic film coated on a surface of a base wire, a ratio of the modulus of elasticity of a surface of the film to the hardness (GPa) of the surface of the film (modulus of elasticity / hardness ) equal to 6-25 when measured by a nano-indentation method.
    公开号:BE1019645A5
    申请号:E2010/0319
    申请日:2010-05-26
    公开日:2012-09-04
    发明作者:Hiroshi Yaguchi；Yasuhiro Oki；Kazuo Yoshikawa；Takashi Kobori
    申请人:Kobelco Res Inst Inc；
    IPC主号:
    专利说明:

    COATED SAW THREAD
    BACKGROUND OF THE INVENTION
    1. The domain of the invention
    The present invention relates to a coated saw wire that is used in a sawing machine. More specifically, the present invention relates to a coated saw wire that is used in blowing abrasive grains on a contact portion between a workpiece and the saw wire when sawing a workpiece of metal, ceramic, and the like.
    2. Description of the related art
    A workpiece from metal, ceramics and the like is sawn by a sawing machine with a saw wire attached thereto. The saw wire runs in one direction or in two directions (back and forth) and can cut the workpiece to any width by bringing the saw wire into contact with the workpiece.
    The cutting surface of the workpiece must be smooth. In order to improve the accuracy of the saw surface of the workpiece, the workpiece is sawn while a solution containing abrasive grains is blown onto the contact portion between the workpiece and the saw wire. The accuracy of the sawing surface becomes so excellent because the abrasive grains contained in the blown solution are drawn between the workpiece and the sawing wire and the wear of the workpiece is thereby promoted.
    As a technology that improves the accuracy of the cutting surface of the workpiece, a technology is known that improves the shape of the sawing wire itself and not blowing the abrasive grains. By way of example, in the publication of the unexamined Japanese patent application with the number 2005-111653 a saw wire is proposed whose surface is subjected to a galvanization with zinc or copper and whose difference between the maximum and minimum diameter and the surface roughness has been optimized. Furthermore, in the unexamined Japanese patent application with the number H10-309627 a steel wire for a saw wire is proposed whose unevenness of the saw surface is reduced by imposing conditions on the distribution of the hardness in the cross section of the wire.
    Furthermore, in the unexamined Japanese patent application with the number 2006-179677 a wire is published whose outer peripheral surface is coated with a resin-bearing film containing abrasive grains. The documentation accompanying the patent states that abrasive grains (separate abrasive grains) can be stably drawn to a contact portion between the wire and a workpiece because the abrasive grains (separate abrasive grains) bite into the resin-bearing film when using the wire.
    As described above, the saw wire wears out when sawing the workpiece during blowing of the abrasive grains and thus an unevenness is formed on the surface of the saw wire. This unevenness deteriorates the accuracy of the saw surface of the workpiece and causes the cutting wire to break. In the publications of the unexamined Japanese patent applications with the numbers 2005111653, H10-309627 and 2006-179677, however, no attention is paid to the cutting resistance of the sawing wire and according to the study of the present inventors in the field of the cutting resistance inferior.
    SUMMARY OF THE INVENTION
    The present invention was developed on the basis of such conditions, and its object is to provide a coated saw wire with excellent abrasion resistance that contains an organic film coated on the surface of a base wire and which is used for sawing during blowing of abrasive grains. Furthermore, it is another object of the invention to provide a coated saw wire with which the accuracy of the saw surface can be made excellent.
    The coated saw wire in accordance with an aspect of this invention that could accomplish the above-described task is characterized in that it contains an organic film coated on the surface of the base wire and that the elastic modulus (GPa) ratio of the surface area of the film relative to the hardness (GPa) of the surface area of the film (elasticity / hardness) is 6-25 when measured by a nano-indentation method.
    The hardness of the surface of the film is preferably 0.1-1 GPa. The thickness of the inorganic film can be 0.05 - 15 µm. As for the base wire, the use of a wire with a hardness of 3 GPa or more is recommended if measured by a method of nano-indentation.
    The invention includes a method for producing a saw body comprising sawing the workpiece through the coated saw wire while abrasive grains are blown onto the contact surface between the saw wire and the work piece.
    In accordance with an aspect of the invention, the cutting resistance of the sawing wire can be improved since the modulus of elasticity to hardness (modulus of elasticity / hardness, hereinafter referred to as "plasticity index") of the surface of the sawing wire is retained within the Furthermore, if the hardness of the surface is maintained within the range of 0.1-1 GPa and in particular if the plasticity index of the surface of the saw wire remains within the aforementioned range, the accuracy may also be of the saw surface can be improved.
    BRIEF DESCRIPTION OF THE DRAWINGS
    Figure 1 is a graph showing the relationship between the depth of identification and the hardness of the surface of the film with respect to No. 1, shown in Table 1 of the examples; Figure 2 is a graph showing the relationship between the depth of indentation and the modulus of elasticity of the surface of the film with respect to No. 1 shown in Table 1 of the examples; Figure 3 is a graph showing the relationship between the depth of indentation and the hardness of the surface of the film with respect to No. 2, shown in Table 1 of the examples; and Figure 4 is a graph showing the relationship between the depth of indentation and the modulus of elasticity of the surface of the film with respect to No. 2, shown in Table 1 of the examples.
    DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
    In order to improve the cutting wire abrasion resistance used for sawing a workpiece by a sawing machine while blowing abrasive grains, the inventors have conducted extensive investigations. As a result, with regard to the saw wire containing an organic film or an inorganic film coated on the surface of a base wire, it was discovered that the volume of the wear could be reduced if the balance between the elastic modulus and the hardness of the surface of the sawing wire was effectively controlled to ensure that the ratio of the elastic modulus to the hardness (plasticity index) remains in the range of 6-25. Thus the invention was completed. Furthermore, it became clear that if the hardness of the surface of the saw wire was maintained in the range of 0.01-1 GPa and in particular if the plasticity index of the surface of the saw wire remained within the aforementioned range, the surface of the workpiece could be softened after sawing and a workpiece with excellent surface accuracy could be obtained.
    First, it will now be described how the invention was completed.
    The most important cause of the wear of the sawing wire used for sawing the workpiece when blowing abrasive grains is abrasive wear. Abrasive wear is a phenomenon in which individual abrasive grains bite into the interface of the saw wire and the workpiece and thereby cause the saw wire to peel off causing the wear. It is thought that to cure the abrasive wear, surface hardening is effective. In the inventors' investigations, however, it was discovered that if the surface of the saw wire was hardened excessively, the surface would flake off and the abrasive wear increased on the contrary. In these circumstances, the inventors paid attention to the material of the surface of the saw wire, and discovered that the abrasive wear of the saw wire could be improved if, in addition to the hardness, the elastic modulus was checked.
    That is, a saw wire in accordance with an aspect of the invention is one containing an organic film or an inorganic film coated on a surface of a base wire (coated base wire) with a ratio of the elastic modulus to the hardness ( plasticity index) of a film surface equal to 6 - 25. By bringing the plasticity index to 6 - 25, the balance between the elastic modulus and the hardness of the film becomes excellent. When this equilibrium is excellent, and even when a stress is applied and an elongation occurs during sawing, the deformation of the coated saw wire remains in elastic deformation and virtually no plastic deformation occurs. This way the accuracy of the cutting surface also becomes excellent. When the plasticity index is excessively low, the hardness becomes too large for the elastic modulus. Consequently, when stress is applied, brittle fracture occurs in the coated saw wire, and a portion of the surface of the coated saw wire peels off which increases the volume of the wear away. If peeling occurs on the surface of the coated saw wire, the surface also becomes rough and the accuracy of the saw surface of the workpiece deteriorates. Consequently, the plasticity index is brought to 6 or more, preferably to 9 or more, even more preferably to 10 or more. However, when the plasticity index is excessively high, the modulus of elasticity becomes excessively high for the modulus of elasticity.
    Therefore, when tension is applied, the coated saw wire is plastically deformed and wears off easily. Accordingly, the plasticity index is brought to 25 or less, preferably to 23 or less, even more preferably to 20 or less.
    The hardness of the surface of the coated saw wire film is preferably 0.1-1 GPa. If the surface of the film of the coated saw wire is excessively hard, a run-out easily occurs during sawing, no accurate sawing is possible, and the accuracy of the sawing surface threatens to deteriorate. Therefore, the hardness of the surface of the coated saw wire film is brought to, for example, 1 GPa or less, preferably 0.9 GPa or less, more preferably 0.6 GPa or less. From the point of view of improving the accuracy of the saw surface of the work piece, it is recommended to keep the surface of the film of the coated saw wire as low as possible. However, if the surface of the coated saw wire film becomes excessively soft, the wear resistance of the coated saw wire tends to deteriorate. Furthermore, if the coated saw wire is worn, the surface characteristics of the coated saw wire deteriorate and unevenness is formed on the surface. This also leads to the formation of unevenness on the saw surface of the workpiece and the deterioration of the accuracy of the saw surface of the workpiece. Furthermore, when the surface of the coated saw wire film becomes excessively soft, the strength of the wire also decreases. Then the speed of the wire when cutting cannot be increased and the productivity decreases. Accordingly, the hardness of the surface of the coated saw wire film is increased to, for example, 0.1 GPa or more, preferably 0.15 GPa or more, more preferably 0.2 GPa or more.
    The modulus of elasticity in the surface of the film of the coated saw wire is not particularly limited and can be adjusted so that the plasticity index becomes 6 to 25, in equilibrium with the hardness of the surface of the film. The modulus of elasticity in the surface of the film is, for example, 0.6 - 25 GPa, preferably 1 - 20 GPa, more preferably 2 - 15 GPa.
    In the invention, with a view to preventing the wear of the coated saw wire, attention is primarily focused on the characteristics of the surface layer of the coated saw wire. To be more precise, in a zone of 0.05 - 5.0 µm depth (especially in a zone of 0.05 - 1.5 µm depth) from the outer surface of the film, after the profiles in the depth direction of the elastic modulus and the hardness of the surface of the film were measured, the individual representative values are decided upon, and the plasticity index (and preferably also the hardness) determined on the basis of the representative values is checked in the zone described above . More specifically, the elastic modulus and the hardness are measured by a nano-indentation method. In accordance with the method of nano-indentation (hardness test for a very small part), the hardness and the modulus of elasticity of the material to be examined can be measured with less indentation due to an ultra-low indentation load, therefore the material at the bottom of the surface layer hardly exerts influence, and the characteristics and performance of the surface can be accurately determined.
    With regard to the modulus of elasticity and the hardness of the surface of the film, the measurement leads to a position where, if the surface of the film of the coated saw wire is measured several times, the measurement results do not differ much and stable results can be achieved, which can be used as a representative value. For example, the modulus of elasticity of the surface of the film tends to increase from the surface of the film of the coated saw wire toward the central axis. Consequently, the result measured near the surface of the film of the coated saw wire can be used as a representative value for the modulus of elasticity of the surface of the film. On the other hand, and with regard to the hardness of the surface of the film, the results become more varied the closer to the outer surface of the film is measured, which is different from the modulus of elasticity. Accordingly, the result measured on the center axis of the coated saw wire can be used as a representative value for the hardness of the surface of the film. By way of example, in the examples described below, profiles of the hardness of the surface of the film as shown in Figures 1 and 3 and profiles of the elastic modulus of the surface of the film as shown in Figures 2 and 4 were measured. The hardness measured in the range of 400 - 450 nm became "the hardness of the surface of the film of the coated saw wire" and the elastic modulus measured in the range of 60 -90 nm indentation depth became the "elastic modulus of the surface of the film of the coated saw wire ”.
    That is, Figures 1 and 3 show the measurement results of the hardness profiles in the surface of the coated saw wire film in the profiles described below. As is apparent from these drawings, it is known that the hardness measurements of the surface of the film vary in the range of the outer surface of the film to 150 nm indentation depth, while they hardly vary in the range of 400 - 450 nm indentation depth, and there is only a small measurement error. On the other hand, Figures 2 and 4 show the measurement results of the modulus of elasticity in the surface of the coated saw wire film. As can be seen from these drawings, the measurement results of the modulus of elasticity of the surface of the film do not vary very much in the vicinity of the surface of the film, although it is recognized that the modulus of elasticity tends to increase as the indentation depth increases in a range of 200 nm or more indentation depth. Also when the modulus of elasticity and the hardness of the surface of the film are measured in the outer surface of the film, the results vary widely with each measurement and a reliable result cannot be obtained. Therefore, it must be avoided to measure in the outer surface.
    The elastic modulus and the hardness of the surface of the film are calculated by measuring in at least 15 places and calculating the average of those measurement results. If an abnormal value occurs in the measurement results (for example, a value greater than 3 times or less than 1/3 of the average), that value is rejected and an additional measurement is carried out in order to be able to calculate the average of the measurement results from at least 15 places. The result thereof is that in the method of nano-indentation the hardness and the modulus of elasticity are measured in an extremely small zone and therefore hardly any measurement errors occur.
    For the base wire that forms the film, a wire of titanium, copper, steel, and the like can be used.
    With regard to a steel wire, for example, a wire made of stainless steel or high carbon steel and the like can be used. As for a stainless steel wire, a wire made from austenite-based stainless steel such as SUS301, SUS304, SUS310, SUS316, SUS321, SUS341, a ferrite-stainless steel wire such as SUS405, SUS430, a wire of a martensite stainless steel such as SUS403, SUS410, a stainless steel duplex wire (austenite and ferrite stainless steel) such as SUS329J1, a stainless precipitation hardened steel wire such as SUS630 and the like. With regard to a wire of high-carbon steel, for example, a wire of steel with a carbon content of 0.5 to 1.2% can be used. With regard to this high-carbon steel wire, for example, a steel wire as described in JIS G3502 can be used.
    According to an aspect of the invention, it is recommended to use a base wire with a hardness of 3 GPa or more when measured by the method of nano-indentation. Because the tensile strength of fully coated saw wire can be increased by bringing the hardness of the base wire to 3 GPa or more, the breaking of the wire does not occur even when the speed of the wire is increased when sawing the workpiece. This way, productivity can be increased.
    As for the organic film being coated on the surface of the base wire, a synthetic resin whose plasticity index is adjusted to be 6 to 25 is selected from thermosetting and thermoplastic resins. Of such synthetic resins, a phenolic resin, amide-based resin, epoxy resin, polyurethane, formal, ABS resin, vinyl chloride, imide-based resin, polyester, and the like can be used. The plasticity index can be adjusted by checking the degree of polymerization in the case of a thermoplastic resin and the density of cross-links in the case of a thermosetting resin. The plasticity index can also be adjusted by copolymerizing more than two different types of monomers and by the addition of an additive (for example, a plasticizer such as a phosphorus ester, a thermal stabilizer such as metal soap and the like).
    The organic film can be formed by coating the surface of the base wire with a varnish sold on the market and then heating. By appropriately adjusting the hardness of the organic film, the plasticity index and the elastic modulus can be checked. The hardness of the organic film can be adjusted based on the varnish used and the applied temperature.
    As for the varnish, an enamel wire varnish sold on the market by Totoku Toryo Co., Ltd, or an electric copper wire (enameled wire) varnish sold on the market by Kyocera Chemical Corporation, may be used.
    As regards the varnish for enamelled wire, one of the following can be used as an example: polyurethane varnish: “TPU F1”, “TPU F2-NC”, “TPU F2-NCA”, “TPU 6200”, “TPU 5100” , "TPU 5200", "TPU 5100", "TPU K5 132", "TPU 3000K", "TPU 3000EA" and the like; products from Totoku Toryo Co., Ltd.
    Polyester varnish: "LITON 21005", "LITON 21002", "LITON 3100F", "LITON 3200BF", "LITON 3300", "LITON 3300KF", "LITON 3500SLD", "Neoheat 8200K2" and the like; products from Totoku Toryo Co., Ltd. Polyester imide varnish: "Neoheat 8600A", "Neoheat 8600AY", "Neoheat 8600", "Neoheat 8600H3", "Neoheat 8625", "Neoheat 8600E2", and the like; products from Totoku Toryo Co., Ltd.
    With regard to the varnish for electrical copper wire (enameled wire), for example, a varnish for heat-resistant urethane copper wire (an epoxy-modified resin such as "TVE5160-27", a varnish for formal copper wire (polyvinyl formal resin such as "TVE5225A", a varnish for heat-resistant formal copper wire (an epoxy-modified formal resin such as "TVE5230-27", a varnish for a polyester copper wire (a polyester resin such as the "TVE5350 series" and the like are used (all products mentioned are products of Kyocera Chemical Corporation).
    For the inorganic film coated on the surface of the base wire, for example, film whose plasticity index of the surface of the film is adjusted to be 6 to 25 can be selected from an SiO 2 film, glass (soda glass) film, CrN film and the like The SiO 2 film can be formed by coating the surface of the base wire with a solution containing SiO 2 and then drying. If the temperature is further raised and the wire is sintered, a dense film can also be formed. The glass film can be formed by coating the surface of the base wire with a mixture of glass powder and a solvent and then drying. The CrN film can be formed by the arc ion plating (AIP) of the surface of the ··. * ·· · base wire in a nitrogen atmosphere using Cr target material with an AlP device.
    The thickness of the film is preferably brought to 0.05 -15 µm. When the film is excessively thin, the film wears out and disappears in the first phase of sawing or peeling off the base wire so that the base wire itself is exposed, and the film's effect of increasing the wear resistance cannot be fully be obtained. Therefore, a film with a thickness of 0.05 µm or more, more preferably of 0.5 µm or more, and in particular of 2 µm or more is preferred. However, if the film becomes excessively thick, the percentage of film relative to the entire coated saw wire becomes excessively large and thereby reduces the strength of the entire coated saw wire. Consequently, the wire tends to break easily if the speed of the wire is increased in an effort to increase productivity. Therefore, a film with a thickness of 15 µm or less, more preferably of 13 µm or less, and in particular of 10 µm or less is preferred.
    The diameter of the entire coated saw wire is not particularly limited, but is generally around 100 - 300 µm (preferably 100 - 150 µm).
    The coated saw wire in accordance with another aspect of the invention is used to produce a sawn object by sawing a workpiece consisting, for example, of metal, ceramic, silicon, or having a semiconductor or magnetic component. is.
    Sawing by a sawing machine is performed while a solution containing abrasive grains is blown onto a contact surface between the coated sawing wire and the workpiece. The reason for this is that the abrasive grains contained in the blown solution are drawn between the workpiece and the sawing wire and the wear of the workpiece is thereby promoted.
    For the solution-containing abrasive grains, a product can be chosen that is known on the market. With regard to the abrasive grains, silicon carbide powder (Sic powder), diamond powder and the like can be used, for example.
    Examples
    Although an aspect of the invention will be explained below with specific reference to the examples, the invention is not in itself limited by the following examples and may, of course, be implemented with modifications made appropriately within the scope of application, adaptable to the above and below described objectives, and each of these modifications must be added to the technical scope of the invention.
    A monocrystalline silicon was sawn by means of a coated saw wire while blowing abrasive grains, the volume of abrasion was measured before and after sawing, and the wear resistance of the saw wire was evaluated. The surface roughness of the saw surface of the single crystal silicon was also measured and the accuracy of the saw surface was evaluated. In addition, the line speed of the sawing wire during sawing was changed and productivity was evaluated.
    The base wire of the material shown in Table 1 below was coated with the film of the material shown in Table 1 below with the thickness shown in Table 1 below and the coated saw wire with a diameter of 140 µm (incl. The film) was produced.
    <Basic thread>
    In Nos. 1 - 4, 13, 14 the following basic wire was used: a steel wire (type A) containing 0.72 mass percent C, 0.21 mass percent Si, 0.52 mass percent Mn with the equilibrium iron and unavoidable impurities as stipulated in JIS G3502 and drawn to the specified diameter of the wire.
    In Nos. 5 - 9 the basic wire used was: a steel wire (type A) as stipulated in JIS G3522 containing 0.82 weight percent C, 0.19 weight percent Si, 0.49 weight percent Mn with the equilibrium iron and unavoidable impurities as stipulated in JIS G3522 and drawn to the specified diameter of the wire.
    In Nos. 10 and 11 the following basic thread was used: pure copper and pure titanium, drawn to the prescribed diameter.
    In No. 12 the basic wire used was: a wire from stainless steel for a spring (SUS304) as stipulated in JIS G4314 and drawn to the prescribed diameter of the wire <Film>
    The procedure for forming the organic film (Nos. 1 - 4, 10-14) is the following.
    In Nos. 1, 10 - 12, a varnish for a polyurethane wire as stipulated in JIS C2351 "W143" (varnish for an enamelled wire "TPUF1" (trade name) was produced by Totoku Toryo Co., Ltd .; coated film composition after baking is polyurethane ) used.
    In Nos. 2 - 4 a varnish for a polyester thread as stipulated in JIS C2351 "W141" (varnish for an enamelled thread "LITON 21005" (trade name) was produced by Totoku Toryo Co., Ltd .; coated film composition after baking is on telephonic acid based polyester).
    In No. 13, a varnish for a polyesterimide wire as stipulated in JIS C2351 "W141" (varnish for an enameled wire "Neoheat 8600" (trade name) produced by Totoku Toryo Co., Ltd .; coated film composition after polyester is polyesterimide) was used.
    In No. 14, a varnish for a formal wire as stipulated in JIS C2351 "W142" (varnish for an enamelled wire "TVE5225A" (trade name) produced by Totoku Toryo Co., Ltd .; polyvinyl formal coated film composition) was used.
    The surface of the base wire was coated with the varnish, the temperature and the time of heating were properly controlled, and the film whose elasticity modulus and hardness (or plasticity index) were adjusted was formed. More specifically, prior to film formation, the base wire was subjected to a degreasing treatment, then coated with the varnish in 4 - 10 coating cycles, then a volatile component was solubilized at 250 - 270 ° C for curing, and the coated sawing wire was produced.
    The procedure for forming the inorganic film (Nos. 5-9) is the following.
    In No. 5, the CrN film was formed on the surface of the base wire by the arc ion plating (AIP) in a nitrogen atmosphere using Cr target material.
    In No. 6, the glass film was formed by coating the surface of the base wire with a mixture of glass powder and a solvent and then drying.
    In No. 7, SiO 2 film was formed by coating the surface of the base wire with a solvent-containing silicon powder and then drying.
    In No. 8, the copper galvanization film was formed by electroplating a galvanization layer with a composition in components of 63 mass percent CU, 37 mass percent Zn on the surface of the base wire.
    In No. 9, the epoxy film containing silicon was formed by coating the surface of the base wire with a mixture in which silicon with an average diameter of the particles of 3 µm was added to 10 mass percent at an epoxy resin (100 mass percent).
    On the produced coated saw wire, the modulus of elasticity and the hardness were measured by the nano-indentation method. The specific measurement conditions were as follows.
    <Measurement conditions>
    Measuring device: "Nano Indenter XP / DCM" made by Agilent Technologies Ine. Analysis software: "Test Works 4" made by Agilent Technologies Ine.
    Tip: XP
    Measurement method: continuous stiffness measurement (CSM .continuous stiffness measurement)
    Excitation / vibration frequency: 45 Hz Excitation / vibration amplitude: 2 nm Stretch speed: 0.05 Is Indentation depth: up to 500 nm Measurement points: 15 points Measurement point interval: 30 μη
    Measuring environment: at 23 ° C room temperature, controlled by air conditioning Standard sample: molten silica
    Also, with regard to the modulus of elasticity of the surface of the film, the results in the range of 60 - 90 nm indentation depth of the outer surface of the film were used, while with regard to the hardness of the surface of the film, the results in the range of 400 - 450 nm indentation depth from the outer surface of the film were used. Measurement was performed at 15 points. Any abnormal value in the measurement results of these 15 points was removed, the measurement repeated, and the elastic modulus and the hardness of the surface were calculated as the average of the results of the 15 points. The modulus of elasticity and the hardness of the surface are shown in Table 1 below. The ratio of the modulus of elasticity to the hardness (modulus of elasticity / hardness; plasticity index) was also calculated and is also shown in Table 1 below. The hardness of the base wire, measured in similar conditions, is also shown in Table 1 below.
    Furthermore, the tensile strength (TS) of the coated saw wire that was produced was measured in a tensile test. The measurement results are shown in Table 1 below.
    The monocrystalline silicon was then sawn using the coated saw wire. Sawing was performed while a slurry with diamond abrasive grains with an average grain size of 5.6 µm was suspended in an aqueous solution based on ethylene glycol between the coated saw wire and the monocrystalline silicon. The abrasive grain content (diamond) was brought to 5% by mass. The coated saw wire speed was set at 100 - 500 m / min, the new line feed was set at 5 m / min, and the coated saw wire tension was set at 15 N.
    The sawing was performed under the conditions described above, the coated saw wire was removed from the sawing machine when the total sawing time reached 7 hours, the wire diameter of the coated saw wire was measured, and the wear resistance of the saw wire was evaluated in accordance with the criteria described below based on the calculated difference in wire diameter before and after cutting. The evaluation results are shown in Table 1 below. Also, the wire speed of the coated saw wire during sawing was brought to 500 m / min in Nos. 1 - 3, 5 - 8, 12 - 14. With regard to Nos. 4, 9 - 11, the cutting was performed at low speed ( 100 - 300 m / min) and individual tests were performed at high speed (500 m / min) as Nos. 4a, 9a - 11a.
    <Abrasion resistance> 3 points (accepted): the wire diameter is reduced by less than 3 µm.
    2 points (accepted): the wire diameter is reduced by less than 3 - 5 pm.
    1 point (refused): the wire diameter has been reduced by more than 3 µm.
    Furthermore, the surface roughness of the monocrystalline silicon was measured after 7 hours and the accuracy of the saw surface was evaluated. Surface accuracy was evaluated in accordance with the criteria described below based on the measurement results of the average roughness Rz of ten points as stipulated in JIS 80601 (Appendix 1, 2001). The evaluation results are shown in Table 1 below.
    <Accuracy of the surface> 3 points (accepted): Rz is 3 µm or less.
    2 points (accepted): Rz is greater than 3 pm and is less than or equal to 6 pm.
    1 point (refused): Rz is greater than 6 pm.
    For No. 1, shown in Table 1, a graph indicating the relationship between the indentation depth and the hardness of the surface of the film is shown in Figure 1. Also, a graph indicating the relationship between the penetration depth and the elastic modulus of the surface of the film shown in Figure 1. Regarding No. 2, shown in Table 1, a graph indicating the relationship between the depth of identification and the hardness of the surface of the film is shown in Figure 3. Also, a graph showing the relationship between the penetration depth and the modulus of elasticity of the surface of the film shown in Figure 4.
    As is apparent from Figs. 1 and 3, it is known that in the range of an indentation depth of 400 - 450 nm of the outer surface of the film, the measurement results of the hardness of the surface of the film do not vary greatly. As is apparent from Figures 2 and 4, it is known that in the range of an indentation depth of 60 - 90 nm of the surface of the film, the measurement results of the elastic modulus of the surface of the film do not vary greatly. It is also recognized that the modulus of elasticity tends to increase closer to the base wire (to be more precise; in the range of 200 nm or more in indentation depth), under the influence of the base wire.
    The following study can then be conducted in accordance with Table 1.
    The coated saw wires No. 1, 2, 4 - 7, 10 - 14 are the examples that satisfy the requirements of an aspect of the invention.
    In particular, the coated saw wires No. 1, 2, 7, 12-14 are excellent in the area of wear resistance because the plasticity index has been adjusted in a weighted manner. Furthermore, since the hardness of the surface was also adjusted in a waxed manner, the sawing surface of the monocrystalline silicon sawn through the coated saw wire is excellent in terms of accuracy. Furthermore, since the hardness of the base wire was also adjusted in a washed manner, there are no breaks in the wire even when the speed of the wire is increased to 500 m / min. This can increase productivity.
    The coated saw wire No. 4 is excellent in terms of wear resistance because the plasticity index has been adjusted in a weighted manner. Furthermore, since the hardness of the surface was also adjusted in a waxed manner, the sawing surface of the monocrystalline silicon sawn through the coated saw wire is excellent in terms of accuracy. Although there was no problem with a low wire speed of 100 m / min, after the wire speed was increased to 500 m / min, a break of the wire as shown in No. 4a occurred because the film was excessively thick. The productivity could therefore not be increased.
    The coated saw wires Nos. 5 and 6 are excellent in terms of wear resistance because the plasticity index has been adjusted in a washed manner. However, since the hardness of the surface was not adjusted in a washed manner, the saw surface of the monocrystalline silicon sawn through the coated saw wire is inferior.
    The coated saw wires No. 10 and 11 are excellent in terms of wear resistance because the plasticity index has been adjusted in a weighted manner. Furthermore, since the hardness of the surface was also adjusted in a waxed manner, the sawing surface of the monocrystalline silicon sawn through the coated saw wire is excellent in accuracy. Although there was no problem with a low wire speed of 200 m / min or 300 m / min, after the wire speed was increased to 500 m / min a break of the wire as shown in Nos. 10a, 11a occurred because the hardness was not adjusted in a normal way. The productivity could therefore not be increased.
    On the other hand, Nos. 8 and 9 are the samples that do not meet the requirements set in an aspect of the invention in which the plasticity index was not adjusted in a weighted manner. As a result, the wear resistance is inferior. Particularly in the coated saw wire No. 9a, a break occurred when the wire speed was raised to 500 m / min.
    Furthermore, sawing wire No. 3 was a reference steel whose film coated on the surface of the base wire was excessively thin, so that the effect of coating with a film could not be fully achieved.
    权利要求:
    Claims (7)
    [1]
    A coated saw wire containing an organic film coated on a surface of a base wire, wherein a ratio of the elasticity modulus (GPa) of a surface of the film to the hardness (GPa) of the surface of the film (elasticity modulus / hardness) ) is 6 to 25 if measured by a nano-indentation method.
    [2]
    The coated saw wire according to claim 1, wherein the hardness of the surface of the film is from 0.1 to 1 GPa.
    [3]
    The coated saw wire according to claim 1, wherein the film thickness of the organic film or the inorganic film is 0.05 - 15 µm.
    [4]
    The coated saw wire according to claim 1, wherein a wire with a hardness of 3 GPa or more is used as the base wire when measured by a nano-indentation method.
    [5]
    The coated saw wire according to claim 2, wherein the film thickness of the organic film or inorganic film is 0.05 - 15 µm.
    [6]
    The coated saw wire according to claim 2, wherein a wire with a hardness of 3 GPa or more is used as the base wire when measured by a nano-indentation method.
    [7]
    A method for producing a saw body comprising sawing the workpiece through the coated saw wire according to any of claims 1 to 6 while abrasive grains are blown onto the contact surface between the saw wire and the work piece.
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    JP2009126471|2009-05-26|
    JP2009126471|2009-05-26|
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