专利摘要:
An earpiece including an external surface having a first fixed configuration disposable within the outer ear and having a passage adapted for retention of an in ear device, the earpiece heatable to achieve a moldable condition which allows reconfiguration of the external surface by engagement with the outer ear to dispose the external surface in a second fixed configuration in greater conformity to the outer ear.
公开号:AU2013216867A1
申请号:U2013216867
申请日:2013-02-08
公开日:2014-08-21
发明作者:Kyle J. Kirkpatrick
申请人:Decibullz LLC;
IPC主号:H04R1-10
专利说明:
WO 2013/119913 PCT/US2013/025288 MOLDABLE EARPIECE SYSTEM This International Patent Cooperation Treaty Patent Application is a continuation of United States Patent Application No. 13/761,947, filed February 7, 2013, and claims the benefit of United States Provisional Patent Application No. 61/596,567, filed February 8, 5 2012, each hereby incorporated by reference herein I. TECHNICAL FIELD An earpiece including an external surface having a first fixed configuration disposable within the outer ear and having a passage adapted for retention of an in ear device, the earpiece heatable to achieve a moldable condition which allows reconfiguration of the external 10 surface by engagement with the outer ear to dispose the external surface in a second fixed configuration in greater conformity to the outer ear. II. BACKGROUND A wide variety of apparatus which deliver sound to the ear such as medical equipment, headsets, hearing aids, cellular telephones, and the like include in part in ear devices such as 15 earphones, earplugs, earbuds, ear tips, ear tubes, or the like which are not configured to the outer ear of the individual wearer. Because conventional in ear devices are not configured to the individual wearer's outer ear, the in ear device may not stay in fixed engagement with the outer ear, or the in ear device may not align with the outer portion of the ear canal, or the in ear device may be 20 uncomfortable for the wearer to insert into or retain in the outer ear. The instant invention provides a moldable earpiece which retains conventional in ear devices to overcome in whole or in part certain of the forgoing disadvantages associated with conventional in ear devices. III. DISCLOSURE OF INVENTION 25 Accordingly, a broad object of the invention can be to provide a moldable earpiece which includes an external surface disposed in a first fixed configuration disposable within the outer ear of an ear of a wearer and having a passage adapted for retention of an in ear device which upon heating to a moldable condition allows reconfiguration of the external surface by engagement with the outer ear of a wearer and upon cooling disposes the external surface of WO 2013/119913 PCT/US2013/025288 the earpiece in a second fixed configuration which retains the in ear device and has greater conformity with the outer ear of the wearer. Another broad object of the invention can be to provide a method of making a moldable earpiece for retention of an in ear device which includes forming an earpiece to 5 dispose the external surface in a first fixed configuration disposable within the outer ear of an ear and further including a passage adapted for retention of an in ear device capable upon heating of achieving a moldable condition which allows reconfiguration of the external surface of the earpiece by engagement with an outer ear of an ear and upon cooling disposes the external surface in a second fixed configuration having greater conformity with the outer ear. 10 Another broad object of the invention can be to provide a kit for production of an earpiece which retains an in ear device and which has greater conformity with the wearer's outer ear, the kit including a moldable earpiece having a passage adapted for retention of the in ear device which upon heating to a moldable condition allows reconfiguration of the external surface by engagement with the wearer's outer ear and upon cooling disposes the external 15 surface in a second fixed configuration having greater conformity to the wearer's outer ear and which retains the in ear device. Another broad object of the invention can be to provide a method of molding an earpiece which retains an in ear device by obtaining an moldable earpiece having an external surface disposed in a first fixed configuration disposable within the outer ear of an ear and 20 having a passage adapted for releasable retention of the in ear device and which by heating the earpiece to achieve a moldable condition allows reconfiguration of the external surface by engagement with said outer ear of said ear and by cooling the earpiece while engaged with the outer ear disposes the external surface in a second fixed configuration having greater conformity with the outer ear. 25 Naturally, further objects of the invention are disclosed throughout other areas of the specification, drawings, photographs, and claims. IV. A BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is side perspective view which illustrates a step of a particular method of using an embodiment of the inventive earpiece in a first fixed configuration with a particular 30 in ear device in the form of an ear speaker. 2 WO 2013/119913 PCT/US2013/025288 Figure 2 is front perspective view which illustrates a step of a particular method of using an embodiment of the inventive earpiece in a first fixed configuration with the particular in ear device shown in Figure 1. Figure 3 is a front view which illustrates a step of a method of using an embodiment of 5 the inventive earpiece in a second fixed configuration engaged to the particular in ear device shown in Figure 1. Figure 4 is a top perspective view which illustrates a step of a method of using an embodiment of the inventive earpiece with a particular in ear device which is part of an apparatus which resides outside the ear in the form of a hands free head set. 10 Figure 5 is a top view which illustrates a step of a method of using an embodiment of the inventive earpiece in a first fixed configuration engaged to the particular in ear device shown in Figure 4. Figure 6 is a front view which illustrates a step of a method of using an embodiment of the inventive earpiece in a second fixed configuration engaged to the particular in ear device 15 shown in Figure 4. Figure 7 is a cross section 7-7 of the particular earpiece shown in Figure 2. Figure 8 is cross section 8-8 having the particular earpiece shown in Figures 2 and 7 engaged with the in ear device shown in Figure 7. Figure 9 is an exploded perspective side view of a particular embodiment of the 20 inventive earpiece in a first fixed configuration having a passage and into which a conduit removably inserts to provide an internal surface configured to retain an in ear device. Figure 10 is a top view of a particular embodiment of the inventive earpiece in a first fixed configuration. Figure II is a bottom view of a particular embodiment of the inventive earpiece in a 25 first fixed configuration. Figure 12 is a front view of a particular embodiment of the inventive earpiece in a first fixed configuration. 3 WO 2013/119913 PCT/US2013/025288 Figure 13 is a back view of a particular embodiment of the inventive earpiece in a first fixed configuration. Figure 14 is a first side view of a particular embodiment of the inventive earpiece in a first fixed configuration. 5 Figure 15 is a second side view of a particular embodiment of the inventive earpiece in a first fixed configuration. Figure 16 is cross section view 16-16 as shown in Figure 9. Figure 17 is a cross section view 17-17 as shown in Figure 12. Figure 18 is front view of the embodiment of the earpiece shown in Figures 10 through 10 15 in a second fixed configuration engaged within the outer ear and retaining a particular embodiment of an in ear device. Figure 19 is a front perspective view of a particular embodiment of the earpiece in a first fixed configuration having a conduit which extends outwardly to couple to an speaker tube of an apparatus worn outside the ear in the form of a hearing aid. 15 Figure 20 is a front view of the embodiment of the earpiece in a second fixed configuration engaged within the outer ear and retaining the speaker tube shown in Figure 19 of the hearing aid worn outside the ear. Figure 21 is a front perspective view of an embodiment of the earpiece in a first fixed configuration adapted to retain a particular embodiment of an in ear device in the form of an in 20 ear hearing aid. Figure 22 is a front view of the embodiment of the earpiece shown in Figure 21 in a second fixed configuration engaged within the outer ear and retaining the in ear hearing aid as shown in Figure 21. Figure 23 is a cross section view of the ear which shows an embodiment of the 25 earpiece in a second fixed configuration adapted to retain a particular embodiment of an in ear device in the form of an in ear canal hearing aid. Figure 24 is a block flow diagram of a method of providing a kit for an embodiment of a moldable earpiece system. 4 WO 2013/119913 PCT/US2013/025288 Figure 25 is a block flow diagram of a method of sculpting an embodiment of a moldable earpiece. V. MODE(S) FOR CARRYING OUT THE INVENTION Generally referring to Figures 1 through 8, which illustrate a generic embodiment of an 5 inventive moldable earpiece (1)(also referred to as an "earpiece") having an external surface (2) disposed in a first fixed configuration (3) disposable within the outer ear (4) of an ear (5). The earpiece (1) having a passage (6) which communicates between a first location (7) and a second location (8) on the external surface (2) of the earpiece (1) and adapted for retention or releasable retention of an in ear device (9) in the earpiece (1). The earpiece (1) can be heated 10 to achieve a moldable condition (10) which allows reconfiguration of the external surface (2) by engagement within the outer ear (4) and can be cooled while engaged with the outer ear (4) to dispose the external surface (2) in a second fixed configuration (11) conformed more closely to the configuration of the outer ear (4). As to particular embodiments, the earpiece (1) can be provided separate from but capable of use with one or more of a wide variety of in ear 15 devices (9), for example: earphones, earplugs, earbuds, ear tips, ear tubes, ear speakers, and in ear hearing aids, or the like. As to particular embodiments, the in ear devices (9) can be a part of an apparatus (57) worn or which resides outside of the ear (5), for example: headsets, head phones, telephones, blue tooth headphones, wireless headphones, hearing aids, medical apparatus, or the like. As to other embodiments, the earpiece (1) and the in ear device (9) can 20 be provided in combination as part of a moldable earpiece system (12) or the earpiece (1) can be provided as part of a kit (13) which can be used by a wearer (14) for production of an earpiece (1) having greater conformity with the wearer's (14) outer ear (4) for retention or releasable retention of an in ear device (9). Embodiments of the moldable earpiece (1) having an external surface (2) disposed in 25 the first fixed configuration (3) can be formed from an amount of moldable material (15). The term "moldable material" means for the purpose of this invention any material which retains a fixed configuration disposable within the outer ear (also referred to as the "first fixed configuration" (3)) at temperatures below about 40'C (110"F) and achieves a moldable condition (10) in a temperature range of about 40'C (about 1 10 F) and about 65'C (150'F) 30 which allows the external surface (2) of the earpiece (1) to be reconfigured by engagement with the outer ear (4) and allows the passage (6) to be reconfigured by engagement with an in ear device (9) with the material remaining moldable at temperatures sufficiently low to avoid injury to the outer ear (4) or damage to the in ear device (9) and which cures at ambient 5 WO 2013/119913 PCT/US2013/025288 temperature or while engaged with the outer ear (4) to retain a fixed configuration conformed more closely to the configuration of the outer ear (4) (also referred to as the "second fixed configuration"( 11)). The amount of moldable material (15) can be one or more of, combinations of, or 5 admixtures of one or more thermoplastic polymers suitable for use with the invention, such as: polyethylene, polypropylene, polyvinyl chloride (PVC), polystyrene, polyester, polycaprolactone, polytetrafluoroethylene, acrylonitrile butadiene styrene, or the like. As one illustrative example, embodiments of the earpiece (1) can be formed from an amount of polycaprolactone polymer (CAS No.: 24989-41-4); however, other thermoplastic 10 polymers suitable for use with embodiments of the invention can have physical properties as those described in Table 1 for polycaprolactone polymer, or similar physical properties which allow the material to be utilized in one or more of the embodiments of the earpiece (1). TABLE 1. Physical Properties of Polycaprolactone Thermoplastic Polymers 15 Physical Property ASTM Test Molecular Weight Mn GPC, THF, 25-C 37,000±2000; 47500 ± 2000; 69000 ± 1500 Mw GPC, THF, 25-C 84500 ±1000; 120000 ±2000 20 Mz GPC, THF, 25-C 130000 ±5000; 178500 Polydispersity (Mw/Mn) 1.78 1.74 Melt Flow Index D 1238 80'C, 2.16kg, g/10 min 2.36 0.59 25 80'C, 21.6kg, g/10 min 34.6 9.56 190'C, 2.16kg, g/10 min 28 7.29 Thermal Analysis (DSC) Melting Point 'C 60-62 60-62 30 Heat Of Fusion, DHm, J/g 76.9 76.6 Crystallinity, % 56 56 Crystallisation Temperature, 'C 25.2 27.4 Glass Transition Temperature, Tg , 0 C -60 -60 35 Tensile Properties Yield Stress, s y, Mpa D 412-87 100mm/min 17.5 16 500mm/min 17.2 14 Modulus , E. Mpa D 412-87 40 1mm/min 470 440 10mm/min 430 500 Draw Stress ,s d, MPa D 412-87 1 00mrn/min 12.6 11.9 6 WO 2013/119913 PCT/US2013/025288 500mm/min 11.5 11 Draw Ratio, 1 d, x D 412-87 1 00mm/min >4.2 4 Stress At Break ,s b, Mpa D 412-87 5 100mm/min 29 54 Strain At Break, e b, % 100mm/min D 412-87 >700 920 Flexural Modulus, E , MPa 2mm/min D 790 411 nd 10 Hardness D 2240 Shore A 95 94 Shore D 51 50 15 Viscosity Pa. sec, 70'C ,10 1/sec 2890 12650 Pa. sec, 100 C ,10 1/sec 1353 5780 Pa. sec, 150C ,10 1/sec 443 1925 20 As to the illustrative example, polycaprolactone polymers provide a biodegradable polyester with a range of molecular weights in the range of 37,000 and 80,000 each having a melting point of about 60'C useful in making and using embodiments of the earpiece (1). Polycaprolactone polymers impart good water, oil, solvent, and chlorine resistance. Polycaprolactone polymers are also compatible with wide range of other materials 25 (collectively referred to as "admixed agents" (38)), such as: starch to impart greater biodegradability; colorants, such as alcohol dyes or acrylic coloring agents; powders such as acrylic powder; particulates of plastic, copolymer plastics, metal, bismuth oxychloride, or glitter; or the like, either separately or in various combinations. Polycaprolactone polymers are non-toxic and approved by the United States Food and Drug Administration for specific 30 applications in the human body. The term "outer ear" for the purposes of this invention includes the visible part of the ear that resides outside of the head (16) (also referred as the "auricle") which in part includes the outer ear bowl (17) and the outer portion of the open ear canal (18) (also referred to herein as the "concha") having skin that moves with that of the outer ear bowl (1 7)(as shown in the 35 example of Figure 2). The term "ear canal" for the purposes of this invention includes that part of the ear canal (58) from the outer portion of the open ear canal (18) to the location at which in ear canal hearing aids (59) are conventionally worn. 7 WO 2013/119913 PCT/US2013/025288 Now referring primarily to Figures 1 through 18, particular embodiments of the earpiece (1) can be formed from an amount of moldable material (15) to provide an external surface (2) disposed in a first fixed configuration (3) disposable in the outer ear (4). The first fixed configuration (3) can provide a first portion (19) of the external surface (2) configured to 5 allow or facilitate engagement with a part of the outer ear (4). As illustrative examples, embodiments can have the first portion (19) of the external surface (2) configured generally as a hemisphere (as shown in the examples of Figures 1, 2, 4 and 5) or configured generally in droplet shape or comma shape (as shown in the example of Figure 10 through 15) or configured as a truncated cone (as shown in the examples of Figures 19 and 21); however, as 10 to other embodiments, the first portion (19) of the external surface (2) can be configured in any other configuration which facilitates engagement of the earpiece (1) in the first fixed configuration (3) with a part of the outer ear (4), the outer ear bowl (17), or the outer portion of the ear canal (18). The remaining second portion (20) of the external surface (2) can be formed in the first 15 fixed configuration (3) to provide a generally flat surface (as shown in the examples of Figures 1, 2, 4, 5, 7, 8, 12, 19 and 21); although the second portion (20) of the external surface (2) in the first fixed configuration (3) can be configured in any form which allows the passage (6) adapted for retention or releasable retention of the in ear device (9) to communicate between a first location (7) and a second location (8) on said external surface (2) of said earpiece (1). 20 Now referring primarily to Figures 7, 8 and 17, the passage (6) which communicates between a first location (7) on the first portion (19) and a second location (8) on the second portion (20) of the external surface (2) and can be configured to receive the in ear device (9) at a location within the passage (6) to position a sound delivery element (21) proximate the first 25 location (7) of the external surface (2) of the earpiece (1) and position the body (22) of the in ear device (9) proximate the second location (8) of the external surface (2). The passage (6) can be configured in a wide variety of structural forms to receive a correspondingly wide variety of structural forms of the in ear device (9). As shown in the example of Figures 7 and 8, where the in ear device (9) has a generally cylindrical structure, the passage (6) can define a 30 corresponding generally cylindrical volume, or as further shown in the example of Figures 7 and 8 where the body (22) of the in ear device (9) has a greater diameter than the sound delivery element (21) the passage (6) can corresponding provide a first passage portion (23) of greater diameter than a second passage portion (24) for retention or releasable retention of the 8 WO 2013/119913 PCT/US2013/025288 in ear device (9) within the passage (6). The earpiece (1) can have an external surface (2) in the first fixed configuration (3) which engaged with the outer ear (4) substantially aligns the passage (6) with the ear canal (18). Now referring primarily to Figures 9 through 18, embodiments of the inventive 5 earpiece (1) can further include a conduit (25) which defines the passage (6) which communicates between the first location (7) and the second location (8) on said external surface (2) of the earpiece (1). The conduit (25) can have a conduit external surface (26) which engages the moldable material (15) of the earpiece (1) and a conduit internal surface (27) which defines a configuration of the passage (6) adapted for retention or releasable retention 10 of the in ear device (9) in the earpiece (1). The configuration of the conduit internal surface (27) of the conduit (25) can vary between embodiments to retain or releasably retain a wide variety of configurations of the in ear device (9). As to particular embodiments, the conduit (25) can take the form of an elastomer layer (28) formed integral with the amount of moldable material (15) to provide a one-piece conduit 15 earpiece (1)(as shown in the examples of Figures 10 through 11) with the elastomer layer (28) providing the conduit internal surface (27) defining the configuration of the passage (6)(as shown by the example shown in Figure 17). As to other particular embodiments, the conduit (25) can take the form of a flexible elastomer insert (29) which removably couples within the passage (6) the earpiece (1) with the 20 the flexible elastomer insert (29) providing the conduit internal surface (26) defining the configuration of the passage (6) to retain or releasable retain the in ear device (9) in the earpiece (1). A plurality of flexible elastomer inserts (28) each having substantially the same configuration of the conduit external surface (26) can provide a plurality of different configurations of the conduit internal surface (27) to retain or releasably retain a 25 corresponding plurality of different configurations of the in ear device (9) by interchanging the conduit (25) removably coupled within the passage (6) to provide in one earpiece (1) a plurality of different configurations of the conduit internal surface (27). Additionally, the conduit (25) can be provided with sufficient structural rigidity to maintain the configuration of the passage (6) for retention or releasable retention of the in ear 30 device (9) even in the moldable condition (10) of the earpiece (1). 9 WO 2013/119913 PCT/US2013/025288 Now referring primarily to Figures 19 and 20, particular embodiments of the conduit (25) can be configured to extend outwardly from the earpiece (1) to couple to a speaker tube (30) (also referred to as "hearing aid tube") of a hearing aid (31) worn outside of the ear (5) (or couple to a similar sound conveyance structure). The earpiece (1) can be configured as above 5 described to provide an external surface (2) formed in a first fixed configuration (3). The earpiece (1) can be heated to achieve the moldable condition (10) of the external surface (3) which can be engaged to the outer ear (4) and cooled to provide the second fixed configuration (11) of the earpiece (1) with the conduit (25) extending a sufficient distance outward of the second portion (20) of the external surface (3) to couple the speaker tube (30)(as shown in the 10 example of Figure 20). Now referring primarily to Figures 21 and 22, a similar embodiment of the earpiece (1) provide an external surface (2) formed in the first fixed configuration (3)(as shown in the example of Figure 21) having a passage (6) configured to retain or releasably retain an in ear device (9) in the form of an in ear hearing aid (31). The earpiece (1) can be heated to achieve 15 the moldable condition (10) of the external surface (2) which can be engaged to the outer ear (4) and cooled to provide the second fixed configuration (11) of the earpiece (1) with the passage (6), or the conduit (25) having a conduit internal surface (27) defining the configuration of the passage (6), which retains or releasably retains the in ear hearing aid (31)(as shown in the example of Figure 22). 20 Now referring primarily to Figure 23, particular embodiments of the invention having a first fixed configuration (3) similar to that shown in Figure 21 can be utilized to retain an in ear canal hearing aid (59) as above defined and as shown in Figure 23. The particular embodiments of the first fixed configuration (3) utilized with in ear canal hearing aids (59) further include an earpiece withdrawal element (60) which can be in the form of a stiff 25 member or a flexible cord depending upon the application. Now referring primarily to Figure 24, embodiments of the invention can provide a kit (13). The kit (13) can be produced by obtaining an amount of moldable material (15) (as shown in step (32)), having physical properties as or similar to those above described or useful in making or using embodiments of the invention as described, such as a polycaprolactone 30 polymer. The amount of moldable material (15) can be sufficiently heated (as shown in step (33)) to allow, if desired, admixing of one or more admixed agents (38) (as shown in step (34)) to alter one or more physical properties of the amount of moldable material (15) depending upon the application. The amount of moldable material (15) (whether or not, the amount of 10 WO 2013/119913 PCT/US2013/025288 moldable material (4) includes one or more admixed agents (38)) can be sufficiently heated in step (33) to allow molding of the earpiece (1) (whether in a mold (39) or otherwise formed)(as shown in step (35)) having an external surface (2) in the first fixed configuration (3) disposable within the outer ear (4) of an ear (5) and having a passage (6) which communicates 5 between a first location (7) and a second location (8) on the external surface (2) of the earpiece (1) for retention of an in ear device (9). For example, polycaprolactone polymers can be obtained (step 32) and heated to about 65'C (150"F)(step 33) to allow admixing with one or more admixed elements (6) (step 34) and molding an amount of the polycaprolactone polymers in a mold (39) (step 35) to produce the 10 earpiece (1) having an external surface in the first fixed configuration (3). The earpiece (3) can be cooled to room temperature (or below about 40 0 C (11 0"F) to maintain the configuration imparted by the mold (39). Production of the kit (13) can further include packaging of the earpiece (1) (as shown in step (36)) separate of any in ear device (9) or in combination with an in ear device (9). 15 Subsequent, distributing of the kit (13) (as shown in step (37)) allows a plurality of earpiece wearers (14) access to a plurality of earpieces (1) having an external surface (2) that can be reconfigured from a first fixed configuration (3) to a second fixed configuration (11) having greater conformity with the wearer's (14) outer ear (4) for retention or releasable retention of an in ear device (9). 20 Now referring primarily to Figure 25, which provides block flow diagram of using embodiments of the inventive earpiece (1) whether or not obtained as a kit (13), or whether obtained with or separate from an in ear device (9). A first step includes obtaining an earpiece (1) having an external surface (2) disposed in a first fixed configuration (3) disposable within the outer ear (4) of an ear (5) and having a passage (6) which communicates between a first 25 location (7) and a second location (8) on the external surface (2) of the earpiece (1) and adapted to retain or releasably retain an in ear device (9) in said earpiece (1)(as shown in step (40) and as shown in the examples of Figures 1, 2, 4, 7, 10 through 17, 19, and 21). A second step includes heating the earpiece (1) to achieve a moldable condition (10) which allows reconfiguration of the external surface (2) (as shown in step 41). Heating to 30 achieve the moldable condition (10) of the earpiece (1) as obtained in step (40) can be accomplished in a variety of ways. As a first illustrative example, the moldable earpiece (1) can be located in a heated enclosure (49). Where the earpiece (1) in the first fixed 11 WO 2013/119913 PCT/US2013/025288 configuration (3) is formed from polycaprolactone (or other material(s) have same or similar physical properties), the moldable earpiece (1) can be heated within the heated enclosure (49) having sufficient temperature to achieve the molded condition (10). As to particular embodiments, the heated enclosure (49) can have a temperature maintained at about 70'C 5 (160"F) and the earpiece (1) can be heated within the heated enclosure (49) for about 10 minutes. The moldable earpiece (3) can be removed from the heated enclosure (49) and allowed to sufficiently cool for engagement with the outer ear (4) (typically about 30 seconds). As a second illustrative example, the moldable earpiece (1) can be located in an amount of liquid (50). The amount of liquid (50) can be any liquid which does not degrade the 10 moldable material (15) of the earpiece (1) and which can hold a temperature sufficient to heat the earpiece (1) to achieve the moldable condition (10), such as an oil, alcohol, water, or the like, or combinations thereof. Typically, the amount of liquid (50) will be an amount of water (51). The amount of liquid (50) can be sufficiently heated to achieve the moldable condition (10). For example, where the moldable earpiece (3) is made from polycaprolactone polymer, 15 the earpiece (1) can be heated in an amount of water (50) to a temperature of about 60'C (140'F) for about 5 minutes. The earpiece (1) can be removed from the heated water (50) and allowed to sufficiently cool for engagement with the outer ear (4) (typically about 30 seconds). As to particular embodiments, the earpiece (1) in the first fixed configuration (3) of the external surface (2) disposed in the amount of liquid (50) can be heated by exposing the 20 earpiece (1) disposed in said amount of liquid (50) to an amount of microwave radiation (51) sufficient to achieve the moldable condition (10). As to particular embodiments, the earpiece (1) can be exposed to an amount of microwave radiation (51) sufficient to achieve the moldable condition (10). As a third illustrative example, the earpiece (1) can be located in a flow of heated fluid 25 (52). The flow of heated fluid (52) can be a flow of heated air (53); although the invention is not so limited. As to particular embodiments of the earpiece (3) made from polycaprolactone polymer (or other material have the same or similar physical properties), a flow of sufficiently heated air (53) can be obtained from conventional hair dryer (54). The settings of the hair dryer (55) as to temperature and flow rate can be adjusted to allow the earpiece (1) to be 30 sufficiently heated to achieve the moldable condition (10), typically, within a period of about one minute to about 2 minutes. The earpiece (1) can be removed from the flow of heated air (53) and allowed to sufficiently cool for engagement with the outer ear (4) (typically about 30 seconds). The above illustrative examples are not intended to be limiting with respect to the 12 WO 2013/119913 PCT/US2013/025288 method of heating the moldable earpiece (1) and other methods of heating the moldable earpiece (1) can be utilized, including, for example, a sand bath or salt bath. Again referring primarily to Figure 25, by disposing the in ear device (9) into the passage (6) of the earpiece (1) in the moldable condition (10)(as shown in step 42 and as 5 shown in the examples of Figures 5 and 8), the wearer (14) can forcibly urge the moldable material (15) of the earpiece (1) in contact with the in ear device (9) to reconfigure the passage (6) to retain or releasably retain the in ear device (9) in the earpiece (1). As to particular embodiments, by disposing the in ear device (9) in a conduit (25) (as shown in the example of Figure 17) the wearer can maintain the configuration of the passage (6) defined by the conduit 10 internal surface (27) to retain or releasably retain the in ear device (9) in the earpiece (1). Again referring primarily to Figure 25, the earpiece (1) in the moldable condition having the in ear device (9) retained in the passage (6) can be disposed in the outer ear (4) aligning the sound delivery element (21) of the in ear device (9) with the outer portion of the ear canal (18)(as shown in step 43 and in the examples of Figures 2 and 5). The earpiece (1) 15 engaged with the outer ear (4) and having the sound delivery element (21) in alignment with the outer portion of the ear canal (18) can be molded (as shown in step (44)) by forcible urging of the fingers (56) to reconfigure the external surface (2) of the earpiece (1) to more closely conform to the engaged part of the outer ear (4) (as shown in the examples of Figures 3, 6, 18, 20, and 22). 20 Again referring primarily to Figure 25, once the earpiece (1) has been molded by engagement with the outer ear (4), the earpiece (1) engaged with the outer ear (4) can be allowed to cool to ambient temperature, or sufficiently cool to achieve the second fixed condition (11) of the external surface (2) of the earpiece (1) which more closely conforms to the engaged part of the outer ear (4) (as shown by step 45). Typically, sufficient cooling can be 25 achieved in a period of about five minutes to about ten minutes. Cooling allows the earpiece (1) to cure in a second fixed configuration (11) which conforms to the outer ear (4) of the wearer (14). During the cooling, the wearer (14) should not talk or otherwise move the mouth or face. The earpiece (1) can then be removed from the out ear (4) of the wearer (14) (as shown as step (41)). The earpiece (1) in the second fixed configuration (11) can be re-inserted 30 into the outer ear (4) and removed from the outer ear (4) as desired (shown as steps (46) and (47). Additionally, steps 41 through 46 can be repeated to re-configure the external surface of the earpiece (1). 13 WO 2013/119913 PCT/US2013/025288 As can be easily understood from the foregoing, the basic concepts of the present invention may be embodied in a variety of ways. The invention involves numerous and varied embodiments of a moldable earpiece (1) or moldable earpiece system (12) which can be utilized for the production of a molded earpiece (56) by the process above described. 5 As such, the particular embodiments or elements of the invention disclosed by the description or shown in the figures or tables accompanying this application are not intended to be limiting, but rather exemplary of the numerous and varied embodiments generically encompassed by the invention or equivalents encompassed with respect to any particular element thereof. In addition, the specific description of a single embodiment or element of the 10 invention may not explicitly describe all embodiments or elements possible; many alternatives are implicitly disclosed by the description and figures. It should be understood that each element of an apparatus or each step of a method may be described by an apparatus term or method term. Such terms can be substituted where desired to make explicit the implicitly broad coverage to which this invention is entitled. As 15 but one example, it should be understood that all steps of a method may be disclosed as an action, a means for taking that action, or as an element which causes that action. Similarly, each element of an apparatus may be disclosed as the physical element or the action which that physical element facilitates. As but one example, the disclosure of "a moldable earpiece" should be understood to encompass disclosure of the act of "molding an earpiece" -- whether 20 explicitly discussed or not -- and, conversely, were there effectively disclosure of the act of "molding an earpiece", such a disclosure should be understood to encompass disclosure of "a moldable earpiece" and even a "means for molding an earpiece." Such alternative terms for each element or step are to be understood to be explicitly included in the description. In addition, as to each term used it should be understood that unless its utilization in 25 this application is inconsistent with such interpretation, common dictionary definitions should be understood to be included in the description for each term as contained in the Random House Webster's Unabridged Dictionary, second edition, each definition hereby incorporated by reference. Moreover, for the purposes of the present invention, the term "a" or "an" entity refers 30 to one or more of that entity; for example, "a light source" refers to one or more of those light sources. As such, the terms "a" or "an", "one or more" and "at least one" can be used interchangeably herein. 14 WO 2013/119913 PCT/US2013/025288 All numeric values herein are assumed to be modified by the term "about", whether or not explicitly indicated. For the purposes of the present invention, ranges may be expressed as from "about" one particular value to "about" another particular value. When such a range is expressed, another embodiment includes from the one particular value to the other particular 5 value. The recitation of numerical ranges by endpoints includes all the numeric values subsumed within that range. A numerical range of one to five includes for example the numeric values 1, 1.5, 2, 2.75, 3, 3.80, 4, 5, and so forth. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint. The term "about" generally refers to a range of numeric 10 values that one of skill in the art would consider equivalent to the recited numeric value or having the same function or result. Similarly, the antecedent "substantially" means largely, but not wholly, the same form, manner or degree and the particular element will have a range of configurations as a person of ordinary skill in the art would consider as having the same function or result. When a 15 particular element is expressed as an approximation by use of the antecedent "substantially," it will be understood that the particular element forms another embodiment. Thus, the applicant(s) should be understood to claim at least: i) each of the moldable earpieces herein disclosed and described, ii) the related methods disclosed and described, iii) similar, equivalent, and even implicit variations of each of these devices and methods, iv) 20 those alternative embodiments which accomplish each of the functions shown, disclosed, or described, v) those alternative designs and methods which accomplish each of the functions shown as are implicit to accomplish that which is disclosed and described, vi) each feature, component, and step shown as separate and independent inventions, vii) the applications enhanced by the various systems or components disclosed, viii) the resulting products 25 produced by such systems or components, ix) methods and apparatuses substantially as described hereinbefore and with reference to any of the accompanying examples, x) the various combinations and permutations of each of the previous elements disclosed. The background section of this patent application provides a statement of the field of endeavor to which the invention pertains. This section may also incorporate or contain 30 paraphrasing of certain United States patents, patent applications, publications, or subject matter of the claimed invention useful in relating information, problems, or concerns about the state of technology to which the invention is drawn toward. It is not intended that any United States patent, patent application, publication, statement or other information cited or 15 WO 2013/119913 PCT/US2013/025288 incorporated herein be interpreted, construed or deemed to be admitted as prior art with respect to the invention. The claims set forth in this specification, if any, are hereby incorporated by reference as part of this description of the invention, and the applicant expressly reserves the right to use 5 all of or a portion of such incorporated content of such claims as additional description to support any of or all of the claims or any element or component thereof, and the applicant further expressly reserves the right to move any portion of or all of the incorporated content of such claims or any element or component thereof from the description into the claims or vice versa as necessary to define the matter for which protection is sought by this application or by 10 any subsequent application or continuation, division, or continuation-in-part application thereof, or to obtain any benefit of, reduction in fees pursuant to, or to comply with the patent laws, rules, or regulations of any country or treaty, and such content incorporated by reference shall survive during the entire pendency of this application including any subsequent continuation, division, or continuation-in-part application thereof or any reissue or extension 15 thereon. The claims set forth in this specification, if any, are further intended to describe the metes and bounds of a limited number of the preferred embodiments of the invention and are not to be construed as the broadest embodiment of the invention or a complete listing of embodiments of the invention that may be claimed. The applicant does not waive any right to 20 develop further claims based upon the description set forth above as a part of any continuation, division, or continuation-in-part, or similar application. 16
权利要求:
Claims (39)
[1] 1. A moldable earpiece for an in ear device, comprising: an earpiece having an external surface disposed in a first fixed configuration disposable within the outer ear of an ear, said 5 earpiece having a passage which communicates between a first location and a second location on said external surface of said earpiece, said passage adapted for releasable retention of said in ear device to said earpiece, said earpiece heatable to achieve a moldable condition which allows reconfiguration of said external surface by engagement with said outer ear, said earpiece coolable while engaged with said outer ear to dispose said external surface in a 10 second fixed configuration.
[2] 2. The moldable earpiece of claim 1, further comprising a conduit which communicates between said first location and said second location on said external surface of said earpiece, said conduit having a conduit external surface which engages said earpiece and an conduit internal surface which defines said passage adapted for releasable retention of said in ear 15 device in relation to said earpiece.
[3] 3. The moldable earpiece of claim 2, wherein said passage defined by said conduit communicates with said first location and said second location to align said passage with an ear canal of said ear.
[4] 4. The moldable earpiece of claim 3, wherein said conduit upon heating and molding of 20 said earpiece maintains configuration of said conduit internal surface which defines said passage adapted for releasable retention of said in ear device.
[5] 5. The moldable earpiece of claim 4, wherein said conduit comprises an elastomer layer integral to said earpiece.
[6] 6. The moldable earpiece of claim 3, wherein said conduit comprises a flexible elastomer 25 insert which removably couples to said earpiece.
[7] 7. The moldable earpiece of claim 1, wherein said earpiece maintains said external surface in said first fixed configuration or said second fixed configuration at a temperature below about 40'C (110 F) and maintains earpiece in said moldable condition at a temperature of between about 40'C (about 1 10"F) and about 654C (150'F). 17 WO 2013/119913 PCT/US2013/025288
[8] 8. The moldable earpiece of claim 7, wherein said earpiece comprises an amount of polycaprolactone polymer having a molecular weight of between about 37,000 and about 80,000.
[9] 9. The moldable earpiece of claim 8, wherein said earpiece achieves said moldable 5 condition by heating said earpiece for a period of time within a heated enclosure maintained at about 70'C (160"F).
[10] 10. The moldable earpiece of claim 8, wherein said earpiece achieves said moldable condition by exposure of said earpiece for a period of time to an amount of microwave radiation. 10
[11] 11. The moldable earpiece of claim 8, wherein said earpiece achieves said moldable condition by disposal in an amount of liquid having temperature of between about 40'C (about 1 IOF) and about 65'C (150 F).
[12] 12. The moldable earpiece of claim 8, wherein said earpiece achieves said moldable condition by disposal in an amount of liquid, said earpiece disposed in said amount of liquid 15 exposed to an amount of microwave radiation.
[13] 13. The moldable earpiece of claim 12, wherein said amount of liquid comprises an amount of water.
[14] 14. The moldable earpiece of claim 1, wherein said in ear device is selected from the group consisting of: earphones, earplugs, earbuds, ear tips, ear tubes, ear sealing ballons, and in ear 20 hearing aids.
[15] 15. The moldable earpiece of claim 14, wherein said in ear device is a part of an apparatus which resides outside of said ear.
[16] 16. The moldable earpiece of claim 15, wherein said apparatus is selected from the group consisting of: headsets, head phones, telephones, blue tooth headphones, wireless headphones, 25 and hearing aids.
[17] 17. A method of making a moldable earpiece for an in ear device, comprising: producing an earpiece having an external surface disposed in a first fixed configuration disposable within the outer ear of an ear, said earpiece having a passage which communicates between a first location and a second location on said external surface of said earpiece, said passage adapted
[18] 18 WO 2013/119913 PCT/US2013/025288 for releasable retention of said in ear device to said earpiece, said earpiece heatable to achieve a moldable condition which allows reconfiguration of said external surface by engagement with said outer ear, said earpiece coolable while engaged with said outer ear to dispose said external surface in a second fixed configuration. 5 18. The method of claim 17, further comprising disposing a conduit within said earpiece which communicates between said first location and said second location on said external surface of said earpiece, said conduit having an internal surface which defines said passage adapted for releasable retention of said in ear device in relation to said earpiece.
[19] 19. The method of claim 18, further comprising disposing said conduit within said earpiece 10 to align said passage with an ear canal of said ear.
[20] 20. The method of claim 19, further comprising providing said conduit in a structural form which maintains said passage in a configuration adapted for releasable retention of said in ear device in relation to said earpiece during reconfiguration of said external surface in said moldable condition of said earpiece. 15
[21] 21. The method of claim 20, further comprising providing said conduit as a flexible elastomer layer.
[22] 22. The method of claim 21, further comprising providing said conduit as a flexible elastomer insert which removably couples within said earpiece.
[23] 23. The method of claim 1, wherein producing said earpiece further comprises forming 20 said earpiece from an amount of composition which maintains said first fixed configuration and said second fixed configuration at a temperature below about 40'C (1 10F) and maintains said moldable condition at a temperature of between about 40 0 C (about 1 10'F) and about 65 0 C (150"F).
[24] 24. The method of claim 23, further comprising forcing said earpiece from an amount of 25 polycaprolactone polymer having a molecular weight of between about 37,000 and about 80,000.
[25] 25. The method of claim 1, further comprising configuring said passage for releasable retention of said in ear device selected from the group consisting of: earphones, earplugs, earbuds, ear tips, and in ear hearing aids. 19 WO 2013/119913 PCT/US2013/025288
[26] 26. The method of claim 25, wherein said in ear device is a part of an apparatus which resides outside of said ear.
[27] 27. The method of claim 26, wherein said apparatus is selected from the group consisting of: headsets, head phones, telephones, blue tooth headphones, wireless headphones, and 5 hearing aids.
[28] 28. A method of molding an earpiece for an in ear device, comprising: a) obtaining an earpiece having an external surface disposed in a first fixed configuration disposable within the outer ear of an ear, said earpiece having a passage which communicates between a first location and a second location on said external surface of said 10 earpiece, said passage adapted for releasable retention of said in ear device to said earpiece; b) heating said earpiece to achieve a moldable condition which allows reconfiguration of said external surface; c) disposing said earpiece in said moldable condition within an outer ear of an ear; d) molding said external surface of said earpiece by engagement with said outer 15 ear of said ear; and e) cooling said earpiece disposed in said outer ear to achieve said external surface in a second fixed configuration.
[29] 29. The method of claim 28, wherein heating comprises locating said earpiece in a heated enclosure having a temperature sufficient to achieve said moldable condition. 20
[30] 30. The method of claim 28, wherein heating comprises exposing said earpiece to an amount of microwave radiation sufficient to achieve said moldable condition.
[31] 31. The method of claim 28, wherein heating comprises: a) heating an amount of liquid to a temperature sufficient to achieve said moldable condition; and 25 b) disposing said earpiece in said amount of liquid.
[32] 32. The method of claim 32, wherein heating comprises: a) disposing said earpiece in an amount of liquid; and b) exposing said earpiece disposed in said amount of liquid to an amount of microwave radiation sufficient to achieve said moldable condition. 30
[33] 33. The method of claim 1, wherein amount of liquid comprises an amount of water. 20 WO 2013/119913 PCT/US2013/025288
[34] 34. The method of claim 1, wherein disposing said earpiece in said moldable condition within an outer ear of an ear further comprises aligning said passage of said earpiece with an ear canal of said ear.
[35] 35. The method of claim 34, wherein molding said external surface of said earpiece by 5 engagement with said outer ear of said ear further comprises engaging said external surface of said earpiece in said moldable condition to a concha of said outer ear.
[36] 36. The method of claim 35, further comprising retaining said in ear device within said passage of said earpiece.
[37] 37. The method of claim 36, further comprising removing said in ear device from within 10 said passage of said earpiece.
[38] 38. The method of claim 37, refitting said earpiece to said outer ear by repeating steps b) through d) of claim 28.
[39] 39. A molded earpiece by the process of claim 28. 21
类似技术:
公开号 | 公开日 | 专利标题
US10779073B2|2020-09-15|Moldable earpiece system
US9179211B2|2015-11-03|Double seal moldable earpiece system
AU2018210187B2|2021-04-29|Earpiece intra-auricular support system
AU2021266221A1|2021-12-02|Reconfigurable intra-auricular support
US10507599B2|2019-12-17|Moldable earpiece heating case
同族专利:
公开号 | 公开日
US20190028790A1|2019-01-24|
US9451353B2|2016-09-20|
US20130216086A1|2013-08-22|
US9769555B2|2017-09-19|
US20160373852A1|2016-12-22|
CA2900475C|2016-05-10|
CA2900475A1|2013-08-15|
CN104160719A|2014-11-19|
WO2013119913A1|2013-08-15|
MX2014009513A|2014-11-25|
EP2813091B1|2018-05-16|
EP2813091A4|2016-02-24|
EP2813091A1|2014-12-17|
CN104160719B|2018-01-16|
US10779073B2|2020-09-15|
US9628889B2|2017-04-18|
US20170223444A1|2017-08-03|
US10091571B2|2018-10-02|
US20180035194A1|2018-02-01|
US20210006886A1|2021-01-07|
ES2670838T3|2018-06-01|
AU2013216867B2|2016-12-01|
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USD925493S1|2019-11-25|2021-07-20|Decibullz Llc|Intra-auricular earbud support|
法律状态:
2017-03-30| FGA| Letters patent sealed or granted (standard patent)|
优先权:
申请号 | 申请日 | 专利标题
US201261596567P| true| 2012-02-08|2012-02-08||
US61/596,567||2012-02-08||
US13/761,947||2013-02-07||
US13/761,947|US9451353B2|2012-02-08|2013-02-07|Moldable earpiece system|
PCT/US2013/025288|WO2013119913A1|2012-02-08|2013-02-08|Moldable earpiece system|
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