• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A motor vehicle headlamp (1) having at least one LED (4, 4a, 4d) soldered onto metallic surfaces (3-1, 3-2) of a printed circuit board (3) with their connections as SMD, and with an optical system (2, 8) which radiates the light emitted by the at least one LED (4; 4a, 4d) into the traffic space, wherein the targeted setting of the emission direction of the at least one LED (4; 4a, 4d) with different solder thicknesses (d1, d2) between them Terminals (4-1, 4- 2) and the metallic surfaces (3-1, 3-2) of the circuit board (3) is soldered.
    公开号:AT518666A4
    申请号:T50846/2016
    申请日:2016-09-21
    公开日:2017-12-15
    发明作者:Petsch Daniel
    申请人:Zkw Group Gmbh；
    IPC主号:
    专利说明:

    The invention relates to a motor vehicle headlamp with at least one LED soldered on metallic surfaces of a printed circuit board with their terminals as SMD, as well as with an optical system which emits the radiated from the at least one LED light in the traffic area.
    A problem with headlamps of the subject type is that an LED as such has a very small radiating surface, but in practice requires a printed circuit board on which it is connected by soldering with current-carrying conductor tracks. In the context of the present invention, the LEDs are designed as SMD components (Surface Mounted Device) which, with their electrical connections, usually called "pads" for short, are soldered directly onto the printed circuit board, using a reflow method the circuit board, usually together with arranged on this cooling elements for cooling the LED or LEDs needed, because the lack of suitable cooling would lead to the destruction used in the high-power LEDs used in the headlight area, but in any case to an unbearable reduction their life.
    However, the circuit board is in the headlight for the optical system is a problem because the soldered thereon LED or soldered LEDs are parallel to the circuit board level and without special precautions are not adjustable in terms of their emission direction. As a result, part of the light emitted by the LED or the LEDs remains unused and / or, when using a reflector in the headlight, the printed circuit board can shade off a part of the light emitted by the reflector.
    At this point, it should further be noted that unlike many other conventional bulbs LEDs have only a limited opening angle and thus radiate in relation to a spherical surface in a partial angle, so you can not accept uncritically optical systems that are suitable for incandescent lamps, for example Specific problems, which will be discussed below, result, which reduce the overall efficiency.
    An object of the invention is to eliminate the disadvantages mentioned as possible without additional cost and thereby increase the overall efficiency of the headlamp.
    This object is achieved, starting from a headlamp of the type mentioned, according to the invention, that for targeted adjustment of the emission of the at least one LED, this is soldered with different solder thicknesses between their terminals and the metallic surfaces of the circuit board.
    The invention makes it possible to "adjust" the emission direction of one or more LEDs and thus to make optimal use of the light illuminated by the LEDs without any additional costs being incurred.
    In an expedient variant of the invention can be provided that the optics is designed as a lens system having at least one lens and a printed circuit board with at least two LEDs, which is arranged at a distance from a lens approximately normal to the optical axis, wherein outside the optical axis lying LEDs with different solder thicknesses between their terminals and the metallic surfaces of the circuit board are arranged so that their main emission direction is directed to the center of the lens.
    In this way, the light from out of the optical axis placed LEDs, which are now inclined to the optical axis, better used and the overall efficiency can be increased.
    A further expedient variant is characterized in that the optics is designed as reflector optics and has a half-shell reflector, wherein the circuit board with the at least one LED substantially in the sectional plane, which also contains the optical axis, wherein the at least one LED is arranged with different solder thicknesses between their terminals and the metallic surfaces of the circuit board so that their main emission direction is inclined to the reflector.
    Thanks to this training, an increase in the efficiency is also possible and it avoids a shadowing of the emitted light through the circuit board.
    It is particularly advantageous if the reflector is a paraboloid half-shell reflector.
    In some cases, it may be expedient to provide that the reflector is additionally assigned a lens system with at least one lens.
    The invention together with further advantages is explained in more detail below by way of example embodiments, which are illustrated in the drawing. In this show
    1 shows a half-shell reflector of a headlamp according to the prior art in a schematic section with an arranged on a circuit board LED light source,
    FIG. 2 is a view like FIG. 1, but with an inclined printed circuit board on which an LED light source is arranged, FIG.
    3 in a view like Fig. 1 and 2, the basic solution according to the invention,
    4a shows a section of the arrangement of an LED designed as an SMD component on a printed circuit board section before a reflow soldering process,
    4b shows a view like FIG. 4a of the final arrangement according to the invention of the LED on a printed circuit board section after the reflow soldering process,
    5 shows a lens of a headlamp according to the prior art in a schematic section with four arranged on a printed circuit board LED light sources and
    Fig. 6 is a view like Fig. 5 but with two according to the invention inclined to the PCB LED light sources.
    Referring to FIG. 1, it can be seen a headlamp 1 according to the prior art with a half-shell reflector 2 as optics, in which a LED light source 4 is arranged on a printed circuit board 3. The reference numeral 5 denotes a heat sink or a part of the housing of the headlamp 1. The half-shell of the reflector 2 is at a
    Embodiment less a paraboloid than a juxtaposition of facets, but which could be taken from a Paraboloidfläche. A facet is shown in section, in an adjacent one looks at a shallow angle on the reflector inner surface 2f, which has only a small enclosure here. The circuit board 3 with the LED light source 4 is substantially in the sectional plane σ, which also contains the unspecified optical axis of the headlamp 1. The reflector opening is located in the region of the focal point or the location of the light source 4. From this half-space in the light exit direction of the reflector meet in this example only rays at an angle ß of about 10 ° measured from the main emission of the LED with a total radiation angle greater than α on the reflector inner surface 2f.
    It can now, as shown in FIG. 2, by tilting the circuit board 3 more in the direction of the interior of the reflector 2 try to increase the light output. Shown is an inclined by about 10 ° in the direction of the parabola apex S printed circuit board 3, so that rays impinge on the reflector inner surface 2f at an angle α to 20 °, measured from the main emission of the LED. However, this has the consequence that now a portion of the reflector inner surface 2f near the parabola peak S is shaded. In Fig. 2, this is the area b between the indicated dot-dash lines. Of course, this shading again leads to light losses and is also undesirable lighting technology.
    Fig. 3 shows in connection with Figs. 4a and 4b, the problem solution according to the invention. It is only the light source, namely an SMD LED 4 by 10 ° inclined to the circuit board 3, so that rays at an angle α to 20 °, as measured by the main emission, impinge on the reflector surface without shading additional parts of the reflector surface.
    In order to achieve this, the targeted setting of the emission direction of the at least one LED 4 soldered with different solder thicknesses between their terminals and the metallic surfaces of the circuit board. This will now be explained in detail with reference to FIGS. 4a and 4b.
    4b shows in a greatly enlarged section, in which the heat sink is omitted under the printed circuit board 3, that the inclination of the SMD LED 4 at different solder thicknesses dl, d2 or different thickness Lotspalten between the respective metallic surfaces 3-1, 3rd -2 of the circuit board 3 and the SMD LED 4 is based.
    Fig. 4a shows the populated LED 4 and the printed solder 6-1, 6-2 before the reflow process. In the case of the solder joint facing the parabola vertex S, the solder 6-2 is located only within the region of the metallic surface 3-2 of the printed circuit board 3 which has been freed from solder resist 7. The metallic surfaces 3-1, 3-2 are generally pads of printed conductors.
    At the solder joint which faces the reflector opening, the printed solder 6-1 is also present on the solder resist 7 before the reflow process, in addition to the region of the metallic surface 3-1 which has been freed from solder resist 7. The quantity of solder 6-1 of this metallic surface 3-1 is dimensioned so that after collecting the solder on the exposed metallic surfaces 3-1 sets a height of the solder gap dl, which is greater than in the metallic surface 3-2, which faces the parabola vertex S. ,
    The different solder thicknesses between the terminals 4-1, 4-2 and the metallic surfaces 3-1, 3-2 result in that the main emission direction of the LED 4 is inclined to the reflector 2, without this leading to shading - as shown in FIG 2 - leads.
    1 to 4 show a motor vehicle headlight 1 with a reflector optics, wherein it should be noted that the reflector may be associated in a manner known to those skilled in the art also a lens system that contains at least one lens.
    In the following, it will be shown by way of example that the invention can also be applied to a headlight whose optic is formed by a lens system. Identical or similar parts are denoted by the same reference numerals as used above. Fig. 5 shows an optical arrangement in a headlight 1, consisting of four LEDs 4a, 4b, 4c, 4d on a circuit board 3 and a lens 8. The LEDs 4a, 4b, 4c, 4d lie in a plane ε perpendicular to the optical Axis a and they are at different distances from the optical axis. In the light-emitting diodes 4a, 4d with the greatest distance to the optical axis, rays which are emitted in an angle range up to, for example, a maximum of 30 °, measured from the main emission direction of the respective LED, into the half-plane facing away from the optical axis (the center of the lens), on the light entry surface of the lens 8. In the considered plane lie on the one hand, the light sources, more precisely, the centers of the light emitting surfaces of the LEDs and on the other hand, the optical axis a. It is obvious that in this arrangement a part of the light emitted by the outer LEDs 4a, 4d is lost.
    FIG. 6 shows a similar arrangement in which the LEDs farthest from the optical axis a are inclinedly mounted with respect to the plane of the circuit board 3, so that the main radiation direction of these LEDs is inclined toward the center of the lens 8. Radiation emitted up to an angle of, for example, 40 °, measured from the main emission direction of the LED, into the half-plane facing away from the optical axis, hits the light-entry surface of the lens when the LEDs with this orientation of the light emission surfaces of the LEDs are mounted 8 on.
    Although not shown in detail, it should be clear to those skilled in the art that the described inclination of the outer LEDs is achieved in the same way as in the more specifically described embodiment of Figs. 4a and b, namely in that for the targeted adjustment of the emission direction LEDs 4 a, 4 d are soldered on with different solder thicknesses between their terminals and the metallic surfaces of the printed circuit board. It should be further understood that for other numbers of LEDs, the invention may be applied as well, for example three LEDs in connection with FIG. 6, with one LED centrally located in the optical axis. Likewise, concentric LED arrangements are possible.
    The term "LED" is to be understood in the context of the invention quite generally a light-emitting SMD element, for example, so-called multi-chip LEDs that identify multiple light-emitting surfaces, blue LEDs in conjunction with a phosphor that emit a "white" mixed light etc .. ,
    Although only two terminals of an LED have been shown above, which are soldered on with different solder thicknesses, it should be clear that the invention in the same
    Includes light-emitting SMD elements with three or more terminals, as long as the desired inclination of the LEDs is ensured by appropriate solder thicknesses.
    List of Reference Numbers 1 Headlamp a Optical axis 2 Optic, Reflector b Area 2f Reflector inner surface dl Lot thickness 3 Circuit board d2 Lot thickness 3-1 metallic area of 3 S Parabola vertex 3- 2 metallic area of 3 α Total beam angle 4 LED, SMD LED ß Angle 4a-d LED s Level 4- 1 Connection of 4 σ cutting plane 4-2 Connection of 4 5 Heat sink 6-1 Solder 6-2 Solder 7 Solder stop 8 Lens
    权利要求:
    Claims (5)
    [1]
    claims
    1. Motor vehicle headlight (1) having at least one on metallic surfaces (3-1, 3-2) of a printed circuit board (3) with their terminals as SMD soldered LED (4), as well as with an optic which of the at least one LED radiated light into the traffic space, characterized in that for the targeted adjustment of the emission direction of the at least one LED (4) this with different solder thicknesses (dl, d2) between their terminals (4-1, 4-2) and the metallic surfaces ( 3-1, 3-2) of the circuit board (3) is soldered.
    [2]
    2. Motor vehicle headlight (1) according to claim 1, characterized in that the optic is designed as a lens system having at least one lens (8) and a printed circuit board (3) with at least two LEDs (4a, 4b, 4c, 4d) is arranged at a distance from the lens approximately normal to the optical axis (a), wherein lying outside the optical axis LEDs (4a, 4d) are arranged with different solder thicknesses between their terminals and the metallic surfaces of the circuit board so that their main emission to the center of the Lens is directed.
    [3]
    3. motor vehicle headlight (1) according to claim 1, characterized in that the optics is designed as reflector optics and a half-shell reflector (2), wherein the circuit board (3) with the at least one LED (4) substantially in the Section (σ), which also contains the optical axis is, wherein the at least one LED with different solder thicknesses (dl, d2) between their terminals (4-1, 4-2) and the metallic surfaces (3-1, 3- 2) of the printed circuit board is arranged so that its main radiation direction is inclined to the reflector (2).
    [4]
    4. Motor vehicle headlight (1) according to claim 3, characterized in that the reflector is a paraboloid half-shell reflector (2).
    [5]
    5. Motor vehicle headlight (1) according to claim 3 or 4, characterized in that the reflector is additionally associated with a lens system with at least one lens.
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    同族专利:
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    CN109716518A|2019-05-03|
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    引用文献:
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    CN202708701U|2012-07-05|2013-01-30|翁茂证|Light-emitting diode tube|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50846/2016A|AT518666B1|2016-09-21|2016-09-21|Automotive headlamp|ATA50846/2016A| AT518666B1|2016-09-21|2016-09-21|Automotive headlamp|
    US16/331,678| US20190195448A1|2016-09-21|2017-08-22|Motor-Vehicle Headlamp Having an SMD LED Attached by Soldering|
    CN201780057886.5A| CN109716518A|2016-09-21|2017-08-22|The automotive headlight of SMD-LED with welding|
    PCT/AT2017/060207| WO2018053562A1|2016-09-21|2017-08-22|Motor-vehicle headlamp having an smd led attached by soldering|
    KR1020197003773A| KR20190028731A|2016-09-21|2017-08-22|Automotive head lamp with SMD type LED attached by soldering|
    EP17764319.4A| EP3516688B1|2016-09-21|2017-08-22|Motor-vehicle headlamp having an smd led attached by soldering|
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