• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
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    • 专利摘要:
    Component housing (110) of a vehicle headlamp, comprising an electronic component (1) with an optical active surface on a front side and a thermal effective surface and electrical contacts on a front side facing away from the front, and: - A housing shell (120) with a mounting position for the electronic Component (1), as well as a located in the mounting position component opening (121) in which the electronic component (1) is arranged and through which access to the optical effective surface of the electronic component (1) is possible, - a first circuit board (130 ), with which the electronic component (1) can be connected via its electrical contacts, - a housing cover (150) with which the housing shell (120) can be closed, - at least one first spacer (160) which is disposed between an associated contact point and the Housing cover (150) is arranged, wherein the support point is located on the first circuit board (130), and lower a connecting element is provided for establishing a connection between the housing cover (150) and the housing shell (120), which is preferably insertable along an axis which is arranged running transversely to the printed circuit board (130).
    公开号:AT518344A1
    申请号:T50169/2016
    申请日:2016-03-03
    公开日:2017-09-15
    发明作者:Mayer Matthias；Reinprecht Markus；Mitterlehner Stefan
    申请人:Zkw Group Gmbh；
    IPC主号:
    专利说明:

    Component housing of a vehicle headlight
    The invention relates to a component housing of a vehicle headlamp, which comprises an electronic component with an optical active surface on a front side and a thermal active surface and electrical contacts on a rear side facing away from the front side.
    In addition, the invention relates to a housing system of a vehicle headlamp, which comprises said component housing and a holder for the component housing.
    In the development of the current headlamp systems is increasingly the desire in the foreground to project a high-resolution as possible on the road surface, which can be quickly changed and adapted to the respective traffic, road and lighting conditions. The term "carriageway" is used here for a simplified representation, because of course it depends on the local conditions, whether a photo is actually on the roadway or even extends beyond.In principle, the photograph is based on a projection on a vertical surface according to the relevant standards relating to automotive lighting technology.
    In order to meet this stated need, among other things, headlamps have been developed in which a variably controllable reflector surface is formed from a plurality of micromirrors and reflects a light emission generated by a light source in the emission direction of the headlamp. Such lighting devices are advantageous in vehicle because of their very flexible light distribution, as for different lighting areas, the illumination can be controlled individually and any light distribution can be realized, such as a low beam light distribution, a cornering light distribution, a city light distribution, a motorway light distribution , a bend light distribution, a high beam light distribution or the image of glare-free high beam. For the micromirror arrangement, the so-called Digital Light Processing (DLP®) projection technology is used, in which images are generated by modulating a digital image onto a light beam. In this case, by a rectangular arrangement of movable micromirrors, also referred to as pixels, the light beam in
    Partial areas decomposed and then pixelwise either in the projection away in or out of the projection path out reflected.
    The basis for this technique is an electronic component that contains the rectangular array in the form of a matrix of mirrors and their driving technique and is referred to as "Digital Micromirror Device" (DMD).
    A DMD microsystem is a spatial light modulator (SLM) which consists of matrix-shaped micromirror actuators, that is to say tiltable reflecting surfaces, for example with an edge length of approximately 16 μm. The mirror surfaces are designed to be movable by the action of electrostatic fields. Each micromirror is individually adjustable in angle and usually has two stable end states, which can be changed within a second up to 5000 times. The number of mirrors corresponds to the resolution of the projected image, where a mirror can represent one or more pixels. Meanwhile, DMD chips with high resolutions in the megapixel range are available. The underlying technology for adjustable mirrors is Micro-Electro-Mechanical Systems (MEMS) technology. While the DMD technology has two stable mirror states, and by modulating between both stable states, the reflection factor can be set, the "Analog Micromirror Device" (AMD) technology has the property that the individual mirrors can be set in variable mirror positions. which are each in a stable state
    A typical micromirror component comprises a housing, on whose front side, behind an optical viewing window, the matrix of mirrors is arranged. The optical effective area of such a micromirror component is understood to be the active mirror surface of the component, that is to say the total area formed by all the individual micromirrors. On the back of the housing usually the electrical contacts are arranged around a centrally located surface, which is provided for connection of a cooling device. The thermal effective area of such a micromirror component is understood to be the area on the rear side of the component which is provided for mounting a heat sink.
    Often, the micromirror component is incorporated in a so-called Ceramic Land Grid Array (CLGA) module, an integrated circuit interconnect system. In the LGA system, the integrated circuit terminals on its underside are in the form of a grid array LGA processors are typically mounted on pedestals that incorporate spring-loaded contacts, resulting in less mechanical stress on the contacts, and the ceramic body of the CLGA is designed specifically for high operating temperatures.
    In addition to the mechanical load forces that may arise during the assembly of the individual components, during or while the vehicle is moving, mechanical load forces such as vibrations or driving situations may result in tensile or compressive forces acting on all components in the vehicle. There is therefore the requirement that the components are designed on the one hand such that mechanical load forces have no influence on their function or their arrangement with each other. On the other hand, the components must not be impaired in terms of stability or service life, such as caused by high temperature differences mechanical load forces due to different material expansions of adjacent different materials at and within the components.
    An object of the present invention is to provide a housing for an electronic component in a vehicle headlight, which supports the basic optical function of the vehicle headlight through the inserted electronic component, as well as its stable, mechanical attachment and the connection of the optical, electrical and thermal system components allowed. It should be noted that no mechanical load forces may act on the connections. At the same time, easy maintenance of the components is to be made possible.
    This object is achieved with a vehicle headlamp of the type mentioned above in that the component housing comprises: a housing shell with a mounting position for the electronic component and a component opening located in the region of the mounting position, in which the electronic component is arranged and through which access is possible to the optical effective surface of the electronic component, - a first printed circuit board to which the electronic component is connectable via the electrical contacts, - a housing cover with which the housing shell is closable, - at least a first spacer, the between an associated support point, and the housing cover is arranged, wherein the support point on the first circuit board or on a heat sink, which is arranged on the first circuit board and on the thermal effective surface of the electronic component is located.
    In addition, at least one connecting element for establishing a connection between the housing cover and the housing shell is provided. The connecting element can preferably be used along an axis which is arranged to extend transversely to the printed circuit board.
    By access to an optical or thermal effective surface is meant that the respective active surface can be reached through an opening in either the housing shell or in the circuit board or the electronic component with the active surface can protrude through the opening to allow the effect of the active surface , The optical active surface generates its effect by reflection of light that is incident and is reflected according to the control by the electronic component again. The opening ensures that the path of the incident and reflected light is not affected. The thermal effective surface generates its effect by dissipating heat that occurs in the electronic component. To improve the effect, a heat sink may additionally be mounted on the thermal effective surface. The heat is caused on the one hand by the power loss of the electronics of the electronic component, but also by the incident on the optical effective surface and not reflected, that is absorbed light.
    The inventive solution, a component housing is provided which allows easy installation in the harsh environment of mounting in a vehicle headlight, and keeps away mechanical loads from the sensitive electronic components and circuit carriers during operation and at the same time a suitable interface of the optical function of the electronic component for the vehicle headlamp provides. In particular, no forces act on the electronic component during housing installation. In addition, the arrangement according to the invention allows easy assembly of the individual components and allows good accessibility for maintenance during the product life cycle. Only the holder, in which the imaging optics is installed, has a rigid connection to the electronic component in order to keep the electronic component precisely in the focal point of the imaging optics. The component housing of the invention provides a robust unit in which mechanical loading forces are dissipated, both in assembly and in operation.
    The said component opening allows access to the optical effective area of the electronic component, i. the matrix of mirrors in the component becomes visible to the other components of the illumination device and the light irradiated by a light source can be reflected without interference via the optically effective surface.
    In an advantageous development, the first circuit board may comprise a heat sink opening through which access to the thermal effective area of the electronic component is possible and improved cooling of the electronic component is achieved. It is particularly favorable if the component housing comprises a heat sink which is arranged on the thermal effective area of the electronic component.
    The same applies to the mentioned heat sink opening that it allows access to the thermal effective area of the electronic component to install a heat sink there. Consequently, the circuit board may include an opening through which the heat sink can be pushed through.
    It is advantageous if support points lie on the first printed circuit board or on the heat sink in order to fix the heat sink to the printed circuit board when using a heat sink.
    In an advantageous embodiment it can be provided that at least the first spacer is resilient and preferably has a substantially hollow cylindrical shape and an axis, wherein the connecting element preferably extends through the hollow cylindrical shape and preferably the axis of the connecting element coincides with the axis of the first spacer ,
    When the first spacer is designed to be resilient, a fastening which is particularly suitable in accordance with the task position is achieved with respect to mechanical loads on the printed circuit board or the heat sink. In particular dimensional tolerances of the components used can cause mechanical stresses such as bending stresses in the assembly. The resilient elements provide uniform contact forces during assembly of the component housing and the components or for their low-distortion fixation.
    In a further aspect of the invention, at least one second printed circuit board and at least one adapter can be arranged between the first printed circuit board and the housing cover, wherein the adapter preferably comprises a flexible printed circuit board and connects the printed circuit boards. As a result, complex electronic circuits can be accommodated on the first and second printed circuit boards. Some electronic components require extensive electronic circuits for control or sensor evaluation, which often brings a corresponding size of the circuit board with it. In order to keep the size compact, two or more printed circuit boards can be "piggybacked" over one another It is favorable if the second printed circuit board is connected to the first printed circuit board both electrically and mechanically, and if the second printed circuit board comprises openings through which the first printed circuit boards The mechanical connection of the two printed circuit boards means that both printed circuit boards can move at the same time, which is made possible by the first springy spacer.
    In order to achieve a simpler installation of the electronic component, it may also be advantageous if a mounting base is arranged between the first printed circuit board and the electronic component, whereby the electrical contacts of the electronic component are connected to, for example, contact pads on the first printed circuit board. This is therefore particularly favorable to keep the electronic component with other components of the optical system of the vehicle headlight adjustable. The adjustment to other optical system components is advantageous, for example, to position the electronic component exactly at the focal point of the imaging optics.
    According to an additional aspect of the invention, which supports the compactness as well as the mechanical stability, but in particular the simplicity of the component housing including the components included, at least a second spacer may be interposed between the housing cover and the first spacer. The second
    Spacer may preferably form a common component with the housing cover and preferably have a substantially hollow cylindrical shape and an axis, wherein the connecting element preferably extends through the hollow cylindrical shape and preferably the axis of the connecting element coincides with the axis of the second spacer. It is advantageous if the second printed circuit board comprises openings through which the second spacers can protrude through.
    Furthermore, it is additionally advantageous for the compactness and stability of the component housing if at least one third spacer is arranged between the housing shell and the first printed circuit board. The third spacer may preferably form a common component with the housing shell and preferably have a substantially hollow cylindrical shape and an axis, wherein the connecting element preferably extends through the hollow cylindrical shape and preferably the axis of the connecting element coincides with the axis of the third spacer.
    In addition, the third spacer ensures that the first circuit board is kept at a distance from the housing shell. This is particularly relevant before assembly of the component housing, since in the mounted state, that is, when the holder is connected to the component housing, the holder is the electronic component pressed into the component housing, wherein the spring force of the first spacer holds the arrangement in tension. Prior to mounting the component housing on the support, without the third spacer, the first circuit board could be pressed onto the housing shell and electrical short circuits could occur on circuits located on the first circuit board. The third spacer prevents such short circuits through the housing shell by forming an insulating gap between the first circuit board and the housing shell. This protection against short circuits is only relevant for testing purposes after assembly of the component housing and has no further function in the assembled state of the component housing. If such test purposes are not provided, the third spacer can be dispensed with.
    The compactness and stability of the component housing can be further improved by arranging at least a fourth spacer between the heat sink and the first circuit board. The fourth spacer may be preferably resilient and preferably has a substantially hollow cylindrical shape and an axis, wherein the connecting element preferably extends through the hollow cylindrical shape and preferably coincides the axis of the connecting element with the axis of the fourth spacer.
    It proves to be particularly favorable for the compactness and stability, but in particular for the simplicity of the component housing, when at least a fifth spacer between a second spacer and the housing shell is arranged. The first spacer may preferably be arranged on the outer surface of the fifth spacer and the fifth spacer preferably form a common component with the housing cover and preferably have a substantially hollow cylindrical shape and an axis, wherein the connecting element preferably extends through the hollow cylindrical shape and preferably the axis of the connecting element coincides with the axis of the fifth spacer. It is favorable if the second printed circuit board comprises openings through which the fifth spacers can protrude. The compactness and stability, but in particular the simplicity of the component housing, can be additionally assisted if at least one sixth spacer is arranged between the housing cover and the second printed circuit board. The sixth spacer may preferably form a common component with the housing cover and preferably have a substantially hollow cylindrical shape and an axis, wherein the connecting element preferably extends through the hollow cylindrical shape and preferably the axis of the connecting element coincides with the axis of the sixth spacer. The sixth spacer may, for example, protect the printed circuit boards from short-circuiting in direct contact with the component housing, if this consists of an electrically conductive material.
    All of the abovementioned spacers, which form a common component with the housing cover or the housing shell, can preferably be made of the same material as the housing cover or the housing shell itself. If an electrically conductive material is used for its production, care must be taken that those points on the circuit boards, which are in mechanical contact with these spacers, this circumstance by an appropriate routing of the electronic circuits on the circuit boards account or electrical insulation is provided.
    In an additional aspect of the invention, the component housing may be particularly easy to assemble if at least one connecting element is a screw, a plug connection or an adhesive connection, wherein the connecting element is preferably substantially cylindrical.
    But connecting elements can be fixed or solvable depending on the requirement, which brings corresponding cost advantages in component, assembly or maintenance costs. For releasable connections, it is advantageous if fasteners are screws. For solid, particularly cost-effective connections, it is again favorable if connecting elements are plug connections. In addition to bonded connections, which have additional advantages, in particular with regard to stability, cost-effective rivets are also possible. For a simple construction of the individual components, it is helpful if at least one connecting element is substantially cylindrical. For example, the screws, even if they are pointed tapered. There may also be thread grooves, guide grooves or the like on the connecting elements, which are implemented continuously or only partially along the entire surfaces of the connecting elements. A variation of the diameters along the connecting elements may be advantageous, in particular to assist in easy assembly, since, inter alia, it is the surface of the spacers that provides for mechanical cohesion in the assembled state. When using multiple fasteners a different design of the individual fasteners is possible. It is also possible that individual fasteners through all spacers, but other fasteners are not performed by all spacers. This can result in a variety of variations in the assembly, resulting in a particularly favorable and compact overall arrangement depending on the complexity and number of components within a component housing. A particularly favorable arrangement can be given if three connecting elements or spacers fix one or more printed circuit boards in the component housing, as this mechanically-stress-free fastening of the circuit boards is achieved in the component housing, which has a positive effect on the life of the components on the circuit boards and the circuit boards themselves effect. For mechanically particularly stable arrangements more than three connecting elements or spacers can be used, which is particularly advantageous if the components used, for example on the circuit board or the heat sink have a large mass. In this case, it is favorable if resilient spacers are used at suitable locations in order to reduce mechanical stresses in the printed circuit boards. Suitable locations are, for example, positions at which or in the vicinity of large masses are attached. When using more than three connecting elements or spacers, it is advantageous if the component tolerances of, for example, printed circuit boards, heat sink attachments or spacers are particularly accurate in order to minimize the risk of mechanical stress due to an unfavorable, for example, not planning, installation as small as possible. It may be particularly favorable if at least four connecting elements or spacers are used, in particular if an electronic component is used which has a substantially rectangular optical active surface and requires a very precise alignment with other optical system components, such as light sources , for example, along or parallel to a horizontal and vertical axis. By fixing by means of four connecting elements or spacers, two of which are respectively arranged along or parallel to the horizontal and vertical axis, it is ensured that the electronic component on a printed circuit board or in the mounting frame optimally against e.g. Vibrations or unwanted thermal expansions is secured, including the CLGA housing of the electronic component, which is essential for the optical function of the device. For the simple and quick assembly of the component housing and the components contained therein, it is advantageous if the connecting element simultaneously mechanically interconnects a plurality of components. By such a combined assembly cost advantages, as well as smaller and more compact size or, for example, a particularly efficient cooling device.
    An additional development relates to the cooling of the component housing, wherein it is favorable if, when necessary, a powerful cooling device of the heat sink is inserted into a cooling line with an inlet and an outlet and can be flowed through by a cooling medium, and the housing shell preferably has an inlet opening and an outlet opening , wherein in the inlet opening the inlet and in the outlet opening of the outlet of the cooling line is arranged.
    It is thereby achieved that an external cooling device is particularly easy to connect to the component housing. Depending on the required cooling capacity, for example, air or water can serve as a cooling medium, which is moved by a fan or a pump through the cooling line. To obtain a tightness of the cooling device, this is often made as a usually metallic casting. Cooling inlet and cooling outlet may each include a flange to allow easy connection to other components of the cooling system. Depending on the cooling medium used, the use of seals in the flange area may also be useful.
    In order to enable movements of the first circuit board during assembly of the component housing to a holder, it may be advantageous if the inlet opening and the outlet opening are embedded elastically movable in the housing switch. In the simplest case, this can be realized by seals.
    In addition, a further aspect of the invention can ensure that the assembly of the component housing is particularly easy to perform by at least one spacer bracket is present in the mounting area on the outside of the housing shell, which allows access to the optical active surface of the inserted into the component opening electronic component. The spacer bracket prevents the electronic component from detaching from the mounting base during assembly. This is advantageous since the electronic component in the mounting base mechanically does not have a particularly strong mechanical connection and the electronic component could easily fall out of the mounting base, in particular during the assembly of the individual parts. The spacers significantly improve the handling during the assembly of the component housing and the components contained therein. This may become important since such a component housing is usually manufactured and assembled by a vehicle supplier, the final assembly and the connection to the vehicle systems are carried out by vehicle manufacturers, and favorable handling improves assembly as a whole.
    The spacer bracket can additionally take over the aforementioned function of the third spacer in that, in the assembled, but not yet mounted on the bracket component housing, the first circuit board is held by the housing shell at a distance. On the third spacer can be omitted. When the electronic component rests on the spacer bracket, the spacer bracket during assembly of the component housing can push the electronic component and consequently the first circuit board in the component housing, since the first circuit board is firmly connected to the electronic component. Here, the first circuit board of the
    Housing shell pushed away and held at a distance, wherein the spring force of the first spacer holds the arrangement in tension. By this arrangement, the effect of mechanical loading forces on the electronic component in the assembly of the component housing with the holder can be greatly reduced, since these mechanical loading forces are absorbed by the first, resilient spacer.
    Prior to mounting the housing on the bracket, the first circuit board may be pressed onto the housing shell, causing electrical short circuits on circuits located on the first circuit board. As previously described, the third spacer can prevent such short circuits through the housing shell by forming an insulating gap between the housing shell and the first circuit board. This protection against short-circuits is usually only relevant for testing purposes and has no further function in the assembled state of the housing. If such test purposes are not provided, the third spacer can be dispensed with.
    As an alternative to protection against short circuits, an insulating distance between the housing shell and the first circuit board may be formed by the spacer bracket such that the distance of the spacer bracket to the outside of the housing shell also the distance within the component housing between the first circuit board and the inside of the housing shell in the assembled, but not mounted condition, determined. With appropriate choice of the dimensions of the spacer bracket, the same effect can be achieved as a third spacer, which can be dispensed with in this case.
    By using an analog or digital micromirror array as an electronic component, a particularly advantageous embodiment of the optical function of the vehicle headlight results.
    In an advantageous embodiment of the invention, a simple assembly of the component housing with the vehicle headlight is assisted in that it comprises a housing system of a vehicle headlight. This housing system comprises the component housing and a holder for the component housing.
    The mounting in a vehicle headlight is facilitated in a further aspect of the invention by the holder with the housing shell at least through the
    Connecting element is connected and fixed. In this case, no further component for fixing the component housing is needed. Consequently, there is a favorable connection in mechanical as well as economic terms. The housing shell is connected to a holder such that the spacer bracket is exposed through a recess in the holder.
    The holder may have at least one alignment pin for alignment with the electronic component. The electronic component may have at least one corresponding adjustment opening. This can provide for a simple adjustment of the optical components of the component housing with optical components of the vehicle headlight or of the housing system. This is advantageous in particular because the electronic component should lie as exactly as possible at the focal point of an imaging lens arranged in the holder. For this purpose, it is particularly advantageous if the holder comprises a mounting opening through which access to the optical active surface of the electronic component is possible.
    It will be understood that a suitable number of fasteners, spacers and apertures will aid in the mechanical stability of the assembly. However, depending on the requirements, it is not always necessary for all the connecting elements to run through all the spacers or openings in the respective components, or else additional connecting elements are required for reasons of stability. Thus, it may be appropriate that when using a heavy heat sink this is fastened with additional connecting elements, for example on the housing shell, or on the other hand is dispensed with some spacers for cost or weight reasons.
    The invention and its advantages will be described in more detail below with reference to non-limiting embodiments, which are illustrated in the accompanying drawings. The drawings show:
    1 is a view on a chip top of an electronic component according to an embodiment of the invention in the form of a DLP chip,
    2 shows a view of a chip underside of the electronic component,
    3 is a perspective view of a front side of an embodiment of a component housing according to the invention,
    4 is a perspective view of a back of the component housing,
    5 is an exploded view of the component housing and its components,
    6 is a perspective view of two printed circuit boards according to the invention,
    7 is a perspective view of the back of the housing shell with an inserted circuit board and resilient spacers,
    8 is an exploded view of the component housing before mounting with a holder,
    9 is a perspective view of the component housing, which is connected to the holder,
    10 is a perspective view of a component housing according to the invention in an embodiment with cooling,
    11 is a perspective view from the rear of the component housing of FIG. 10,
    12 is an exploded view of the component housing and the components of FIG. 10,
    13 is a perspective view of two circuit boards of FIG. 10,
    14 is a perspective view from the rear of the housing shell of FIG. 10 with an inserted printed circuit board, resilient spacers and a heat sink,
    15 is a rear view of the component housing for both embodiments of FIG. 3 and FIG. 10, which is connected to the holder, and the position of sectional planes A-A, B-B and C-C,
    16 is a side view of the component housing of FIG. 3 in the sectional plane A-A of FIG. 15,
    FIG. 17 shows a side view of the component housing according to FIG. 3 in a housing system in the sectional plane B-B according to FIG. 15, FIG.
    18 is a side view of the component housing in the embodiment with cooling of FIG. 10 in the sectional plane A-A of FIG. 15,
    FIG. 19 shows a side view of the component housing according to FIG. 10 in a housing system in the sectional plane B-B according to FIG. 15, FIG.
    FIG. 20 shows a side view of the component housing according to FIG. 10 in a housing system in the sectional plane C - C according to FIG. 15, FIG.
    21 is a side view of the component housing of FIG. 3 in the sectional plane B-B of FIG. 15,
    FIG. 22 shows a side view of the component housing according to FIG. 3 in a housing system in the sectional plane B-B according to FIG. 15.
    With reference to FIGS. 1 to 20, embodiments of the invention will now be explained in more detail. In particular, important parts are shown for the invention in a headlamp, it being understood that a headlamp contains many other, not shown parts that allow a meaningful use in a motor vehicle, in particular a car or motorcycle. In the figures, only a representative reference numeral for a respective component is drawn, even if the same component is executed several times.
    In the figures, the components of a component housing 110,210 of a vehicle headlight are shown in overview or in various perspectives and sections.
    Fig. 1 and Fig. 2 show an electronic component 1 according to the invention in the form of an analog or digital micromirror array (DLP chip). In Fig. 1, the electronic component 1 is recognizable with its front. The electronic component 1 has an optical active surface 11 (micromirror array) and an adjustment opening 14. FIG. 2 shows the electronic component 1 with its rear side facing away from the front side, which has a thermal active surface 12 and with electrical contacts 13 arranged around it.
    FIGS. 3 to 9 show a first exemplary embodiment of a component housing 110 with its internal structure. FIGS. 10 to 14 show a further exemplary embodiment of a component housing 210 with its internal structure, wherein a cooling device is for connection to an externally arranged housing Provide cooling unit is. The reference numerals in the second embodiment are designated by "2xx" and correspond to those of the first embodiment denoted by "lxx" unless otherwise specified. For simplicity, in the following description, in addition to the reference numerals of the first embodiment in parentheses, the reference numerals of the second embodiment are given.
    Referring to FIG. 3 (FIG. 10), the component housing 110 (220) comprises a housing shell 120 (220) with a mounting position for the electronic component 1. Further, in the region of the mounting position, there is a component opening 121 (221) in which the electronic component Component 1 is arranged. Through the component opening 121 (221) access to the optical active surface 11 of the electronic component 1 is possible. The housing shell 120 (220) can be closed with a housing cover 150 (250). The connection elements 170 (270) serve to establish connections between the housing cover 150 (250) and the housing shell 120 (see FIG. 8). The connecting elements 170 (270) are each inserted along an axis, which are each arranged along or parallel to a line 100 (200) (FIG. 5). In addition, two spacer brackets 122 (222) are arranged on the housing shell 120 (220).
    FIG. 4 (FIG. 11) shows the closed component housing 110 (220), the housing shell 120 (220) and the housing cover 150 (250) in a rear perspective view. In addition, openings for passing through the connecting members 170 (270) are provided to firmly connect the housing cover 150 (250) to the housing shell 120 (220) (see FIG. 8).
    A detailed illustration of the internal structure of the component housing 110 shows an exploded view in FIG. 5 (FIG. 12). The component housing 110 (210) comprises, in addition to the components already mentioned, a first printed circuit board 130 (230) which is connected to the electronic component 1 via its electrical contacts 13 and preferably via a mounting base 15. A plurality of support points 161 (see FIG. 7) lie on the first circuit board 130 (230). At least first spacers 160 (260) are disposed between the support points 161 and the housing cover 150 (250).
    The first spacers 160 (260) are resilient and each has a hollow cylindrical shape. The connecting members 170 (270) each pass through the hollow cylindrical shape, with each axis of the hollow cylindrical shape of the connecting members 170 (270) coinciding with the axis of the first spacers 160 (260).
    Between the first circuit board 130 (230) and the housing cover 150 (250) a second circuit board 132 (232) is arranged, as well as an adapter 133 (233), which may also comprise a flexible circuit board and the circuit boards 130 (230) and 132 (230). 232) connects.
    Between the first circuit board 130 (230) and the electronic component 1, the mounting base 15 is arranged, whereby the electrical contacts 13 of the electronic component 1 are connected to the first circuit board 130 (230).
    Second spacers 151 (251) are interposed between the housing cover 150 (250) and the first spacers 160 (260), forming a common component with the housing
    Housing cover 150 (250) and each have a hollow cylindrical shape. The connecting members 170 (270) each pass through the hollow cylindrical shape with the axis of the connecting members 170 (270) coinciding with the axis of the second spacers 151 (251).
    The fourth spacer 226 (Fig. 20) is arranged only in the second embodiment and will be explained later. Fifth spacers 152 (252) are disposed between the second spacers 151 (251) and the housing shell 120 (220). The first spacers 160 (260) are disposed on the outer surface of the fifth spacers 152 (252). The fifth spacers 152 (252) form a common component with the housing cover 150 (250) and each have a hollow cylindrical shape. The connecting members 170 (270) pass through the respective hollow cylindrical shape, with the axis of the connecting members 170 (270) coinciding with the axis of the fifth spacers 152 (252).
    Sixth spacers 153 (253) are arranged between the housing cover 150 (250) and the second circuit board 132 (232), form a common component with the housing cover 150 (250) and each have a hollow cylindrical shape. The connecting members 170 (270) each pass through the hollow cylindrical shape with the axis of the connecting members 170 (270) coinciding with the axis of the sixth spacers 153 (253).
    6 shows the two printed circuit boards 130 (230) and 132 (232) and the spacers 160 (260) and 151 (251) arranged therebetween in a perspective view. The first spacers 160 (260) are disposed on the outer surface of the fifth spacers 152 (252), the fifth spacers 152 (252) being longer in length than the first spacers 160 (260) and passing through the circuit board 130 (230) ,
    7 shows a view from the rear of the housing shell 120, as well as the inserted printed circuit board 130 and the first spacers 160. The heat sink opening 131 in the first printed circuit board 130 can be seen, whereby access to the thermal active surface 12 of the electronic component 1 is possible and here only Purpose of a better heat dissipation from the electronic component 1 is because no heat sink is used.
    8 shows a perspective view from the front of the closed component housing 110 (210) for mounting on a holder 2. A holder opening 21 for access to the optically active surface 11 of the electronic component 1 and an alignment pin 22 for alignment with an adjustment opening can be seen 14 of the electronic component 1. FIG. 9 shows the assembled arrangement of FIG. 8, wherein the connecting elements 170 (270) firmly connect the housing cover 150 (250) to the housing shell 120 (220), and additionally the mount 2 to the housing shell 120 (220) firmly connect.
    The arrangement mentioned in this example is therefore favorable, since in this way the individual components are fastened to one another and held in position, as well as according to the task the mechanical loading forces are suitably damped.
    In a holder 2, the electronic component 1 in the focal point of a subsequent imaging optics (not shown here) mounted. For this purpose, the holder 2 comprises a holder opening 21, whereby access to the optical active surface 11 of the electronic component 1 is possible.
    The outside of the housing shell 120 (220) has spacer brackets 122 (222) in the mounting area (see FIG. 3), the optical active area 11 of the electronic component 1 inserted into the component opening 121 (221), i. The housing shell 120 (220) is fixed to the holder 2, wherein the spacer brackets 122 (222) are exposed through a recess 23 in the holder 2.
    The holder 2 has alignment pins 22 for alignment with the electronic component 1, and the electronic component 1 at least corresponding adjustment openings 14.
    The fasteners 170 (270) in this embodiment are screws that are detachable and reusable. This connection form facilitates maintenance of the component housing, alternatively plug-in, clampable or adhesive connection elements are possible.
    FIGS. 10 to 14 illustrate a further exemplary embodiment of the component housing 210 with its internal structure, wherein a cooling device is provided for connection to an externally arranged cooling unit. The figures show a heat sink 240 which is connected to the thermal active surface 12 of the first printed circuit board 230 connected to the electronic
    Component 1 is arranged. The first printed circuit board 230 comprises a heat sink opening 231, through which access to the thermal active surface 12 of the electronic component 1 is possible. Otherwise, the same applies according to the embodiments in FIGS. 3 to 9.
    The heat sink 240 is inserted into a cooling line 241 with an inlet 242 and an outlet 243 and through which a cooling medium can flow, and the housing shell 220 has an inlet opening 223 and an outlet opening 224, wherein the inlet 242 in the inlet opening 223 and in the outlet opening 224 the outlet 243 of the cooling line 241 is arranged.
    The inlet opening 223 or the outlet opening 224 on the component housing 210 serves for connection to an external cooling unit, preferably a fan (not shown here). For liquids as cooling medium, a pump is used.
    Depending on the cooling demand, which is based on the power loss of the electronic component 1, various cooling media can be used, for example air, preferably ambient air, or a liquid, preferably water or oil. The liquid may additionally contain, for example, antifreeze additives.
    The embodiment in Fig. 10 corresponds to the embodiment in Fig. 3, wherein in addition a heat sink is provided. 10, the inlet 242 of the cooling line 241 can be seen in the component housing 210. In FIG. 11, the inlet 242 of the cooling line 241 can be seen in the component housing 210.
    FIG. 12 shows, in the exemplary embodiment of the component housing with cooling, the inlet 242 of the cooling line 241, which is arranged in the inlet opening 223 of the housing shell 220. On the heat sink 240 a plurality of support points 262 are defined, on which the resiliently running first spacers 260 rest. The outlet 243 of the cooling line 241, which is arranged in the outlet opening 224 of the housing shell 220, can be seen in FIG. 12.
    FIG. 13 shows the first printed circuit board 230 with the electronic component 1, which is mechanically connectable via springy and hollow cylindrical first spacers 260 to the second printed circuit board 232 by means of the connecting elements 270.
    FIG. 14 shows the rear view of the component housing 210 with housing shell 220, inserted printed circuit board 230 and the first spacers 260. Inserted into the printed circuit board 230 is a heat sink 240 which forms a common component with a cooling line 241, wherein the cooling line 241 has an inlet 242 and an outlet 243. Inlet 242 is passed through the inlet opening 223 of the housing shell 220, outlet 243 is performed through the outlet opening 224 of the housing shell 220. The heat sink 240 is arranged on the thermal active surface 12 of the electronic component 1. The support points 262 lie on the heat sink 240.
    Fig. 15 illustrates the position of sectional planes A-A, B-B and C-C through the component housing 110 of the first embodiment as well as the component housing 210 of the second embodiment. The sectional plane A-A passes through the connecting elements 170, 270. The sectional plane B-B passes through the electronic component 1 and the sectional plane C-C extends away from the electronic component 1 through the component housing 110, 210.
    In Fig. 16, the internal structure of the component housing 110 according to the sectional plane A-A of Fig. 15 is illustrated. Here, in particular, the extent of the second spacers 151 and the fifth spacers 152 can be seen, as well as the arrangement of the first spacers 160 on the outer surface of the fifth spacers 152 and the position of the support points 161.
    The alignment pins 22 with their corresponding adjustment openings 14 can be seen, and the screw through the connecting elements 170, the circuit boards 130,132 and the spacers 160, 260,151,152,153. It is clear that corresponding openings are provided for the passage of the connecting elements by spacers, printed circuit boards, heat sink and housing components.
    The internal structure of the component housing 110 according to the sectional plane B-B of FIG. 15 is illustrated in FIG. 17.
    In Fig. 18, the internal structure of the component housing 210 according to the sectional plane AA of Fig. 15 is illustrated, the example comprising a heat sink 240 which is disposed on the thermal active surface 12 of the electronic component 1 and an external cooling unit (not shown) for active cooling, for example by a fan, can provide.
    In Fig. 19, the internal structure of the component housing 210 according to the sectional plane BB of FIG. 15 is illustrated, which passes through the electronic component 1 and the heat sink 240 with the cooling line 241, wherein the sixth spacers 253 are shown having a common component with form the housing cover 250 and serve to form a distance between the second circuit board 232 and the housing cover. Optionally, the sixth spacers 253 may be hollow cylindrical, such that the connecting elements 270 are performed by the sixth spacers 253, wherein the axes of the sixth spacers 253 may be arranged along or parallel to the line 200, respectively.
    Sixth spacers 253 are arranged between the housing cover 250 and the second circuit board 232, form a common component with the housing cover 250 and each have a hollow cylindrical shape. The connecting elements 270 each extend through the hollow cylindrical shape, wherein the axis of the connecting elements 270 coincides with the axis of the sixth spacer 253.
    FIG. 20 illustrates the internal structure of the component housing 210 according to the sectional plane C-C of FIG. 15, wherein the fourth spacers 226 are disposed between the heat sink 240 and the first circuit board 230. The fourth spacers 226 each have a hollow cylindrical shape. The connecting elements 270 each extend through the hollow cylindrical shape, wherein the axis of the connecting elements 270 coincides with the axis of the fourth spacer 226.
    If the fourth spacers 226 are designed to be resilient, the effect of mechanical loads acting on the heat sink 240, for example in the form of vibrations, can be reduced.
    FIGS. 21 and 22 show the function during assembly of the component housing 110 according to the invention. The same applies mutatis mutandis to both aforementioned embodiments.
    In Fig. 21, the assembled component housing 110 (220) is shown. The resilient first spacers 160 (260) press the first circuit board 130 (230) against the housing shell 130 (230). The electronic component 1 abuts against the two spacer brackets 122 (222).
    If the component housing 110 (220) is mounted on the holder 2, it can be seen from FIG. 22 that the electronic component 1 is pressed into the component housing 110 (220) by the holder in the region of the holder opening 21. The first spacer 160 (260) is compressed and the first circuit board 130 (230) is spaced from the housing circuit 120 (22) with a counterforce exerted by the spring tension of the material of the first spacer 160 (260). The second circuit board 132 (232) is electrically and mechanically coupled to the first circuit board via the adapter and is slid in parallel with the first circuit board 130 (230).
    The adjusting opening 14 of the electronic component 1 can receive the adjusting pin 22 of the holder 2 and the spacer brackets 122 (222) extend through the recesses 23 of the holder 2. The electronic component 1 is no longer applied to the spacer brackets 122 (222).
    The following reference numerals are used below: 1 Electronic component 11 Optical active surface of the electronic component 12 Thermal active surface of the electronic component 13 Electrical contacts of the electronic component 14 Adjustment opening of the electronic component 15 Mounting base for electronic component 2 Holder 21 Holder opening for electronic component in holder 22 Justierstift der Holder 23 Recess in holder 3 Housing system 100,200 Line through mounting axis 110,210 Component housing 120,220 Housing shell 121.221 Component opening in housing shell 122.222 Spacer bracket 223 Inlet opening in housing shell 224 Outlet opening in housing shell 225 Fourth spacer 130.230 First PCB 131.231 Cooler connector in first PCB 132.232 Second PCB 133.233 Adapter between first and second Circuit board 240 Heat sink 241 Cooling line 242 Inlet of cooling line 243 Outlet of cooling line 150.250 Housing edeckel 151.251 Second spacer 152.252 Fifth spacer 153.253 Sixth spacer 160.260 First spacer (spring-loaded, elastically deformable) 161 Support point of the spacer on PCB 262 Support point of the spacer on heat sink 170.270 Connecting element
    权利要求:
    Claims (18)
    [1]
    claims
    1. component housing (110, 210) of a vehicle headlamp, comprising an electronic component (1) with an optical active surface (11) on a front side and a thermal active surface (12) and electrical contacts (13) on a, the front side facing away from back marked by a housing shell (120, 220) having a mounting position for the electronic component (1) and a component opening (121, 221) located in the region of the mounting position, in which the electronic component (1) is arranged and through which access to the optical active surface (11) of the electronic component (1) is possible, - a first printed circuit board (130, 230), with which the electronic component (1) via its electrical contacts is connectable, - a housing cover (150, 250), with the housing shell (120,220) is closable, - at least a first spacer (160, 260) between an associated support point (161, 262) and the housing cover (150,250) ang is arranged, wherein the support point (161, 262) on the first circuit board (130, 230) or on a heat sink (240) on the first circuit board (130,230) and on the thermal effective surface (12) of the electronic component (1). is provided, wherein at least one connecting element (170, 270) is provided for establishing a connection between the housing cover (150, 250) and the housing shell (120, 220), which is preferably insertable along an axis that is transverse to the first circuit board (130, 230 ) is arranged running.
    [2]
    Second component housing (110, 210) according to claim 1, characterized in that the first circuit board (130, 230) comprises a heat sink opening (131,231) through which access to the thermal effective surface (12) of the electronic component (1) is possible.
    [3]
    3. component housing (110, 210) according to claim 1 or 2, characterized in that at least the first spacer (160,260) is resilient and preferably has a substantially hollow cylindrical shape, wherein the connecting element (170, 270) preferably by the hollow cylindrical shape and preferably the axis of the connecting element (170, 270) coincides with the axis of the first spacer (160, 260).
    [4]
    4. component housing (110, 210) according to any one of claims 1 to 3, characterized in that between the first circuit board (130, 230) and the housing cover (150, 250) at least a second circuit board (132,232) is arranged and at least one adapter (133, 233), which preferably comprises a flexible printed circuit board and which connects the circuit boards (130, 132, 230, 232).
    [5]
    5. component housing (110, 210) according to one of claims 1 to 4, characterized in that between the first circuit board (130, 230) and the electronic component (1) a mounting base (15) is arranged, whereby the electrical contacts (13 ) of the electronic component (1) are connected to the first printed circuit board (130, 230).
    [6]
    6. component housing (110, 210) according to one of claims 1 to 5, characterized in that at least a second spacer (151, 251) between the housing cover (150, 250) and the first spacer (160, 260) is inserted, wherein the second Spacer (151,251) preferably forms a common component with the housing cover (150,250) and preferably has a substantially hollow cylindrical shape, wherein the connecting element (170, 270) preferably through the hollow cylindrical shape and preferably with the axis of the connecting element (170, 270) the axis of the second spacer (151, 251) coincides.
    [7]
    7. component housing (110, 210) according to one of claims 1 to 6, characterized in that at least a third spacer between the housing shell (120, 220) and the first circuit board (130, 230) is arranged, wherein the third spacer is preferably a common component with the housing shell (120, 220) forms and preferably has a substantially hollow cylindrical shape, wherein the connecting element (170, 270) preferably through the hollow cylindrical shape and preferably the axis of the connecting element (170, 270) with the axis of the third Spacer collapses.
    [8]
    8. component housing (110, 210) according to one of claims 1 to 7, characterized in that at least a fourth spacer (225) between the heat sink (240) and the first circuit board (130, 230) is arranged, wherein the fourth spacer ( 225) is preferably resilient and preferably has a substantially hollow cylindrical shape, wherein the connecting element (170, 270) preferably extends through the hollow cylindrical shape and preferably the axis of the connecting element (170, 270) coincides with the axis of the fourth spacer (225).
    [9]
    9. component housing (110, 210) according to one of claims 6 to 8, characterized in that at least a fifth spacer (152,252) between a second spacer (151, 251) and the housing shell (120, 220) is arranged, wherein the first Spacer (160,260) is preferably arranged on the outer surface of the fifth spacer (152, 252) and the fifth spacer (152, 252) preferably forms a common component with the housing cover (150, 250) and preferably has a substantially hollow cylindrical shape, wherein the connecting element (170, 270) preferably passes through the hollow cylindrical shape and preferably the axis of the connecting element (170, 270) coincides with the axis of the fifth spacer (152, 252).
    [10]
    10. component housing (110, 210) according to one of claims 4 to 9, characterized in that at least a sixth spacer (153,253) between the housing cover (150,250) and second circuit board (132, 232) is arranged, wherein the sixth spacer (153 , 253) preferably forms a common component with the housing cover (150, 250) and preferably has a substantially hollow cylindrical shape, wherein the connecting element (170, 270) preferably extends through the hollow cylindrical shape and preferably the axis of the connecting element (170, 270) with the Axis of the sixth spacer (153, 253) coincides.
    [11]
    11. The component housing (110, 210) according to any one of claims 1 to 10, characterized in that at least one connecting element (170, 270) is a screw, a plug connection or an adhesive connection, wherein the connecting element (170, 270) is preferably substantially cylindrical is.
    [12]
    12. component housing (110, 210) according to one of claims 1 to 11, characterized in that the cooling body (240) in a cooling line (241) with an inlet (242) and an outlet (243) is inserted and can be flowed through by a cooling medium and the housing shell (220) preferably has an inlet opening (223) and an outlet opening (224), in the inlet opening (223) the inlet (242) and in the outlet opening (224) the outlet (243) of the cooling line (241 ) is arranged.
    [13]
    13. component housing (110, 210) according to one of claims 1 to 12, characterized in that in the mounting area on the outside of the housing shell (120, 220) at least one spacer bracket (122, 222) is included, the access to the optical effective surface ( 11) of the electronic component (1) inserted into the component opening (121, 221).
    [14]
    14. component housing (110, 210) according to one of claims 1 to 13, characterized in that the electronic component (1) is an analog or digital micromirror array.
    [15]
    15. housing system (3) of a vehicle headlamp, characterized in that a component housing (110,210) according to one of claims 1 to 14 and a holder (2) is included, wherein the holder (2) with the housing shell (120, 220) at least through the connecting element (170, 270) is connectable.
    [16]
    16. housing system (3) according to claim 15, characterized in that the housing shell (120, 220) with a holder (2) is connected such that by a recess (23) in the holder (2) of the spacer bracket (122, 222 ) is free.
    [17]
    17. Housing system (3) according to claim 15 or 16, characterized in that the electronic component (1) has at least one corresponding adjustment opening (14) and the holder (2) has at least one alignment pin (22) for alignment with the adjustment opening (14). of the electronic component (1).
    [18]
    18. housing system (3) according to any one of claims 15 to 17, characterized in that the holder (2) comprises a support opening (21), wherein through the support opening (21) access to the optical active surface (11) of the electronic component (1) is possible.
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    同族专利:
    公开号 | 公开日
    EP3423747B1|2020-01-01|
    AT518344B1|2019-02-15|
    CN109073191B|2020-11-27|
    US10488007B2|2019-11-26|
    EP3423747A1|2019-01-09|
    JP6591086B2|2019-10-16|
    KR20180113611A|2018-10-16|
    WO2017147632A1|2017-09-08|
    CN109073191A|2018-12-21|
    JP2019512840A|2019-05-16|
    US20190316752A1|2019-10-17|
    KR102112304B1|2020-05-19|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50169/2016A|AT518344B1|2016-03-03|2016-03-03|Component housing of a vehicle headlight|ATA50169/2016A| AT518344B1|2016-03-03|2016-03-03|Component housing of a vehicle headlight|
    US16/080,743| US10488007B2|2016-03-03|2017-02-22|Component housing of a vehicle headlight|
    JP2018545973A| JP6591086B2|2016-03-03|2017-02-22|Component housing for vehicle floodlight|
    KR1020187027548A| KR102112304B1|2016-03-03|2017-02-22|Component housing of vehicle headlight|
    EP17711065.7A| EP3423747B1|2016-03-03|2017-02-22|Component housing of a vehicle headlight|
    PCT/AT2017/060041| WO2017147632A1|2016-03-03|2017-02-22|Component housing of a vehicle headlight|
    CN201780027528.XA| CN109073191B|2016-03-03|2017-02-22|Housing for a structural component of a vehicle headlight|
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