• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
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  • 优先权
    • 专利摘要:
    Cutting station (1), installation and method for separating the lateral edge (3) of the waffle blocks (2) running parallel to the cutting direction and optionally for breaking the waffle blocks (2), comprising at least one cutting body (7) arranged in a cutting area (6) ) which projects beyond the conveying surface (5) at least by the thickness (8) of the waffle block (2), a sliding device (11) movably arranged along the cutting direction (9) and driven by a drive (10) for pushing through individual wafer blocks (2). or individual wafers block stack by the cutting area (6), which is formed such that the sliding device (11) comprises a first sliding body (12) and a second sliding body (13), wherein the first sliding body (12) and the second sliding body (13) via at least one drive (10, 19, 20) along or in the direction of the cutting direction (9) are arranged movably, and wherein the second sliding body (13) relative to the e The first sliding body (12) is movably arranged via at least one drive (10, 20).
    公开号:AT516482A1
    申请号:T742/2014
    申请日:2014-10-02
    公开日:2016-05-15
    发明作者:Johannes Haas；Josef Haas；Stefan Jiraschek；Günter Pirklbauer；Gerhard Liebermann
    申请人:Haas Food Equipment Gmbh；
    IPC主号:
    专利说明:

    Cutting station, system and method for making waffle products
    The invention relates to a cutting station, a plant for producing end products by cutting flat wafers blocks and a method for cutting waffle blocks and in particular for separating the lateral, parallel to the cutting direction edge of the waffle blocks.
    Waffle blocks are intermediates for the production of baked products, which preferably have multi-layered waffle layers. These wafer layers are crispy, brittle and / or thin-walled waffle layers which are baked in a baking machine with peripherally arranged, lockable baking tongs under increased pressure. Subsequently, the individual wafers are coated or filled with a mass, such as a cream, and placed on top of each other in several layers. The wafer blocks thus produced have, for example, a size of about 40 × 80 cm, in particular of 35 × 73 cm, and a thickness of about 7 mm to 3 cm. The products to be produced therefrom are known, inter alia, as waffle slices and usually have the shape of a bite-sized cuboid. To make these products, the edge of the wafer blocks must be cut or cut so that the outer edges of the wafer block have a desired smooth shape. The waffle blocks manufactured as an intermediate product do not have a homogeneous edge area, since on the one hand the waffle sheets can not be evenly spread to the edge with the cream and on the other hand the edge of the waffle sheets can not be given an exactly predeterminable shape during the baking process.
    Furthermore, the relatively large wafer blocks must be cut to form cuboid and edible end products. Optionally, the wafer blocks are divided by inclined cutting bodies into prismatic end products, for example having a trapezoidal profile. Preferably, the wafer blocks are divided by two substantially orthogonal cuts so that end products are formed having substantially rectangular bases.
    The cutting of the waffle blocks is done according to the prior art in that a waffle block is pushed through a cutting frame. Cutting wires or cutting bands are stretched in the cutting frame. By pushing, the waffle block is cut by the cutting wires or cutting bands. After being pushed through the first cutting frame, the block is pushed through a second cutting frame, wherein the first cutting direction and the second cutting direction are 90 ° to each other. By this second cut, the desired end products are formed.
    A disadvantage of the devices of the prior art is that when cutting the wafer blocks often comes to break out of wafer parts in the edge region and in particular in the rear corner regions. This increases rejects and thus reduces the efficiency of the entire process for producing the final products.
    The breaking of the corners can be prevented in the prior art, that a relatively wide edge is cut off. However, this also reduces the efficiency of the process because the wide cut edge also falls as a reject path.
    Thus, according to the prior art, there is a trade-off in the improvement of the efficiency, which is in particular a trade-off between the separation of the smallest possible edge and the break-free separation of the edge.
    The object of the invention is now to solve this conflict of goals.
    It has been found, in a manner which is surprising to a person skilled in the art, that the break-out of the corners can be prevented or at least reduced if the waffle block is pushed or pushed through the cutting area at the rear end side of the edge of the waffle block. The rear face of the waffle block is that side of the waffle block that is rearward in the cutting direction, that side on which a slide body engages to push the waffle block into or through the cutting area.
    The rear end face of the edge of the waffle block is that area of the waffle block which lies on the rear end face of the waffle block, in the region of the edge which is to be separated by the cutting body or bodies. Thus, during the cutting process, the device according to the invention supports the waffle block in the area of the rear end side of the edge to be cut off.
    In order to keep the edge to be cut according to the invention as narrow as possible, the cutting bodies, in particular the outer cutting bodies for separating the edge, are arranged as far outside as possible.
    Since the sliding body has to push the waffle block through the cutting area, an exemption must be provided in the sliding body for each cutting body so that the sliding body does not collide with the cutting body or bodies when the waffle block is pushed through the cutting area. In the narrow edge area, however, this means that the distance between the side edge of the sliding body and the first clearance for the cutting body for separating the edge corresponds at most to the width of the edge. This border width is for example 3 mm. After deducting the tolerance of the playful leadership of the sliding body remains as a lateral portion of the sliding body only a thin web is left, which is not adapted to cause sufficient support of the rear end side of the edge.
    The object according to the invention is therefore achieved, in particular, in that the sliding device comprises a first sliding body and a second sliding body, the first sliding body and the second sliding body being movable or moved via a drive, optionally via a plurality of drives, along or in the direction of the cutting direction, and in that the second sliding body is relative to the first sliding body via at least one drive is arranged movable.
    More particularly, the invention relates to a waffle block cutting station for separating the lateral edge of the waffle blocks parallel to the cutting direction and optionally breaking the waffle blocks, comprising a machine frame having a conveying surface along which the waffle blocks are transported, at least one cutting body disposed in a cutting region, at least the thickness of the conveying surface the waffle block projects beyond, a along the cutting direction movably arranged and driven by a drive sliding device for pushing individual waffle blocks or individual waffle block stack through the cutting area, which is formed so that the waffle block or the waffle block stack is severed by the cutting body along the cutting direction and cut in particular in the edge region, wherein the sliding device comprises a first sliding body and a second sliding body, wherein the first sliding body u and the second sliding body is arranged to be movable along at least one drive along or in the direction of the cutting direction, and that the second sliding body is movably arranged relative to the first sliding body via at least one drive.
    Optionally, it is provided that the second sliding body has an exemption, which is configured such that a part of the second sliding body, preferably at least the front edge of the second sliding body, is movable past the cutting body through the cutting area, so that a waffle block from the second sliding body completely through the cutting area is slidable, and that the exemption, in particular from the side edge of the second
    Sliding body is limited and arranged laterally outside the second sliding body, or extends as a slit-shaped incision in the second sliding body.
    Optionally, it is provided that the release extends substantially from the front edge of the second sliding body along the cutting direction to the rear, in particular against the cutting direction.
    Optionally, it is provided that the first slide body for pushing the wafer block into the cutting area extends laterally to and into the region of the edge of the wafer block to be severed and, in particular, engages the rear end side of the edge to push the wafer block into the cutting area the second sliding body is engageable with the first sliding body by at least one drive in a sliding position, in which the second sliding body and the first sliding body attack together on the rear end side of the wafer block to push the wafer block into the cutting area.
    Optionally, it is provided that the second sliding body relative to the first sliding body can be brought by at least one drive in a push-through position in which the second sliding body projects beyond the first sliding body in the cutting direction and in which the cutting body is in the release of the second sliding body, so that the second sliding body the cutting area projected in the cutting direction and the waffle block is pushed completely through the cutting area and possibly beyond the cutting area out.
    Optionally, it is provided that in the cutting direction after the cutting area at least one laterally arranged Randabfallleitmittel is provided, or that in the cutting direction after the cutting area on both sides two Randabfallleitmittel provided with the Randabfallleitmittel extending away from the conveying surface, so that the separated edge of the wafer blocks is removed from the conveying surface.
    Optionally, it is provided that the first sliding body is stopped in the cutting position in the cutting direction in front of the Randabfallleitmittel and optionally retracted.
    Optionally, it is provided that a first drive for driving the first slide body is provided, that a second drive for moving the second
    Sliding body is provided and that the second sliding body on the second drive, the first sliding body is excellently extendable.
    Optionally, it is contemplated that the cutter body is rigidly connected to the machine and that the feed for cutting the wafer block is made by the movement of the waffle block by the shifter
    Optionally, it is provided that the cutting body is a cutting wire mounted in a cutting frame or a cutting tape clamped in a cutting frame.
    Optionally, it is provided that two cutting bodies are provided, wherein a cutting body in the left edge region and a cutting body in the right edge region is arranged, so that when pushing through the wafer block by the
    Cutting area simultaneously cut off the left and right edges of the waffle block.
    Optionally, it is provided that three or more cutting body are provided, wherein a cutting body in the left edge region and a cutting body in the right edge region is arranged and that at least one cutting body between the cutting body in the left edge region and the cutting body in the right edge region is arranged so that when pushing the wafer block through the
    Cutting area simultaneously cut off the left and right edges of the waffle block and at the same time the waffle block in the middle region, between the two edges, is cut.
    Optionally, it is provided that a first guide surface and a second guide surface are provided, that the two guide surfaces protrude from the conveyor surface and extend substantially along the cutting direction and that the guide surfaces are spaced apart substantially corresponding to the width of the wafer block arranged between the guide surfaces, so that the Waffle block is cut laterally when cutting.
    Optionally, the invention relates to a plant for producing end products by cutting flat waffle blocks, in particular flat or
    Hollow waffle blocks, wherein in the plant an input station for the blocks, at least one cutting station for cutting the blocks and an output station for the end products are provided.
    Optionally, it is provided that in the input station, a first conveying direction is provided, along which the wafer blocks of the first cutting station are supplied and that the cutting direction deviates from the first conveying direction, transverse to the conveying direction and / or normal to the conveying direction, or that the cutting direction with the first conveying direction Optionally, it is provided that a second cutting station is provided with a second cutting direction, and that the second cutting direction deviates from the first cutting direction, and in particular transversely or normal to the first
    Cutting direction runs.
    Optionally, it is provided that the second cutting station comprises at least a second cutting body, preferably a plurality of second cutting body and a second shifter, so that the previously cut in the first cutting station and optionally cut wafer block is cut by pushing through the second cutting area a further time.
    Optionally, it is contemplated that the installation may be placed in or is in a first position by the drives of the shifters, in which the first cutting station pusher, in particular the second pusher body thereof, projects beyond the first cutting area and in which the second pusher is in a retracted position the waffle block is pushed from the first pusher into the second cutting station.
    Optionally, the invention relates to a method for cutting flat wafers, in particular flat or hollow waffle blocks, optionally to form end products, comprising the following steps:
    Feeding a wafer block along a first conveying direction into the first cutting station,
    Moving the pusher in the cutting direction so that the wafer block is conveyed into and through the cutting area,
    Stopping the first sliding body in front of the Randabfallleitmittel,
    Advancing the second sliding body in the cutting direction, so that the second sliding body projects beyond the first sliding body in the cutting direction and the wafer block is conveyed further in the cutting direction.
    Optionally, it is provided that, when pushing through the wafer block, the edges of the wafer block which are in the cutting direction are cut off by two laterally arranged cutters.
    Optionally, it is provided that, as the wafer block is pushed through, the wafer block is severed by a cutting body remote from the edge in the center region along the cutting direction.
    Optionally, it is contemplated that the waffle block, optionally cut into multiple pieces in the first cutting station, is conveyed to the second cutting station and cut there along a second cutting direction, the second cutting direction being deviated from the first cutting direction, transverse to the first cutting direction, and / or normal runs to the first cutting direction.
    Optionally, it is provided that the waffle block, which may have been cut into a plurality of parts in the first cutting station, is conveyed from the second sliding body into the second cutting station and cut there along a second cutting direction, the second cutting direction being deviated from the first cutting direction, transverse to the first cutting direction, and / or normal to the first cutting direction.
    Optionally, when cutting the waffle block, the edges of the waffle block lying laterally in the second cutting direction are cut off by two laterally arranged cutting bodies of the second cutting station. Optionally, when cutting the waffle block in the second cutting station, the waffle block is removed from the edge along the second one by a cutting body Cutting direction is cut.
    Optionally, it is contemplated that in the first cutting station a waffle block will be completely pushed through the cutting area of the first cutting station and optionally conveyed to the second cutting station, or in the first cutting station a waffle block stack will be pushed completely through the cutting area of the first cutting station and optionally fed into the second cutting station ,
    Optionally, it is provided that the first cutting direction deviates from the first conveying direction and in particular runs transversely to the first conveying direction, or that the first cutting direction coincides with the first conveying direction.
    Optionally, it is provided that the first cutting direction deviates from the second cutting direction, and in particular that the first cutting direction and the second cutting direction are normal to each other.
    The cutting station according to the invention, the installation according to the invention and the method according to the invention are designed and / or suitable for the industrial production of baked products. Preferably, the cutting stations have a throughput of greater than 10, optionally up to 14, wafer blocks per minute. The plant preferably comprises an elongate machine frame which is positioned "in-line" in an industrial production line substantially along the production direction of a bakery, a sandwich forming station, a stacking station, and interposed pens.
    Preferably, the wafer blocks are stacked individually or stacked in the first cutting station and cut. The cutting in the second cutting station may extend to a plurality of wafer blocks per cutting stroke. Preferably, in the second cutting station, two wafer blocks per cutting stroke are at least partially cut so that the cut per cutting stroke traverses an interface of two successively arranged wafer blocks. Thus, in the second cutting station, a waffle block is pushed through the subsequent waffle block through the cutting area.
    When cutting the wafer blocks, it must be ensured, in particular in the first cutting station, that the individual parts are not separated from one another after the cutting process, but are pressed against one another or conveyed or transported adjacent to one another in block form. Otherwise, no exact cuts could be made in the second trimming station, nor could the transfer to a downstream packaging machine be in the desired order.
    To achieve the object according to the invention, it is proposed that there are two sliding bodies, the second sliding body being designed to be extendible relative to the first sliding body.
    The first sliding body extends laterally to or into the region of the rear end side of the rim and supports the waffle block in this area. For cutting the edge, the waffle block is at least partially pushed through the cutting region, in particular by the first sliding body. In this case, the lateral edges of the waffle block are separated and preferably removed by arranged behind the cutting edge Randabfallleitmittel. Just before the edge waste guide, in particular just after the cutting area or just after the cutting body, the first slide body is stopped to prevent the first slide body from colliding with the edge waste lubricant. The second sliding body has exemptions, which are arranged substantially in the region of the cutting bodies and extend in a groove-like or cut-out manner along the cutting direction into the sliding body. As a result of these exemptions, the second sliding body can be moved at least partially through the cutting area without a collision occurring between the second sliding body and the cutting bodies and, if appropriate, the edge waste guiding means. By virtue of this extensibility, the waffle block can be supported right up to the edge scraping guide along its entire rear face and along the trailing edge of the edge, in particular, to prevent breakage of the trailing edges. Only to complete pushing through or further transport of Waffelblocks stops the first sliding body and the second sliding body takes over the further promotion.
    In particular, the second sliding body has a lateral clearance for that cutting body which is adapted to cut off the edge of the wafer block. By this exemption, the side edge of the second sliding body is preferably formed. The first sliding body is designed, for example, narrow or web-shaped and has a lateral extension, which corresponds approximately to the width of the edge or the edge to be cut off. Optionally, a gap is provided between the lateral edge of the second sliding body and the first sliding body, which preferably is similar or the same as the
    Extensions extends along the cutting direction from the front edge of the sliding body to the rear, so that when partially sliding the sliding body through the cutting area of the sliding body does not collide with the cutting body.
    Optionally, the second slide body is disposed or supported on the first slide body. Optionally, the first sliding body comprises only lateral narrow extensions which have a lateral width approximately equal to the width of the rim. Optionally, the first sliding body and the second sliding body together form a sliding body that supports the waffle block substantially along its entire rear face. Optionally, the first slide body and the second slide body together form a slide body which sufficiently supports the wafer block along its end face, so that no reduction in the efficiency of the manufacturing process occurs.
    The second sliding body is preferably formed and / or arranged such that the wafer block can be moved through the cutting area and into the second cutting station. For this purpose, the clearances in the second sliding body are designed such that a complete pushing through of the waffle block by the cutting area and, if necessary, a further conveyance of the waffle block is made possible in a region spaced from the cutting area. This area arranged at a distance from the cutting area is located, for example, in the second cutting station.
    The invention will be further described by means of concrete embodiments and with reference to the figures.
    Fig. 1 shows an oblique view of a system according to the invention comprising a cutting station according to the invention.
    Fig. 2 shows a detailed view of an oblique view of a plant according to the invention comprising a cutting station according to the invention.
    Fig. 3 shows a detailed oblique view of a cutting station according to the invention.
    Fig. 4a shows an arrangement of a first sliding body with a second sliding body in a first position.
    Fig. 4b shows an arrangement of a first sliding body with a second sliding body in a second position.
    Fig. 1 shows a plant for manufacturing end products by cutting wafer blocks, the plant comprising an input station 22, a cutting station 1 for cutting and / or cutting blocks, and an output station 23 for the final products. About the input station 22, the waffle blocks, coming from a plant for the production of wafer blocks, transported towards the cutting station 1. The present embodiment comprises a first cutting station 26 and a second cutting station 27. The input station or conveyor of the input station is particularly designed as a belt or belt conveyor. In the input station, the wafer block is moved along the first conveying direction 25. Preferably, the first conveying direction 25 corresponds substantially to the direction along which the waffled blocks are moved during their production.
    The wafer blocks are subsequently transferred individually or stacked to the first cutting station 26. The first cutting station 26 has a cutting direction 9 along which the wafer blocks or waffle block is cut. Preferably, the cutting direction 9 is substantially normal to the first conveying direction 25. This causes a cutting transverse to the first conveying direction 25 is effected. The first cutting station comprises a sliding device 11. In this embodiment, the sliding device 11 comprises a first sliding body 12 and a second sliding body 13. Further, at least one drive 10 is provided, via which the sliding bodies 12, 13 can be moved along the cutting direction 9. Optionally, as in the present embodiment, the first cutting station has a first drive 19 for the first sliding body over which the first sliding body can be moved along the cutting direction 9. The second sliding body 13 also has a drive 10, namely the second drive 20, which is designed in particular as a separate drive.
    This drive allows, according to the present embodiment, a displacement of the second sliding body with respect to the first sliding body. This displacement is driven by the second drive 20 and preferably extends substantially along the cutting direction 9. Preferably, the cutting station comprises a conveying surface 5. Along this conveying surface or lying on this conveying surface 5, the wafer block is pushed by the sliding bodies.
    The first cutting station 26 includes a cutting area 6. In this cutting area 6, a cutting body 7 is provided. In particular, at least one cutting body 7 is provided. Preferably, at least two cutting bodies 7 are provided, wherein a cutting body 7 is arranged for cutting off the left edge and a cutting body 7 for cutting off the right edge. According to the present embodiments, a plurality of, in particular four, cutting bodies 7 are provided which, in addition to separating the edge, also effect further cuts so that the waffle block is divided into several parts as the waffle block is pushed or conveyed to the skip by the cutting region 6. Preferably, each cutting body is designed as a cutting wire or cutting tape. The cutting wires may be provided and / or clamped in a cutting frame 21. The cutting frame is preferably rigidly connected to the machine frame and optionally tilted so that the waffle block is pressed against the conveying surface during cutting. In the sliding bodies, in particular in that sliding body, through which the waffle block is pushed through the cutting area, exemptions 14 are provided. The exemptions 14 are provided laterally in the region in which the cutting bodies 7 are arranged, so that the cutting bodies 7 can be introduced into the exemptions 14 when the wafer block is pushed through the cutting area, without there being any collision between the sliding body and the cutting body or bodies. 7kommt. Subsequent to the cutting region 6, edge waste-conveying means 32 are provided in the cutting direction 9. These are designed as curved sheets in the present embodiment. The edge waste guide means 32 serve to discharge the cut edge from that part of the waffle block which is further processed into finished products. In particular, the Randabfallleitmittel 32 are formed such that the separated edge is guided laterally and out of the plane of the conveying surface 5 during advancement of the wafer block.
    The first cutting station 26 is followed by a second cutting station 27 in this embodiment. The second cutting station 27 may be constructed identically to the first cutting station 26, the second cutting direction 28 of the second cutting station 27 being transverse to the cutting direction 9 of the first cutting station 26. Thereby, the wafer block may be cut in two different directions, particularly to form end products.
    In the present embodiment, the second cutting station 27 has a different configuration than the first cutting station 26. Thus, the second cutting station comprises a second pusher 30, which merely comprises a sliding body. The second pusher 30 conveys the wafer block to be cut into a second cutting direction 28, in particular through a second cutting region provided with second cutting bodies 29.
    Spaced apart, preferably substantially parallel spaced from the conveying surface 5, preferably at least one, optionally two or more hold-downs 31 are provided. These have a distance from the conveying surface, so that the waffle block fits between the hold-down and the conveying surface and is guided if necessary, so that the hold-down can function as a hold-down in the technical sense. In particular, the hold-down serves as a hold-down against the cutting forces acting on the waffle block.
    In the present embodiment, the wafer blocks are not necessarily conveyed individually by the cutting area of the second cutting station. Rather, according to the present configuration, a first waffle block or a first waffle block stack is conveyed into the first cutting station. There, the waffle block or block of wafers is pushed by the pusher through the cutting area of the first cutting station and further conveyed to the second cutting station. In the normal mode, at this time, there is a previous waffle block or wafers block stack in the second cutting station partially cut by the second cutting body 29. In this case, the preceding waffle block or waffle block stack is advanced at least so far that the subsequent waffle block or waffle block stack can be introduced into the second cutting station. For this, the second pusher is brought to a retracted position so that there is sufficient space to accommodate the subsequent waffle block or wafers block stack. When the subsequent waffle block, which, like the previous waffle block, has been cut in the first cutting station in the first cutting direction, is deposited in the second cutting station, the second pushing device 30 starts and pushes the succeeding wafer block at least partially through the cutting area of the second together with the preceding waffle block cutting station. At this time, the second shifter 30 pushes the succeeding waffle block to the preceding waffle block. As a result, the preceding waffle block is pushed completely through the cutting area of the second cutting station. The subsequent waffle block is pushed only so far through the cutting area of the second cutting station that on the one hand another subsequent waffle block can be introduced into the second cutting station and on the other hand that the second pusher does not collide with the second cutting bodies 29 and if necessary the last strip of the subsequent waffle block is at least cut. In this position, the second pusher is retracted again so that a further waffle block can be inserted into the second cutting station.
    In contrast to the first cutting station where the wafer blocks or wafer block stacks are individually cut, in the second cutting station two waffle blocks or wafer block stacks are cut with a cutting stroke wherein the previous, already cut waffle block or waffle block stacks are completely completely cut and the subsequent waffle block or waffle block stacks are at least cut.
    2 shows a detailed view of an oblique view of a plant according to the invention. The plant and in particular the first cutting station are in a position in which the pusher 11 has traveled in the direction of the cutting region 6. Also in the second cutting station 27, the second pusher 30 is disposed in a central position. For example, in this center position it is not possible to convey the waffle block from the first cutting station to the second cutting station. Such a position results, for example, during the advancement of the second pushing device 30 for pushing a waffle block through the cutting region of the second cutting device.
    The sliding device 11 comprises a first sliding body 12, as well as a second sliding body 13. One of the sliding bodies, in particular the second sliding body 13, comprises exemptions 14. These clearances 14 essentially extend slotted from the front edge 16 of the second sliding body 12 along the cutting direction to the rear. The distance of the reliefs substantially corresponds to the spacing of the cutting bodies 7. The cutting bodies 7 are preferably formed as cutting wires clamped in a cutting frame 21. The sliding device 11 has at least one drive 10. This drive 10 is adapted and adapted to move the slide body (s) so that the waffle block can be slid through the cutting area. Preferably, according to this embodiment, two drives are provided. The first drive 19 is configured to move the first slide body 12 along the cutting direction 9. The first drive 19 is in all embodiments of the invention, for example, designed as a linear drive, which is provided below the conveying surface 5, but with an element protrudes through the conveying surface to drive the first sliding body 12. The second drive 20 is configured to move the second slide body 13 in the cutting direction 9. Optionally, the drive 10, in particular the second drive 20, is mounted on the first slide body 12 for moving the second slide body 13 so that the second slide body 13 is moved via the second drive 20 can be extended or moved relative to the first slide body 12.
    The second sliding body 13 has a side edge 15. In particular, the second sliding body 13 has two side edges 15. The spacing of these two side edges 15 is substantially equal or slightly smaller than the spacing of the outermost two cutting bodies. Thus, the distance between the two side edges 15 is substantially equal to the width of the waffle block after separation of the side edges, optionally less a small amount of tolerance.
    The first sliding body 11 preferably also extends into the region in which the edge of the uncut wafer block is arranged. The width of the first slider thus substantially corresponds to the entire width of the uncut waffle block, that is, the width of the two edges plus the width of the edge trimmed waffle block.
    The side edges of the second sliding body are each delimited by an exemption 14, wherein the exemption is limited only on one side by the second sliding body, so that this lateral exemption 14 at the same time forms the side edge 15 of the second sliding body 13. The exemptions 14 are designed such that the second sliding body can be pushed at least partially through the cutting area 6 without the second sliding body 13 colliding with the cutting bodies 7. When pushing through the cutting bodies 7 are thus arranged in the exemptions 14 of the second sliding body. By retracting the second sliding body 13 and the cutting body 7 leave the exemptions 14th
    Optionally, a first guide surface 34 and a second guide surface 35 are provided for lateral guidance of the wafer block. These guide surfaces may for example be formed by bar-shaped or wall-shaped elements, which are formed substantially following the cutting direction 9. In particular, the guide surfaces 34 and 35 protrude out of the conveying surface 5 and / or protrude beyond, for example, or at least the height of the wafer block to be cut. As a result, the area for receiving the wafer block, that is to say the area between the two guide surfaces 34, 35, has a trough-shaped form into which the waffle block is introduced via the conveying device.
    Figure 4a shows a schematic of the pusher 11. The pusher 11 comprises a first pusher body 12 and a second pusher body 13. In the illustrated position of Figure 4a, the leading edge of the second pusher body 16 and the front edge of the first pusher body are substantially flush or completing one another arranged. In this case, an edge is formed by the first sliding body and the second sliding body, which in the
    Is substantially rectilinear and / or the edge to be pushed of the waffle block, in particular the rear end face 18 of the waffle block is modeled. At the rear end face 18 of the waffle block, the two sliding bodies engage together to push the waffle block.
    For example, the pusher 11 is for sliding the waffle block in the direction of the cutting area and into the cutting area in this position. Just before the cutting bodies, just before the cutting area 6 or just before the Randabfallleitmittel the first sliding body is stopped.
    4b shows a further position in which the second sliding body 13 is arranged opposite the first sliding body 12 in an extended position. Just before the edge waste guide, the first slide body is stopped. The second sliding body is moved further via the second drive 20 and in particular extended with respect to the first sliding body 12, so that the waffle block can be pushed through the cutting area. In this case, the second sliding body 13 has exemptions 14, which are provided in particular in the region of the cutting bodies 7 in order to avoid a collision between the sliding device and the cutting bodies 7. The illustrated position of FIG. 4b corresponds, for example, to a position in which the waffle block has been pushed completely through the cutting area 6. The first slide body 12 is stopped in a retracted position, in particular just before the edge waste guide means. The second sliding body projects beyond the first sliding body in the cutting direction 9. As a result, the waffle block can also be conveyed further into the second cutting station.
    In all embodiments, a stacking magazine 36 may be provided. This stacking magazine 36 comprises movable extensions, in particular plate-shaped bodies, which are movably coupled to the machine frame via a moving device. By means of this stacking magazine a plurality of wafer blocks can be stacked coming from the wafer baking machine and in particular from the input station 22. Thus, a waffle block can be stacked over the other. Preferably, the stacking is done in such a way that the waffle blocks lie congruently on their flat sides against each other or lie on top of each other. For example, two, three, four, five, six, seven, eight or more waffles can be stacked one on top of the other. This waffle block stack may subsequently be cut by the first cutting station and optionally by the second cutting station.
    Thus, in all embodiments, it may be provided that a waffle block stack is provided instead of a single waffle block. Thus, instead of a single wafer block, a single waffle block stack may be inserted into the cutting stations.
    According to a described embodiment, the cutting direction 9 of the first cutting station 26 extends transversely to the first conveying direction 25 of the input station 22. According to this embodiment, the second cutting direction 28 again runs transversely to the cutting direction 9, ie for example parallel to the first conveying direction 25. According to another embodiment, not shown, however, too the cutting direction 9 of the first cutting station 26 extend parallel or in the direction of the first conveying direction 25. In this embodiment, the second cutting direction 28 can run transversely to the cutting direction 9 of the first cutting station 26 and at the same time transversely to the first conveying direction 25.
    Optionally, it is provided that at least one hold-down 31 is provided which is arranged spaced from the conveying surface 5, wherein the distance between the retainer and the conveying surface is substantially equal to the thickness of the waffle block, which is located between hold-down and conveying surface, and optionally in the cutting direction before the Cutting area is arranged so that the waffle block is guided in cutting and in particular secured against an effect caused by the cutting forces erection.
    1. cutting station 2. waffle block 3. edge 4. machine frame 5. conveying surface 6. cutting area 7. cutting body 8. thickness of the waffle block 9. cutting direction 10. drive 11. pusher 12. first sliding body 13. second sliding body 14. Exemption, especially the second sliding body 15. Side edge of the second sliding body 16. Front edge of the second sliding body 17. Back end of the rim 18. Rear face of the waffle block 19. First drive 20. Second drive 21. Cutting frame 22. Feed station 23. Dispensing station 24. Final product 25. First Direction of conveyance 26. First cutting station 27. Second cutting station 28. Second cutting direction 29. Second cutting body 30. Second pushing device 31. Hold-down device 32. Randabfallleitmittel 33. Movement device for hold-down 34th First guide surface 35th Second guide surface 36th stacking magazine
    权利要求:
    Claims (29)
    [1]
    1. Cutting station (1) for wafer blocks (2) for separating the lateral edge (3) of the wafer blocks (2) running parallel to the cutting direction and optionally for breaking the wafer blocks (2), comprising: - a machine frame (4) with a conveying surface (2) 5), along which the wafers blocks (2) are transported, - at least one cutting body (7) arranged in a cutting region (6) which projects beyond the conveying surface (5) at least by the thickness (8) of the waffle block (2), - one along sliding device (11) movably arranged in the cutting direction (9) and driven by a drive (10) for pushing individual wafers blocks (2) or individual wafer block stacks through the cutting area (6) so formed that the waffle block (2) or waffle block stack from the cutting body (7) is cut along the cutting direction (9) and, in particular, cut in the edge region, characterized in that the sliding device ( 11) comprises a first sliding body (12) and a second sliding body (13) such that the first sliding body (12) and the second sliding body (13) are movably arranged over at least one drive (10, 19, 20) along or in the direction of the cutting direction (9) are, and that the second sliding body (13) relative to the first sliding body (12) via at least one drive (10, 20) is arranged to be movable.
    [2]
    A cutting station according to claim 1, characterized in that the second sliding body (13) has an exemption (14) which is designed such that a part of the second sliding body (13), preferably at least the front edge of the second sliding body (13), abuts past the cutting body (7) through the cutting area (6), so that a waffle block (2) is slidable from the second sliding body (13) entirely through the cutting area (6), and that the clearance (14), in particular from the side edge (15 ) of the second sliding body (13) is limited and arranged laterally outside the second sliding body (13), or extends as a slot-shaped incision into the second sliding body (13).
    [3]
    Cutting station according to claim 1 or 2, characterized in that the free position (14) extends substantially from the front edge (16) of the second sliding body (13) rearwardly along the cutting direction (9), in particular against the cutting direction (9).
    [4]
    Cutting station according to one of claims 1 to 3, characterized in that the first sliding body (12) for pushing the wafer block (2) into the cutting area (6) extends laterally to and into the region of the edge (3) of the wafer block (2) to be severed ) and in particular engages the rear end face (17) of the rim (3) to push the waffle block (2) into the cutting area (6).
    [5]
    5. Cutting station according to one of claims 1 to 4, characterized in that the second sliding body (13) relative to the first sliding body (12) by at least one drive (10) can be brought into a sliding position, in which the second sliding body (13) and the first sliding body (12) engage together at the rear end face (18) of the waffle block (2) to push the waffle block (2) into the cutting area (6).
    [6]
    6. Cutting station according to one of claims 1 to 5, characterized in that the second sliding body (13) relative to the first sliding body (12) by at least one drive (10) can be brought into a push-through position, inder the second sliding body (13) the first Sliding body (12) projects beyond the cutting direction (9) and in which the cutting body (7) is in the free position (14) of the second sliding body (13), so that the second sliding body (13) projects beyond the cutting area (6) in the cutting direction (9) and the waffle block (2) pushed completely through the cutting area (6) and possibly beyond the cutting area (6).
    [7]
    7. Cutting station according to one of claims 1 to 6, characterized in that in the cutting direction (9) after the cutting region (6) at least one laterally arranged Randabfallleitmittel (32) is provided, or that inSchneidrichtung (9) after the cutting region (6) on both sides two Randabfallleitmittel (32) are provided, wherein the Randabfallleitmittel (32) from the conveying surface (5) extend away, so that the separated edge (3) of the Waffelblöcke (2) is transported away from the conveying surface (5).
    [8]
    Cutting station according to claim 6 or 7, characterized in that the first slide body (12) is stopped and optionally retracted in the direction of pushing in the cutting direction (9) in front of the edge waste guide means (32).
    [9]
    9. Cutting station according to one of claims 1 to 8, characterized in that a first drive (19) for driving the first sliding body (12) is provided, that a second drive (20) for movement of the second sliding body (13) is provided and that the second sliding body (13) can be extended beyond the second drive (20) so that it protrudes beyond the first sliding body (12).
    [10]
    10. Cutting station according to one of claims 1 to 9, characterized in that the cutting body is rigidly connected to the machine frame (4) and that the feed for cutting the waffle block (2) by the Bewegbzw. the advance of the waffle block (2) by the pusher takes place
    [11]
    11. Cutting station according to one of claims 1 to 10, characterized in that the cutting body (7) is a cutting wire clamped in a cutting frame (21) or a cutting band clamped in a cutting frame (21).
    [12]
    12.Schneidstation according to one of claims 1 to 11, characterized in that two cutting bodies (7) are provided, wherein a cutting body (7) in the left edge region and a cutting body (7) is arranged in the right edge region, so that upon pushing through the wafer block (2) by the cutting area (6) at the same time the left and right edges of the wafer block (2) are cut off.
    [13]
    13.Schneidstation according to one of claims 1 to 12, characterized in that three or more cutting body (7) are provided, wherein a cutting body (7) in the left edge region and a cutting body (7) is arranged in the right edge region and that at least one cutting body ( 7) is arranged between the cutting body (7) in the left edge region and the cutting body (7) in the right edge region, so that when the wafer block (2) is pushed through the cutting region (6) simultaneously the left and right edges of the wafer block (2) are cut off and at the same time the waffle block (2) in the middle area, between the two edges, is cut.
    [14]
    14.Schneidstation according to one of claims 1 to 13, characterized in that a first guide surface (34) and a second guide surface (35) are provided, that the two guide surfaces (34, 35) protrude from the conveying surface (5) and substantially along the cutting direction (9) and in that the guide surfaces (34, 35) are spaced apart substantially corresponding to the width of the wafer block located between the guide surfaces (34, 35) such that the wafer block is guided laterally during cutting.
    [15]
    15. Plant for producing end products (24) by cutting flat wafer blocks (2), in particular flat or hollow waffle blocks, wherein in the plant an input station (22) for the blocks (2), at least one cutting station (1) for cutting the Blocks (2) and an output station (23) are provided for the end products (24), characterized in that at least one cutting station (1) according to one of claims 1 to 16 is formed.
    [16]
    16. Plant according to claim 15, characterized in that in the input station (22) a first conveying direction (25) is provided along which the wafer blocks (2) of the first cutting station (26) are fed and that the cutting direction (9) from the first conveying direction ( 25), transverse to the conveying direction (25) and / or normal to the conveying direction (25), or that the cutting direction (9) coincides with the first conveying direction (25).
    [17]
    Installation according to claim 15 or 16, characterized in that a second cutting station (27) is provided with a second cutting direction (28), and in that the second cutting direction (28) deviates from the first cutting direction (26) and in particular transversely or normal to the first cutting direction (26).
    [18]
    18. Plant according to one of claims 15 to 17, characterized in that the second cutting station (27) at least one second cutting body (29), preferably a plurality of second cutting body (29) and a second shifter (30), so that previously in the first cutting station (26) cut and optionally cut wafer block (2) is cut once more by pushing through the second cutting area.
    [19]
    A plant according to any one of claims 15 to 18, characterized in that the plant is positionable or has a first position via the drives of the pushers in which the pusher of the first cutting station, in particular its second pusher, projects above and in the first cutting area the second pusher is in a retracted position such that the wafer block is pushed from the first pusher to the second cutting station.
    [20]
    20. A method of cutting flat waffle blocks, in particular flat or hollow waffle blocks, optionally to form end products, comprising the following steps: a. Feeding a wafer block along a first conveying direction into the first cutting station, b. Moving the pusher in the cutting direction so that the wafer block is conveyed into and through the cutting area, c. Stopping the first slide body from the edge waste guide, d. Further moving the second sliding body in the cutting direction, so that the second sliding body projects beyond the first sliding body in the cutting direction and the waffle block is conveyed further in the cutting direction.
    [21]
    21. The method according to claim 20, characterized in that when pushing through the wafer block, the cutting edges in the lateral direction of the wafer block are cut off by two laterally arranged cutting body.
    [22]
    A method according to claim 20 or 21, characterized in that when passing the wafer block, the waffle block is severed by a cutting body remote from the edge in the central region along the cutting direction.
    [23]
    A method according to any one of claims 20 to 22, characterized in that the waffle block, optionally cut into several pieces in the first cutting station, is conveyed to the second cutting station where it is cut along a second cutting direction, the second cutting direction deviating from the first cutting direction, transverse to the first cutting direction Cutting direction extends and / or normal to the first cutting direction.
    [24]
    A method according to any one of claims 20 to 23, characterized in that the waffle block, optionally cut into several pieces in the first cutting station, is conveyed from the second sliding body to the second cutting station where it is cut along a second cutting direction, the second cutting direction being from the first cutting direction deviates, transverse to the first cutting direction and / or runs normal to the first cutting direction.
    [25]
    A method according to any one of claims 20 to 24, characterized in that when the waffle block is cut, the edges of the waffle block lying laterally in the second cutting direction are cut off by two laterally arranged cutters of the second cutting station.
    [26]
    A method according to any one of claims 20 to 25, characterized in that when the waffle block is cut in the second cutting station, the waferblock is severed by a cutting body remote from the edge along the second cutting direction.
    [27]
    A method according to any one of claims 20 to 26, characterized in that in the first cutting station a waffle block is pushed completely through the cutting area of the first cutting station and possibly conveyed to the second cutting station, or in the first cutting station a waffle block stack is cut individually through the cutting area of the first cutting station completely pushed through and possibly conveyed into the second cutting station.
    [28]
    28. The method according to any one of claims 20 to 27, characterized in that the first cutting direction deviates from the first conveying direction and in particular runs transversely to the first conveying direction, or that the first cutting direction coincides with the first conveying direction.
    [29]
    29. The method according to any one of claims 20 to 28, characterized in that the first cutting direction deviates from the second cutting direction, and in particular that the first cutting direction and the second cutting direction are normal to each other.
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    同族专利:
    公开号 | 公开日
    BR102015024632A2|2016-07-19|
    CN105475412A|2016-04-13|
    CN105475412B|2018-02-06|
    AT516482B1|2017-03-15|
    DE102015217227A1|2016-04-07|
    DE102015217227B4|2020-12-24|
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    AT511406B1|2011-05-11|2013-07-15|Franz Haas Waffel Und Keksanlagen Ind Gmbh|METHOD AND DEVICE FOR PRODUCING WAFFEL SANDBLOCKS|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA742/2014A|AT516482B1|2014-10-02|2014-10-02|Cutting station, system and method for making waffle products|ATA742/2014A| AT516482B1|2014-10-02|2014-10-02|Cutting station, system and method for making waffle products|
    DE102015217227.9A| DE102015217227B4|2014-10-02|2015-09-09|Cutting station, installation and method for manufacturing wafer products|
    BR102015024632A| BR102015024632A2|2014-10-02|2015-09-25|cutting station, waffle making facility|
    CN201510639484.9A| CN105475412B|2014-10-02|2015-09-30|Manufacture cutting bed, the apparatus and method of waffle product|
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