• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Printed circuit board (1) having a plurality of electronic components (2, 2 ', 2' ', 2' '', 2 '' '') arranged on the printed circuit board (1) in at least one group (G1, G2, G3), wherein the electronic components (2, 2 ', 2' ', 2' '', 2 '' '') each have a first and a second of the circuit board (1) facing the electrical component contact surface (3 ', 3' '), wherein the component contact surfaces (3 ', 3' ') are connected to corresponding printed circuit board contact surfaces (6, 7, 8) arranged on the printed circuit board (1), successive electronic components (2, 2', 2 '', 2 '' ', 2 '' '') form a strand by series connection, wherein the strand is wavy, wherein the electronic components (2, 2 ', 2' ', 2' '', 2 '' '') of the strand according to a matrix with at least two rows (Z1, Z2, Z3) and at least two columns (S1, ..., S6) are arranged on the circuit board (1) and the strand entla ng arranged side by side columns (S1, ..., S6) alternately up and down.
    公开号:AT516416A1
    申请号:T50752/2014
    申请日:2014-10-21
    公开日:2016-05-15
    发明作者:Emanuel Weber；Thomas Gruber
    申请人:Zizala Lichtsysteme Gmbh；
    IPC主号:
    专利说明:

    A printed circuit board having a plurality of electronic components arranged on the printed circuit board in at least one group
    The invention relates to a printed circuit board having a plurality of electronic components arranged on the printed circuit board in a group, the electronic components each having a first and a second electrical component contact surface facing the printed circuit board, the component contact surfaces being correspondingly arranged on the printed circuit board ordered PCB contact surfaces are connected, wherein successive elektro¬nischen components form a strand by series connection.
    A plurality of electronic components means that it must be at least four electronic components.
    In a second aspect, the invention relates to a headlight, in particular a motor vehicle headlight, for generating a dynamic light distribution.
    In a third aspect, the invention relates to a vehicle headlamp system with two headlights.
    Increasing miniaturization and an increased power density in electronic components have led to areas on printed circuit boards, on which a plurality of electronic components are arranged, being provided for cooling the components. Thus, there are enlarged printed circuit board contact surfaces, so-called contact pads, which are designed to produce, on the one hand, an electrical connection with a component and / or to introduce heat from the component into the printed circuit board, into downstream heat sinks or another adjacent component. If a plurality of electronic Bauelemen¬ten be connected in series, it is in the dimensioning of Leiterplattenkontaktflächenbzw. When creating a printed circuit board layout, make sure that these passages for printed conductors that are necessary for the actuation of the components are not adjusted or blocked, so that an electrical contacting or interconnection of individual components is possible. As a result of these printed conductors, the size of the printed circuit board contact surfaces is generally considerably restricted.
    For example, document US 2011/0316009 A1 discloses a lighting device in which a plurality of LEDs are connected in series, wherein the LEDs are grouped in rows and all LEDs of a row are connected in parallel. The series connection of the LEDs takes place from line to line. The arrangement shown in US 2011/0316009 Al eliminates the possibility of a separate control of individual LEDs and has disadvantageous Kühlungs¬eigenschaften.
    An object of the invention is therefore to provide a printed circuit board with a plurality of other electronic components arranged on the printed circuit board, which allows a komp¬pakte arrangement of the electronic components on the circuit board at the same time high power density of the components and beyond robust and herge¬ cost can be made.
    This object is achieved with a printed circuit board of the type mentioned, in which the strand is wavy, wherein the electronic components of the strand according to a matrix having at least two rows and at least two columns are arranged on the circuit board and the strand along side by side arranged columns alternately and runs downhill.
    Thanks to the arrangement of the components according to the invention, it is possible to connect individual electronic components in a particularly efficient and space-saving manner while enabling optimized cooling in series. The components are preferably oriented in the direction of the strand. This means that the components, which have, for example, a cathode and an opposite anode, are oriented so that one anode or cathode directly faces the cathode or anode of the subsequent component, so that successive components preferably shortest paths are connected to each other in series. The circuit board may basically be any type of circuit board known in the art, such as a backplane having a metal core. The invention enables an arrangement of electronic components for optimizing the thermal household. It can be advantageously provided that consecutive electronic components within a column each form a series-connected vertical component pair in that each vertical component pair is connected to a common verti¬ cal printed circuit board contact surface associated with the vertical component pair. The common vertical printed circuit board contact surface is enlarged in comparison to a conventional printed conductor and, for example, has twice, three times or more than four times the width of a printed conductor. A printed circuit is, for example, between 100 pm and 400 pm, preferably 250 pm wide. A PCB contact surface has, for example, a width of at least 1000 μm, preferably 1400 μm. It permits a particularly good dissipation of the heat from individual electronic components into the printed circuit board or into elements connected to the printed circuit board. In particular, the widespread PCB contact surface is of great benefit if one of the two components forming the component pair is out of operation, since in this case the remaining component in operation can use the entire cooling surface or printed circuit board contact surface, thereby reducing the cooling capacity Particularly in dynamic Be¬trieb (in which individual components are switched on and off) can be particularly increased.
    It can also be provided that the electronic components of each even-numbered column of the uppermost row with the electronic component of a subsequent column of the uppermost row form a horizontal component pair and the electronic components of each odd-numbered column of the lowermost row with the electronic component of the lowest Form a row of a subsequent column a horizontal Bau¬teilpaar, or - the electronic components of each odd-numbered column of the top row with the elekt¬ronischen component of a subsequent column of the top row form a horizontal component pair and the electronic components of each even-numbered column of the bottom line with the electronic component the bottom line of a subsequent column form a horizontal Bau¬teilpaar by each horizontal component pair is connected by means of a horizontal component pair to parent common horizontal PCB contact surface. Analogous to the vertical printed circuit board contact surface, the horizontal printed circuit board contact areas can also have a broadening compared with the conventional printed circuit traces. Thus, for example, they have twice, three times or more than four times the width of a conventional belt track (the same applies to the horizontal board contact surfaces as the dimensions of the vertical board contact surfaces).
    An assignment of individual conductor tracks to the respective printed circuit board contact surfaces makes it possible to connect the electronic components with predeterminable electrical potentials, whereby a targeted switching on and off of the individual electronic components is made possible. However, this does not change the basic series connection of the individual electronic components on the printed circuit board. A strand is formed by the sum of successive, electrically interconnected electronic components.
    It may be particularly advantageous if each printed circuit board contact surface is assigned a printed conductor (a printed conductor can also be referred to as a so-called spur line). This makes it possible to specify the electrical potentials of the printed circuit board contact surfaces in a targeted manner and thus to selectively switch on and off all the electronic components connected to the printed circuit board contact surfaces.
    In a particularly favorable embodiment of the invention, it can be provided that a number of n electronic components are assigned to n + 1 circuit board contact surfaces. This allows a particularly efficient cooling of the individual electronic components. The number n is a natural number. Each component in this case is associated with at least one contact surface. Typically, a second circuit board contact surface is associated with the first or last component of a strand.
    It may be particularly advantageous if the conductor tracks run substantially parallel zueinander. As a result, a particularly ordered and compact arrangement of the printed circuit tracks is made possible.
    It can be particularly favorable when the printed conductors are led out between horizontal printed circuit board contact surfaces lying opposite one another within the same row-connected parts, thereby additionally improving the compact arrangement of the electronic components or further increasing the component density on the printed circuit board.
    In particular, it may be provided that the conductor tracks are led out to exactly one side of the printed circuit board. This allows a particularly simple and space-saving contact of the electronic components. It may be particularly advantageous if the conductor tracks are led out only before every other column, whereby the printed circuit board contact surfaces can be configured over a particularly large area.
    In particular, it can be provided that the printed circuit board contact surfaces have an area of at least 2 mm 2, preferably of at least 4 mm 2, particularly preferably of at least 10 mm 2. This allows a particularly efficient cooling of the electronic components, on the one hand components with high power density can be used and or components can be arranged close to each other.
    In a particularly advantageous embodiment of the invention, the electronic component can be a light-emitting electronic component, in particular a semiconductor component, particularly preferably an LED or a laser diode, which is preferably followed by an optical imaging system. As a result, a particularly compact and / or efficient realization of a printed circuit board with light-emitting electronic components is possible. The optical imaging system can be, for example, a lens, a reflector or a combination of reflector and lens, wherein the lens can be designed, for example, as a projection lens, wherein the projection lens is preferably an imaging lens of a projection module. When LEDs are used as the light-emitting electronic component, additional intent or primary optics may be provided on the light-emitting surface of the LEDs. Preferably, each light-emitting electronic component is followed by a respective lens. Conveniently, the light emitting electronic component may have a light emitting surface with the light emitting surfaces of adjacent electronic components being equidistant from each other. As a result, a particularly homogeneous light image, which is achieved by the radiation of the individual electronic components, given.
    Advantageously, it may be provided that each electronic component has a lichtemittie¬rende surface, wherein the light-emitting surface is at least 0, 05 mm2, 0.2 mm2, 0.4mm2, 0.5 mm2 or 1 mm2. This allows a particularly efficient and or homogeneous radiation.
    The base area of the electronic components may for example be between 0.5 mm 2 and 10 mm 2, whereby the advantages of the invention are particularly useful. The Grund¬ surface of an electronic component is the printed circuit board facing surface of the intervening electronic component. Conveniently, it can be provided that the circuit board has a length and a width of at least 3 cm, 4 cm, 5 cm or 6 cm, respectively.
    In a particularly compact arrangement, it may be provided that the electronic components are arranged in exactly two rows. As a result, the number of printed conductors can be kept particularly low and thus the ratio of insulating surface to printed circuit board contact area can be kept particularly low and therefore advantageous (the proportion of the insulating surface on the total area of the printed circuit board increases with an increasing number of printed circuit tracks, since the Tracks are spaced from each other by means of the insulating surfaces).
    Alternatively, it may be provided that the electronic components are arranged in at least three, four or more than four rows. As a result, a particularly high number of electronic components can be attached to a printed circuit board.
    Furthermore, it can be provided that the electronic components are arranged in at least three, four or more than four columns.
    Alternatively, it can be provided that between five and ten columns are provided on elektroni¬schen components. In particular, it may be provided that four groups are each arranged to 6 columns, which are arranged between two groups, each with three columns. The number of electronic components to be serially interconnected in a group may be dependent on the maximum voltage of the supplying electric power source.
    In particular, it may be provided that at least two groups are provided, wherein the groups are arranged rotated by 180 ° to each other and the tracks are led out between the horizontal PCB contact surface of each line which is farthest from the opposite group (ie the respective outer row). The printed circuit board or the electronic components within a group may have the above-mentioned properties. The arrangement of two opposing groups makes it possible to arrange a particularly large number of electronic components efficiently and compactly on a printed circuit board. All previous information refers to a group. Individual groups may have one or more of the mentioned aspects.
    Alternatively, it can also be provided that at least two groups, preferably four groups are provided, wherein the groups are arranged rotated by 90 ° to each other. In this case, it is favorable if the conductor tracks assigned to the individual groups run in a star shape in the direction of the outer sides of the printed circuit board.
    In order to additionally improve the effect of the printed circuit board, provision may be made for the printed circuit board to be thermally connected to a heat sink, wherein a fan is preferably arranged on the heat sink.
    A particularly compact arrangement of individual electronic components may be required in particular with headlights. A second aspect of the invention relates to a headlamp, in particular a motor vehicle headlamp, for generating a dynamic light distribution, comprising at least one printed circuit board with electronic lichtemittie¬renden components arranged thereon according to the invention, wherein it is in the light-emitting elektroni¬schen components in particular semiconductor devices and especially prefers to act on LEDs.
    For selectively influencing the light image of such a headlight according to the invention, it can be provided that the electronic components can be controlled individually.
    In a third aspect, the invention relates to a vehicle headlamp system having two headlamps according to the invention, wherein the left-hand part of the light distribution and the right-hand headlamp generate the right-hand part of the light distribution in a vehicle mounted in the vehicle. Light source, preferably each LED of the two headlights is separately controllable. Such a vehicle headlamp system can be designed very powerful and yet produced at low cost.
    In the following the invention with reference to exemplary, shown in the figures and non-limiting embodiments is discussed in more detail. It shows
    1 shows a schematic representation of a section of a printed circuit board with therein angeord¬neten electronic components according to the prior art,
    FIG. 2 shows a schematic representation of an exemplary electronic component above a printed circuit board,
    FIG. 3 shows a schematic representation of a section of a printed circuit board with electronic components arranged therein according to a first exemplary embodiment of the invention,
    FIG. 4 shows a schematic representation of a section of a printed circuit board with electronic components arranged therein according to a second exemplary embodiment of the invention, and
    Figure 5 is a schematic representation of a section of a printed circuit board with angeord¬neten therein electronic components according to a third exemplary embodiment of the invention.
    In the following, unless otherwise stated, like reference numerals designate the same features.
    Figure 1 shows a schematic representation of a section of a printed circuit board 1 with electronic components 2 (or 2 ', 2 ", 2'", etc.) arranged therein - the right quotation mark "'only serves to number the electronic components, all of which Reference 2 is common) according to the prior art. For clarity, only three electronic components have been provided with corresponding reference numerals therein. The electronic components 2 typically have plus and minus poles (or a cathode and an anode or a collector and an emitter, source or drain, etc.) corresponding component contact surfaces 3 'and 3 " (see Fig. 2) are connected.
    An exemplary electronic component 2, as can be used in the prior art but also in the invention, is shown in FIG. Therein are opposing component contact surfaces 3 ', 3 "recognizable, which are arranged on a base 4 of the electronic component 2. The electronic component 2 is disposed above a section of a printed circuit board 1 which faces the component contact surfaces 3 'and 3 " corresponding PCB contact surfaces 6 'and 6 " having.
    The electronic components 2 are connected in series along a strand in FIG. 1. For this purpose, the electronic components 2 are connected to conductor tracks 5, which contact the corresponding component contact surfaces (not shown in FIG. 1) by a first belt 5 '. a negative terminal of a first electronic component 2 'contacted, a second Lei¬terbahn 5 " the positive pole of the first electronic component 2 'and the negative pole of the following electronic component 2 " contacted, a third interconnect 5 '" the positive pole of the second electronic component 2 " As a result, a series connection of the illustrated components 2 is achieved, wherein insulating sections lying between the strip conductors 5 fill a majority of the area of the illustrated section of the printed circuit board. In such an arrangement, only a relatively poor cooling of the electronic components 2 by means of the circuit board 1und / or arranged on the circuit board 1 cooling elements can be achieved, which is why the attachable to the circuit board 1 power density of the electronic components 2 is relatively low.
    Figure 3 shows a schematic representation of a section of a printed circuit board 1 with electronic components 2 arranged therein according to a first exemplary embodiment of the invention. Therein, the printed circuit board 1 with a plurality of arranged on the circuit board 1 in a group G2 electronic components 2 and cutouts downstream analog groups Gl and G3 is shown schematically. The arranged within this group G2 electronic components 2 correspond to those components 2 of Figure 2 and therefore have a first and a second of the circuit board 1 facing the electrical component contact surface 3 'and 3 ", with the arranged on the circuit board 1 Leiterplattenkontaktflä¬ 6', 6 ";, 6 "' etc., wherein successive electronic components 2 form a strand by series connection, the strand running in a meandering manner, the electronic components 2 of the strand corresponding to a matrix having at least two rows ZI and Z2 and at least two columns ( in the first embodiment, six columns S1 to S6 are provided in the group G2) are arranged on the circuit board 1 and the strand runs alternately up and down along columns S1 to S6 arranged side by side.
    In the embodiment shown, the group G2 has exactly six columns S1 to S6 and two rows ZI and Z2 in which the electronic components 2 are arranged. For clarity, only the first four electronic components of a string have been referenced, namely, the reference numeral 2 'for the first electronic component of the string, 2 "for the subsequent electronic component located in the bottom row Z2 of the same column S1, and FIG series-connected subsequent electronic component 2 '" " and the electronic component 2 ", / etc., which is in turn connected thereto. The strand therefore runs in the first column S1 downwards from the first electronic component 2 'to the second electronic component 2", wherein, as can be clearly seen, arranged within a column S. successive electronic components 2 each form a series-connected vertical component pair, each vertical component pair being connected to a common vertical circuit board contact surface 7 associated with the vertical component pair. The transition of the strand from one column to a subsequent column via so-called horizontal component pairs, which are formed by adjacent, arranged within the same row elekt¬ronic components 2. These are connected to a common horizontal printed circuit board contact surface 8.
    Where the expression "vertical " not necessarily the geometric orientation of the printed circuit board contact surface 7 before. On the contrary, only the connection from an electronic component 2 arranged above to a downstream electronic component 2 arranged within the same strand below is described. In general, not every "field", which is assigned to rows and columns, must be populated with a component 2. Also, the alignment of the rows and columns with each other may deviate from an orthogonal structure. Likewise, individual rows and / or columns could be slightly offset. Preferably, the vertical circuit board contact surface may have a geometric configuration in the form of a rectangle, the extent of which in a vertical direction is greater than that in the horizontal direction. Also, the directions are "vertical " and "horizontal" only in relation to the circuit board 1 to understand, wherein the coordinate system for fixing a hori¬zontalen and vertical axis can be arbitrarily set in relation to the circuit board 1. Also, the circuit board 1 in any position, for example, in a Fahrzeugscheinwer¬fer installed become.
    In the exemplary embodiment shown, the electronic components 2 of each even-numbered column (in this example S2, S4) of the topmost row (ZI) are connected to the electronic component 2 of a subsequent column (S3 and S5, topmost row) and form a pair of horizontal component parts. The electronic components 2 of each odd-numbered column (here S3, S5) of the lowest row (here Z2) are connected to the electronic component 2 of the lowest row of a subsequent column and form a horizontal component pair. This generally does not apply to the first and last electronic component 2 of the strand.
    Of course, the linking of the individual rows and columns can also be done in the reverse manner. In the example of Fig. 3, the strand first passes the column S1 downwards over the horizontal pair of components of the lower row Z2 to the second column S2, where the string goes upwards in the direction of row ZI, and then the subsequent column S3 goes down, and so on. Alternatively For example, the strand could also first pass up the column S1 and then pass over into the column S2 via a horizontal component pair and run downwards, etc. The connection of said electronic components 2 from one column to the next column takes place, as already mentioned horizontal component pair, to which a common horizontal circuit board contact surface 8 is assigned. With the aid of this arrangement of the electronic components 2, a matrix is created, wherein in each field of this matrix preferably an electronic component 2 is arranged. In the embodiment shown, therefore, twelve electronic components 2 are arranged within the group G2. The components do not necessarily have to be arranged in alignment with each other in the rows and columns, but can definitely be offset from one another.
    In the exemplary embodiments of the invention, the electronic components are LEDs which each have a light exit surface 9, wherein in the exemplary embodiment shown, the light exit surfaces 9 of adjacent electronic components 2 have an identical distance from each other.
    In addition, it can be seen in the exemplary embodiment according to FIG. 3 that each printed circuit board contact area 6 (both the vertical and the horizontal printed circuit board contact areas 7 and 8 are generally referenced as printed circuit board contact areas 6) is assigned a conductor track 5. In addition, a number of (n) electronic components 2 (n + 1) PCB contact surfaces 5 are assigned. In addition, the tracks 5 are generally parallel to each other and are led out between opposed horizontal board pads 8. Under the expression "opposite each other"; are understood horizontal PCB contact surfaces 8, which are preferably arranged in the same row and successive columns. This makes it possible that the conductor tracks 5 are led out to exactly one side of the circuit board 1. In addition, the conductor tracks 5 are led out only before every other column. In the example shown, the so-called printed conductor tracks 5 are generally those track tracks (5 ", 5 '", 5) which are led out between the horizontal printed circuit board contact surfaces 8. As can be seen in FIG PCB contact surface 6 'of the first electronic component 2' and the PCB contact surface 8, which is connected to the fourth electronic component 2 "" of the strand of the second group, led out three printed conductors (5 ", 5 '", 5 "") upwards Columns S2 and S3 have no upwardly or downwardly routed traces 5, thereby permitting the formation of a common horizontal printed circuit board contact surface 8 and, therefore, the traces need only be routed out of every other column.The arrangement shown allows traces to be drawn to the next junction, viz between the column S3 and S4, whereby the total number of necessary lead out conductor tracks reduced on the one hand and their spatial arrangement can be optimized beyond. This also allows a particularly generous dimensioning of the printed circuit board contact surfaces 6.
    The printed circuit board contact surfaces 6 have an area of at least 2 mm 2, preferably at least 4 mm 2, particularly preferably at least 10 mm 2. The light-emitting surface 9 of the electronic component 2 is preferably at least 0.3 mm 2, preferably 0.4 mm 2 or at least 0.5 mm 2. The base area of an electronic component 2 is, for example, between 0.5 mm 2 and 10 mm 2. The circuit board 1 may have a length and / or a width of at least 3 cm, 4 cm, 5 cm or 6 cm.
    FIG. 4 shows a schematic representation of a section of a printed circuit board 1 with electronic components 2 arranged therein according to a second exemplary embodiment of the invention. The electronic components 2 are again arranged therein in six columns S1 to S6, wherein three rows ZI to Z3 are provided. Thus, in the arrangement shown, in the group G2 (6 x 3) there are eighteen electronic components 2. This increases the number of tracks 5, and analogously to the first embodiment according to Figure 3, only before every other column does the tracks 5 in the manner already described are led out to the top. The statement above only refers to the arrangement on a printed circuit board 1.
    FIG. 5 shows a schematic representation of a third embodiment of the invention, in which a detail of a printed circuit board 1 with electronic components 2 arranged therein is illustrated. Here, an arrangement is essentially shown which can be divided into two groups Gl and G2, these groups facing each other. Groups Gl and G2 have two rows and six columns. Each group has twelve electronic components 2. The groups are ver¬ rotated by an angle of 180 ° to each other, wherein due to the asymmetry of the electronic components, the horizontal Lei¬terplattenkontaktflächen 8 were adapted to each other so that they korres¬pondieren each other and complementary complement each other whereby a uniform spacing between the groups G1 and G2 and between all the light-emitting areas 9 of the components 2 arranged inside the two groups G1 and G2 can be achieved.
    In the embodiments shown, the distances between the light-emitting surfaces 9 of adjacent electronic components 2 are continuously constant. Alternatively, it would of course also be possible to vary the distances, whereby a targeted influencing of the resolution of individual segments of a light image can be made. All of the abovementioned embodiments according to the invention have particularly advantageous cooling properties and can be produced simply and inexpensively. In view of this teaching, the invention may be modified in any manner known to those skilled in the art and is therefore not limited to the embodiments shown. Also, individual aspects of the invention and the embodiments shown may be taken and combined together. Essential are the principles underlying the invention, which can be carried out by a person skilled in the knowledge of this description in a variety of ways and still remain maintained as such.
    权利要求:
    Claims (24)
    [1]
    Claims 1. Circuit board (1) having a plurality of electronic components (2,2 ', 2 ", 2'", 2 ", /) arranged on the printed circuit board (1) in at least one group (G1, G2, G3) ), wherein the electronic components (2, 2 ', 2 ", 2'", 2 "") each have a first and a second electrical component contact surface (3 ', 3 ") facing the printed circuit board (1), the component contact surfaces ( 3 ', 3 ") are connected to corresponding printed circuit board contact surfaces (6, 7, 8) arranged on the printed circuit board (1), with successive electronic components (2, 2', 2", 2 '", 2" ") forming a strand by series connection, characterized in that the strand is wave-shaped, wherein the electronic components (2, 2 ', 2 ", 2'", 2 "") of the strand correspond to a matrix with at least two Rows (ZI, Z2, Z3) and at least two columns (Sl, ..., S6) are arranged on the circuit board (1) and the strand along side by side angeord¬neter columns (SI, ..., S6) alternately up and down runs.
    [2]
    2. Printed circuit board (1) according to claim 1, characterized in that within a column auf¬ successive electronic components (2, 2 ', 2 ", 2'", 2 "") each form a series-connected vertical component pair, in that each vertical component pair is connected to a common vertical printed circuit board contact surface (7) assigned to the vertical component part pair.
    [3]
    A circuit board (1) according to claim 1 or 2, characterized in that - the electronic components (2,2 ") of each even-numbered column (S2, S4) of the topmost row (ZI) are connected to the electronic component (2) of a subsequent column (S3, S5) of the top line (ZI) form a horizontal component pair and the electronic components (2 ") of each odd-numbered column (Sl, S3, S5) of the bottom line (Z2, Z3) with the electronic component ( 2 '") of the lowermost row (Z2, Z3) of a subsequent column (S2, S4, S6) form a horizontal component pair, or - the electronic components (2) of each odd-numbered column (S1, S3, S5) of the uppermost row (ZI) form a horizontal component pair with the electronic component (2) of a subsequent column (S2, S4, S6) of the uppermost row, and the electronic components (2) of each even-numbered column (S2, S4) of the lowermost row (Z2, Z3) with the electronic component (2) of the lowest line (Z2, Z3) of a subsequent column (S 3, S5) form a horizontal component pair by each horizontal component pair is connected by means of a horizontal component pair to parent common horizontal PCB contact surface (8).
    [4]
    4. printed circuit board (1) according to one of claims 1 to 3, characterized in that each Lei terplattenkontaktfläche (6) is associated with a conductor track (5).
    [5]
    5. Printed circuit board (1) according to one of claims 1 to 4, characterized in that a number of n electronic components (2) n + 1 PCB contact surfaces (6) are assigned.
    [6]
    6. printed circuit board (1) according to one of claims 1 to 5, characterized in that the Lei¬terbahnen (5) extend substantially parallel to each other.
    [7]
    7. printed circuit board (1) according to one of claims 1 to 6, characterized in that the Lei¬ter tracks (5) are led out between each other, arranged within the same row horizontal printed circuit board contact surfaces.
    [8]
    8. printed circuit board (1) according to claim 7, characterized in that the conductor tracks (5) added to exactly one side of the printed circuit board (1) are led out.
    [9]
    9. printed circuit board (1) according to one of claims 6 to 8, characterized in that the Lei¬terbahnen (5) are led out only before every other column.
    [10]
    10. printed circuit board (1) according to one of claims 1 to 9, characterized in that the Lei¬terplattenkontaktflächen (6) have an area of at least 2mm2, preferably of at least 4mm2, more preferably of at least 10mm2.
    [11]
    11. Printed circuit board (1) according to any one of claims 1 to 10, characterized in that the electronic component (2) is a light-emitting electronic component, in particular a semiconductor device, particularly preferably an LED, which is preferably followed by an optical Abbil¬dungssystem.
    [12]
    12. Printed circuit board (1) according to claim 11, characterized in that each electronic Bau¬teil (2) has a light emitting surface (9), wherein the light emitting surface zumin¬dest 0.05 mm2,0,2 mm2,0,4 mm2, 0.5 mm2 or 1 mm2.
    [13]
    Circuit board (1) according to one of claims 1 to 12, characterized in that the base area (4) of the electronic components is between 0.5 mm 2 and 10 mm 2.
    [14]
    14, printed circuit board (1) according to one of claims 1 to 13, characterized in that the Lei¬terplatte (1) has a length and a width of at least 3cm, 4cm, 5cm or 6cm auf¬weist.
    [15]
    15. Circuit board (1) according to one of claims 1 to 14, characterized in that the electronic components (2) are arranged in exactly two rows.
    [16]
    A circuit board (1) according to any one of claims 1 to 15, characterized in that the electronic components (2) are arranged in at least three, four or more than four rows.
    [17]
    A circuit board (1) according to any one of claims 1 to 16, characterized in that the electronic components (2) are arranged in at least three, four or more than four columns.
    [18]
    18. Printed circuit board (1) according to one of claims 1 to 16, characterized in that zwi¬schen five and ten columns of electronic components (2) are provided.
    [19]
    19, printed circuit board (1) according to one of claims 1 to 18, characterized in that zumin¬dest two groups (Gl, G2) are provided, wherein groups (Gl, G2) are arranged rotated by 180 ° to each other and the conductor tracks (5). between the horizontal Leiterplatten¬ contact surface (8) are each brought out that line which is furthest from the gegenüber¬liegenden group (Gl, G2).
    [20]
    20. Printed circuit board (1) according to one of claims 1 to 19, characterized in that zumin¬dest two groups, preferably four groups are provided, wherein the groups are arranged rotated by 90 ° to each other.
    [21]
    21. Printed circuit board (1) according to any one of claims 1 to 20, characterized in that the Lei¬terplatte (1) is thermally connected to a heat sink, wherein preferably a fan is arranged on the cooling body.
    [22]
    22, headlights, in particular motor vehicle headlights, for generating a dynamic light distribution comprising at least one printed circuit board (1) according to a preceding An¬sprüche, wherein the electronic components (2) light-emitting electronic components (2), ins¬besondere semiconductor devices, particularly preferably a LEDs or laser diodes are.
    [23]
    23. Headlight according to claim 22, characterized in that the electronic Bauele¬mente (2) are individually controllable.
    [24]
    24. A vehicle headlamp system with two headlamps according to claim 22 or 23, wherein in a built-in vehicle state left headlights on the road the left part of the light distribution and the right headlights generates the right part of Lichtvertei¬lung, wherein at least each LED light source, preferably each light-emitting diode of the two headlights can be controlled separately.
    类似技术:
    公开号 | 公开日 | 专利标题
    EP3210443B1|2020-12-16|Printed circuit board having a plurality of electronic components arranged on the printed circuit board in at least one group
    DE102014105960B4|2017-12-21|LED lighting device with an improved heat sink
    EP2078895B1|2012-12-12|Lighting system
    DE102013217597A1|2015-03-05|lighting device
    DE102009020619A1|2010-11-11|Illumination device for use as LED module in motor vehicle headlight, has optical imaging elements attached to LEDs, where imaging elements exhibit different optical imaging characteristics
    DE102005049047A1|2007-04-19|modular system
    DE102008046762A1|2010-03-18|LED projector
    WO2009012914A1|2009-01-29|Illumination device
    WO2014056977A1|2014-04-17|Printed circuit board for populating with illumination bodies, comprising a variable working window
    WO2018104146A1|2018-06-14|Headlight and base headlight module for a headlight
    EP2965358B1|2018-05-09|Led module and lighting assembly having a corresponding module
    EP3432692B1|2020-06-10|Thermal coupling of copper heat spreading surfaces
    EP2640171B1|2016-12-21|Circuit board with a regular LED assembly
    DE102013208392A1|2014-11-13|LED module and luminaire with one LED module
    EP2400208A2|2011-12-28|Path lighting
    WO2017025283A1|2017-02-16|Lighting assembly
    DE3249507T1|1984-09-06|In-line or layered, mutually perpendicular, three-dimensional printed circuit board
    WO2020011798A1|2020-01-16|Led arrangement and lighting device
    DE102014105958A1|2014-12-18|LED lighting device and heat sink thereof
    DE202016101043U1|2017-05-31|Direct AC light-emitting diode module
    DE202015104272U1|2016-11-15|Printed circuit board with at least two areas for assembly with components
    DE102012219364A1|2014-04-24|Connectable module for connecting modular components with LEDs to LED TV, has pads arranged at substrate surface such that sequence of pads is reversed with respect to each other from surface edges in clockwise direction around edges
    DE202012103495U1|2013-01-08|Carrier element in a lighting device and lighting device with such a support element
    DE102017103294A1|2018-08-23|OPTOELECTRONIC LIGHTING DEVICE AND METHOD FOR OPERATING AN OPTOELECTRONIC LIGHTING DEVICE
    DE202010006441U1|2010-08-05|LED module unit and lighting device
    同族专利:
    公开号 | 公开日
    AT516416B1|2019-12-15|
    EP3210443B1|2020-12-16|
    WO2016061598A1|2016-04-28|
    GB2547158B|2018-07-11|
    JP2017533587A|2017-11-09|
    US20170328531A1|2017-11-16|
    GB201707808D0|2017-06-28|
    JP6357585B2|2018-07-11|
    US10139066B2|2018-11-27|
    GB2547158A|2017-08-09|
    EP3210443A1|2017-08-30|
    CN107002970A|2017-08-01|
    DE212015000250U1|2017-06-07|
    CN107002970B|2020-05-19|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    JPH01237484A|1988-03-18|1989-09-21|Daido Shingo Kk|Detecting apparatus for breakage of gate bar of railroad crossing|
    JP2004006582A|2002-04-12|2004-01-08|Shiro Sakai|Light emitting device|
    JP2006210949A|2002-04-12|2006-08-10|Shiro Sakai|Light-emitting device|
    JP2008072141A|2002-04-12|2008-03-27|Seoul Semiconductor Co Ltd|Light-emitting device|
    JP2012089887A|2002-04-12|2012-05-10|Seoul Semiconductor Co Ltd|Light-emitting device|
    EP1553641A1|2002-08-29|2005-07-13|Shiro Sakai|Light-emitting device having light-emitting elements|
    WO2005022654A2|2003-08-28|2005-03-10|Matsushita Electric Industrial Co.,Ltd.|Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device|
    US20110316009A1|2010-06-24|2011-12-29|Citizen Holdings Co., Ltd.|Light-emitting device|
    JPS61237484A|1985-04-12|1986-10-22|Sharp Corp|Light-emitting diode array|
    US10267506B2|2010-11-22|2019-04-23|Cree, Inc.|Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same|
    US20100170953A1|2006-04-03|2010-07-08|Stephan Schaade|Electronic module and procedure for at least the partial scrapping of the electronic module|
    US20080099772A1|2006-10-30|2008-05-01|Geoffrey Wen-Tai Shuy|Light emitting diode matrix|
    US10295147B2|2006-11-09|2019-05-21|Cree, Inc.|LED array and method for fabricating same|
    US8400064B2|2009-09-09|2013-03-19|Koninklijke Philips Electronics N.V.|Zener diode protection network in submount for LEDs connected in series|
    JP2011165833A|2010-02-08|2011-08-25|Toshiba Corp|Led module|
    US8791642B2|2011-03-03|2014-07-29|Cree, Inc.|Semiconductor light emitting devices having selectable and/or adjustable color points and related methods|
    FR2974671B1|2011-04-28|2013-04-12|Saint Gobain|LIGHT-EMITTING DIODE MODULE AND LUMINOUS GLAZING WITH SUCH A DIODE MODULE|
    EP2741578B1|2012-12-07|2017-06-07|Nxp B.V.|LED current and dimming control using hysteresis comparatoradjustment of hysteresis upper and lower threshold levels|
    US9041303B2|2013-03-29|2015-05-26|Posco Led Company Ltd.|AC LED lighting apparatus|
    CN203301848U|2013-04-28|2013-11-20|重庆跃达电力设备有限公司|Printed circuit board|
    US9689544B2|2015-05-05|2017-06-27|MJ Products, Inc.|Light engine for and method of simulating a flame|DE102016109951A1|2016-05-31|2017-11-30|Valeo Schalter Und Sensoren Gmbh|Light generating device for a head-up display of a motor vehicle|
    JP2018142591A|2017-02-27|2018-09-13|パナソニックＩｐマネジメント株式会社|Light source module, illumination device, and mobile body|
    EP3599796B1|2018-07-26|2021-02-24|Bilton International GmbH|Led light band and lighting system|
    EP3599797A1|2018-07-26|2020-01-29|Bilton International GmbH|Light system and method for operating same|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50752/2014A|AT516416B1|2014-10-21|2014-10-21|Printed circuit board with a plurality of electronic components arranged on the printed circuit board in at least one group|ATA50752/2014A| AT516416B1|2014-10-21|2014-10-21|Printed circuit board with a plurality of electronic components arranged on the printed circuit board in at least one group|
    JP2017521514A| JP6357585B2|2014-10-21|2015-09-30|Conductor path board comprising a plurality of electronic components arranged in at least one group on a conductor path board|
    US15/520,041| US10139066B2|2014-10-21|2015-09-30|Printed circuit board having a plurality of electronic components arranged on the printed circuit board in at least one group|
    CN201580069942.8A| CN107002970B|2014-10-21|2015-09-30|Printed circuit board with a plurality of electronic components arranged in at least one group on the printed circuit board|
    DE212015000250.0U| DE212015000250U1|2014-10-21|2015-09-30|Printed circuit board having a plurality of arranged on the circuit board in at least one group of electronic components|
    PCT/AT2015/050242| WO2016061598A1|2014-10-21|2015-09-30|Printed circuit board having a plurality of electronic components arranged on the printed circuit board in at least one group|
    GB1707808.0A| GB2547158B|2014-10-21|2015-09-30|Printed circuit board with multiple electronic components arranged on it in at least one group|
    EP15781855.0A| EP3210443B1|2014-10-21|2015-09-30|Printed circuit board having a plurality of electronic components arranged on the printed circuit board in at least one group|
    [返回顶部]