Semiconductor chip Turning and fastening device

专利摘要:
The present invention relates to a flip-chip bonding apparatus which can improve the accuracy and reliability of a transfer process for transferring a bonding head used in a flip-chip bonding process to a predetermined position on the xy plane, the transfer operation of transfer paths for transferring each Bonding head can minimize and mitigate the problem of heat generated position error. More particularly, the present invention relates to a flip-chip bonding apparatus which can reduce the number of movements and moving distance of a bonding head in a specific axis direction, which can reduce thermal expansion and vibration due to the transfer of the bonding head and can improve the UPH value of the device while ensuring a sufficient time for flattening the flux.
公开号:AT512859A2
申请号:T382/2013
申请日:2013-05-07
公开日:2013-11-15
发明作者:
申请人:Hanmi Semiconductor Co Ltd；
IPC主号:

专利说明:

BACKGROUND OF THE INVENTION
Field of the invention
The present invention relates to a flip-chip bonding device.
Background of the prior art
A flip-chip bonding apparatus for bonding a flip-chip to a bonding substrate or the like may include at least one. Bonding head have. Each of the bonding heads is transferred to a predetermined position of the bonding device and can pick up or bond a chip.
In general, a process for bonding a flip chip to a bond substrate should be carried out very precisely, and multiple mounting areas for fixing a chip may be prepared on the bond substrate. In this case, the flip-chip and the installation areas of the bond substrate should guarantee accurate electrical connections, and the chip should be installed and bonded at a proper position (in a proper pattern) in the installation area to reduce the error rate.
The bonding head for such a bonding process can be transferred to a predetermined position on the xy plane by a transfer device of a portal type installed so as to cross the x and y axis directions.
In particular, the bonding head is mounted on a first transfer section and can be moved by a moving part in the longitudinal direction of the first
FULFILLED transfer path can be transferred, and both ends of the first transfer path can be attached to a pair of parallel second transfer routes, which are arranged perpendicular to the first transfer route. The moving part can be transferred longitudinally along the second transfer routes.
Accordingly, the bonding head can be transferred to a predetermined position in the xy plane within a working space by the transfer routes, which are respectively arranged in parallel or vertically.
A working part with the bonding head and the moving part connected to the transfer sections can be driven by an electromagnet or a ball screw.
The working part or the moving part can be accelerated and transferred by the electromagnet or the ball screw at a high speed, and when the quick transfer process is repeated, components constituting each of the transfer sections can generate heat and the precision of a transfer position of the working one Part or the moving part may be affected by the thermal expansion of a specific component occurring due to the heat.
For example, the moving part for attaching the first transfer route to the second transfer routes is a part to which most of the heat generated in the transfer via the second transfer routes is transmitted, and the problem of thermal expansion of the moving part due to the generated heat may to a FOLLOWING! ΓΓ »· #» · · 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 3
Position errors of both ends of the first transfer route lead. Similarly, in the working part attached to the first transfer section, thermal expansion also occurs due to the heat generated at the transfer by the moving part attached to and transferred to the second transfer routes, and the same problem can be experienced the above-described occur.
The positional error of the moving part due to the thermal expansion of a component or the like may result in a bonding position error in accordance with the trend of reducing the size of a chip, whereby a bonding failure can be brought about.
In particular, due to the thermal expansion or vibration at the working part or a transfer part provided on each of the transfer routes, information about the precise position of the flip chip and the installation area on the bond substrate can not be obtained, and the error rate is accordingly increased, and Reliability and precision of the bonding process are reduced.
Accordingly, it is important to minimize the number of movements and the moving distance of the bonding head in the x- or y-axis direction while performing the entire bonding process, and it is important to arrange components such that the number of movements and the moving distance of the bonding head be reduced in a specific axis direction.
| FOLLOW-UP 4 4 4 44 444
That is, it is preferable to omit or minimize the driving of either the working part or the transfer part in the process of transferring the bonding head and performing a bonding process, and even if the driving of one of the parts is omitted or minimized, interference should occur various components generated by the movement of the bonding head or the like can be minimized when the components for the bonding process are arranged close to each other to improve the space utilization, and there are also some cases where one is required for operating specific operating components Place should be assured.
Accordingly, a method of reducing the number of movements and moving distance of the bonding head in a specific axis direction, arranging components between sequential processes, and reducing interference between work spaces is required.
SUMMARY OF THE INVENTION
A flip-chip bonding apparatus comprises: a turning unit for receiving a chip from one. Wafer and for turning the chip upside down, a working part with a bonding head for receiving the turned by the turning unit chips, wherein the bonding head can be transferred along the z-axis direction and rotated with respect to the z-axis can SUBSTITUTES: Π a flux immersion unit for immersing the lower surface of the chip received by the bonding head into a flux, a first vision unit for photographing an image of the lower surface of the chip immersed by the flux immersion unit, a second vision unit for photographing an image of the upper one Surface of a bond substrate to which the chip is to be attached, a flip-chip bonding part for bonding a chip on a bond substrate with a corrected position according to a result of the inspection performed by the first sight unit and the second view unit, a first transfer route for attachment and transfer the working part g of a y-axis direction and a pair of second transfer routes arranged in parallel along an x-axis direction perpendicular to the first transfer route to attach a moving part connected to both ends of the first transfer route and to move the moving part to x-axis direction. To transfer the axial direction perpendicular to the transfer direction of the first transfer route, wherein the flux immersion unit and the first sighting unit are arranged on the same axis parallel to the first transfer route. 1
NACHGER 6 ·· ··· * · ** · ·· «fff · * * · · · * · ··· • ·
BRIEF DESCRIPTION OF THE DRAWING
Show it:
1 shows a view of a flip-chip bonding device according to the present invention,
FIG. 2 is a view of another embodiment of a flip-chip bonding apparatus according to the present invention;
FIG. 3 shows an enlarged view about a working part,
4 shows a view of two exemplary transfer paths of a bondhead of a flip-chip bonding device according to the present invention, FIG.
Figure 5 is a view of two other exemplary transfer paths of a bondhead of a flip-chip bonding device according to the present invention;
FIG. 6 is a view of two other exemplary transfer paths of a bondhead of a flip-chip bonding device according to the present invention;
FIG. 7 is a block diagram of a flip-chip bonding apparatus according to the present invention;
FIG. 8 is a plan view of a flip-chip bonding apparatus according to an embodiment of the present invention;
FIG. 9 is a side view of a main part of a flip-chip bonding apparatus according to an embodiment of the present invention;
FOLLOW 7 · ♦ «« · ·
FIG. 10 is a plan view of a main part of a flip-chip bonding apparatus according to an embodiment of the present invention;
FIG. 11 shows a detailed view of a part A from FIG. 10,
FIG. 12 is a side view of a main part of a flip-chip bonding apparatus according to an embodiment of the present invention.
13 is a conceptual view of an operating state of a flip-chip bonding device according to an embodiment of the present invention;
FIG. 14 is a perspective view of a flux immersion unit associated with a flip-chip bonding apparatus according to an embodiment of the present invention;
FIG. 15 is a side view of a main part of a flux immersion unit associated with a flip-chip bonding apparatus according to an embodiment of the present invention;
FIG. 16 is a side view showing an operation state of a main part of a flux immersion unit belonging to a flip-chip bonding apparatus according to an embodiment of the present invention, and FIG
Figure 17 is a block diagram of a turning unit associated with a flip-chip bonding apparatus according to an embodiment of the present invention. NACHGH '· · · · ································································
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Preferred embodiments of the present invention will be described below in more detail with reference to the accompanying drawings, advantages and features of the present invention, and methods of implementation thereof will be explained by the following embodiments described with reference to the accompanying drawings. However, the present invention may be embodied in various ways and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. Furthermore, the present invention is defined only by the scope of the claims. Like numbers refer to like elements throughout.
A flip-chip bonding apparatus 1 according to the present invention is a device which forms a separate solder bump on a pad, which is an input and output terminal of a chip, and turns the chip and directly applies the solder bump to a circuit pattern such as a carrier bond substrate or a circuit band bonds.
Figure 1 is a view of a flip-chip bonding apparatus 1 according to the present invention. The flip-chip bonding device 1 according to the present invention is outlined.
In the description and the drawing described below, a horizontal direction means an x-I NACHCETr " " '7! 'l
9
Axis direction and a vertical direction a y-axis direction. In addition, however, it may be interpreted that the x-axis direction is parallel to a transfer direction for the moving part of a second transfer route described below and that the y-axis direction is a direction parallel to a transfer direction for the working part of a first transfer route described below.
Specifically, the flip-chip bonding apparatus 1 includes a turning unit 210 for picking up a chip from a wafer and turning the chip upside down (for reversing the upper and lower surfaces of the chip), a working part 1110 running along the z-axis direction and rotates on the z-axis, with a bonding head 1120 for receiving the chip turned over by the turning unit 210, a flux immersion unit 400 for immersing the lower surface of the chip received by the bonding head 1120, a first sighting unit 910 for photographing (inspection by photographing) an image of the lower surface of the chip dipped by the flux immersion unit 400, a chip bonding chip bonding part 500, its position through the bonding head 1120 according to a result of the scanning by the first vision unit 910 Inspection was corrected, on a bond substrate, a first transfer line 1100 for attachment and a pair of second transfer paths 1300, each having a moving part 1310 connected to both ends of the first transfer route 1100, and which are parallel to each other in the x-axis direction perpendicularly are arranged to the first transfer line 1100 to the
The moving part 1310 in the x-axis direction perpendicular to the transfer direction of the first transfer line 1100 is to be transferred, and the flux immersion unit 400 and the first view unit 910 are on the same axis parallel to the first transfer route 1100 arranged.
According to the embodiment described below with reference to FIG. 1, the turning unit 210, the flux immersion unit 400, and the first sighting unit 910 are provided in pairs at symmetrical positions with respect to the y-axis and is the first transfer route 1100 with the working part 1110 in FIG a pair mounted on the second transfer routes to be driven independently.
However, this should be interpreted as providing the turning unit 210, the flux immersion unit 400, and the first viewing unit 910 in pairs at symmetrical positions with respect to the y-axis, depending on the type of apparatus, and the number of the first Overpass distances 1100 with the working part 1110 can be increased or decreased indefinitely.
The flip-chip bonding apparatus 1 according to the present invention may transfer the bonding head 1120 (1) or 1120 (2) attached to the working part 1110 (1) or 1110 (2) to a predetermined position on the xy plane , Because the bonding head 1120 (1) or 1120 (2) may have a structure capable of raising or shutting down in the z-axis direction in the process of bonding or adsorbing (adsorbing) a chip, or moving in the Θ-direction around the z The flip-chip bonding device 1 according to the present invention may be designed to rotate the am
11 1110 (1) or 1110 (2) attached to the working part 1110 (1) or 1120 (2) to a predetermined position in the x-y-z space.
In addition, each of the working parts 1110 (1) and 1110 (2) may be installed together with a vision unit (a second vision unit 1130) described below.
The flip-chip bonding apparatus 1 according to the present invention may perform a process of separating and accommodating a single flip chip fc from each wafer w fed by a wafer feeder 100 and turning the single flip chip, so that one with a bump electrode (solder bump) provided bonding surface can point down.
The wafer feeder 100 may wait for work while stacking a plurality of w w wafers, and the wafers in the wafer feeder 100 may be sequentially supplied to a flip chip feeder 200.
The wafer feeder 100 has a structure for holding each wafer while the surface of the wafer is exposed to a wafer charger 101.
The wafer feeder 100 may include a guide device 120 for guiding the wafer to the flip-chip delivery part 200.
The guide means 120 performs a function of guiding the transfer of the wafer transferred by a separate drive means (not shown).
The flip-chip submitter 200 separates a plurality of chips constituting the wafer w fed by the wafer feeder 100 into
12 12
* · «« * «« • · «···
♦ · · «· · · ·
Single chips, turn over each of the chips, and feed the flip chip fc (in this specification, the flip chip a chip whose upper and lower surfaces are reversed) to each of the bonding heads 1120 (1) and 1120 (2).
The wafer w, which has a plurality of chips (or flip chips), may be in a state of mounting adhesive tape on the bottom while it is in a disassembled state. In addition, each of the flip chips fc may be in a state in which the lower surface of the chip is provided upward facing with a bump electrode (a solder bump) or a contact point.
The flip chip delivery part 200 may include an ejector (not shown) for ejecting each of the chips from the wafer w and a turning unit 210 (1) or 210 (2) for turning a chip hit and separated by the ejector, so that the bondhead 1120 (1) or 1120 (2) can receive the turned chip.
The turning unit 210 (1) or 210 (2) may have a pickup structure capable of performing a picking operation by adsorption and a turning operation for reversing the upper and lower surfaces of the chip. The rotational direction of the turning unit 210 or the like can be changed in various ways.
In summary, the ejector (not shown) is provided under the wafer, and each of the chips forming the wafer w can be separated from the wafer w by the impact of the ejector, and each of the separated chips is RETAINED by the turning unit positioned above the wafer | 13
• · · · · · · · · · · · · · · · · 210 (1) or 210 (2) can be reversed, leaving the bottom of the chip with a bump electrode (a solder bump) or a contact point can point down.
The flip chip fc inverted by the inverter 210 (1) or 210 (2) may be picked up by the bonding head 1120 (1) or 1120 (2), which is a working unit waiting over the flip chip.
In the flip-chip bonding apparatus 1 shown in Fig. 1, a pair of bonding heads 1120 (1) and 1120 (2) are provided in the working part 1110 (1) and 1110 (2), respectively.
In addition, a pair of second sighting units 1130 (1) and 1130 (2) may be provided together with the bonding heads 1120 (1} and 1120 (2) at the working parts 1110 (1) and 1110 (2), respectively.
Because the turning unit 210 picks up and rotates a chip so that a bonding surface can face down and the top surface of the chip can face upward, the bonding head 1120 (1) or 1120 (2) can hold the pickup state in which the bottom face of the chip presenting the bump electrode (solder bump) or the like, facing downward by receiving the upper surface of the upwardly facing chip.
The bonding head 1120 (FIG. 1) or 1120 (FIG. 2) may receive a flip-chip as a bonding target from the flip-chip submitter 200 and may be transferred to the flux immersion unit 400 and the flip-chip bonding portion 500 while being connected to the working portion 1110 (FIG. 1) or 1110 (2) is attached.
• • • Φ • «14 • · ·· Λ
The bonding head 1120 (1) or 1120 (2) may be driven to flip a specific flip chip after a pickup process, a dipping process, a photographing process (inspection process), and a bonding process along a transfer path of the first and second transfer paths 1100 and 1300 Chip delivery part 200 attributed.
The working parts 1110 (1) and 1110 (2) may be respectively attached to a pair of the first transfer paths 1100 (1) and 1100 (2), which transfer the working parts 1110 (1) and 1110 (2) in the y-axis direction and both ends of the first transfer links 1100 (1) or 1100 (2) may be respectively fixed to a pair of second transfer links 1300 (1) and 1300 (2) having the first transfer links 1100 (1) and 1100 (2 ) by the moving parts 1310a (l), 1310a (2), 1310b (l), and 1310b (2) in the x-axis direction.
Specifically, both ends of the first transfer route 1100 (1) or 1100 (2) located on the left side of the transfer routes 1100 (1) and 1100 (2) shown in FIG. 1 are respectively defined by the moving parts 1310a (1). and 1310a (2), and the moving parts 1310a (1) and 1310a (2) may be fixed to transfer along the longitudinal direction (x-axis direction) of the second transfer routes 1300 (1) and 1300 (2) become.
Each of the first transfer routes 1100 (1) and 1100 (2) and the second transfer routes 1300 (1) and 1300 (2) has an overlapped gantry structure that may be configured to independently operate the working parts 1110 (1) and 1110 (2) to transfer to a given position on the xy plane, and the
SUBSEQUENT
Number of first transfer lines 1100 (1) and 1100 (2) can be increased or decreased.
The first and second transfer routes 1100 and 1300 transfer the bonding head 1120 (1) or 1120 (2), which receives a flip chip from the flip chip delivery part 200, to the side of the flux immersion unit 400.
The flux immersion units 400 (1) and 400 (2) shown in Fig. 1 may be provided in a pair corresponding to the number of working parts 1110 (1) and 1110 (2) or bonding heads 1120 (1) and 1120 (2) ,
The flux immersion unit 400 (1) or 400 (2) may provide flux for bonding by dipping the bottom surface of the flip chip.
The flux immersion unit 400 (1) or 400 (2) may include a flux receptacle 400 (1) or 400 (2) containing flux and a flux sweeper 420 (1) or 420 (2) for flattening the surface of the flux after the flip-chip has been immersed in the flux.
After the bonding head 1120 (1) or 1120 (2) has been transferred via the transfer paths 1100 and 1300 via the flux receptacle 400 while the flip chip has been picked up, the dipping process may be performed by shutting down the bond head 1120 (1) or 1120 (2) become.
The bonding head 1120 (FIG. 1) or 1120 (FIG. 2) may be configured to extend in the z-axis direction at one or more of the flip-chip delivery part 200, the flux immersion unit 400, a | REPLACED | 16
• · · • · ♦ ·· ··· • ·
The first vision unit 910 (1) or 910 (2) described below and the flip-chip bonding part 500 are driven up or down.
That is, according to the embodiment illustrated in FIG. 1, the raising and lowering of the bondhead 1120 (1) or 1120 (2) in the z-axis direction may be implemented in a method in which the bondhead 1120 (1) or 1120 (2) itself or the working part 1110 (1) or 1110 (2) to which the bonding head 1120 (1) or 1120 (2) is attached is provided with a start-up or shut-down function.
Because, according to the embodiment illustrated in FIG. 1, the bonding head 1120 (1) or 1120 (2) may have a structure capable of powering up or down to dip the bottom surface of the flip chip when the bonding head 1120 (FIG ) or 1120 (2) is transferred through the transfer routes 1100 and 1300 via the flux immersion unit 400, the bonding heads 1120 (1) and 1120 (2) can each perform their own work.
The bonding head 1120 (1) or 1120 (2) accommodating the flip chip for which the flux dip has been completed may be transferred through the transfer paths 1100 and 1300 to the flip chip bonding portion 500 described below.
The flip chip delivery part 200 executes the pickup, rotation, and pickup steps on the flip chip, and the flux immersion unit 400 executes the power down, dip, and start up steps. That is, the flip-chip may be in a state where it is skewed or shifted from a later postulated position because the physical position is constantly being changed even if each step is precisely controlled.
Because the physical error can not be completely prevented, the defect in the bonding process must be corrected or removed. The reason is that an accurate bonding can not be guaranteed even if the position of the flip chip is slightly changed because the size of the bump electrode (solder bump) or the contact point on the bottom surface of the flip chip is very small ,
Accordingly, the flip-chip bonding apparatus 1 according to the present invention may include a viewing part for photographing a flip-chip or a bonding substrate on which the flip-chip is bonded. The vision unit may include the first viewing unit 910 and the second viewing unit 1130 for photographing at least one image.
The flip-chip bonding device 1 illustrated in FIG. 1 can have two types of viewing units, namely the first and second vision units 910 and 1130.
The flip-chip bonding device 1 may include a pair of first sighting units 910 (1) and 910 (2) arranged in an upward direction to photograph the lower surface of the flip chip immersed by the flux immersion unit 400.
According to the embodiment illustrated in FIG. 1, the first sighting unit 910 (1) or 910 (2) can be arranged by the bonding head 1120 (1) or 1120 (2) on a path on which
SUBSEQUENT, the flip-chip passes through the flux immersion unit 400 to photograph the lower surface of the submerged flip-chip.
That is, the first vision unit 910 (1) or 910 (2) may be disposed below the transfer path of the bonding head 1120 (1) or 1120 (2) to photograph in the upward direction.
The first vision unit 910 (1) or 910 (2) may obtain information about the position of the transferred flip chip by photographing the bottom surface of the flip chip received by the bonding head 1120 (1) or 1120 (2).
The first viewing unit 910 (1) or 910 (2) may photograph a range of at least two points of the lower surface of the transferred flip-chip. This is because, although it is possible to extract the position of each flip chip from an image obtained by photographing a dot (by photographing a shot), a better corrected image can be extracted if two or more dots are photographed. In this case, a range of two or more dots must be photographed to detect a skew degree (or degree of rotation) together with a shift of the flip chip in a certain direction.
The flip-chip whose lower surface has been immersed in the flux by the flux immersion unit 400 (FIG. 1) is transferred to the flip-chip bonding part 500.
The flip-chip bonding part 500 may include a bonding table 510 for attaching and laying one of a bond substrate.
POSSIBLE 4 * ·· 19 • t Μ ♦ · * * * * * 4- # «« ♦ · ♦ · # · «· ft ft • • 4 4 4 4
Charger (not shown) along a guide 113 transferred bond substrate (bond object bond substrate) have bs.
An alignment viewing unit 12 provided in a separately provided pre-alignment unit 114 may perform a pre-alignment process on the bond substrate transferred to the bond table 510, i. perform a total inspection at each bonding position.
The bonded substrate transferred from the bond substrate charging means (not shown) along the guide 113 is transferred along the x-axis direction, as shown in Fig. 1, and the adjustment-viewing unit 12 can move to a predetermined position through the transfer paths 11 and 13 of a gantry structure information on the position of the transferred bond substrate may be previously collected by a photographing method and used as reference data in the bonding process performed on the bond table.
Although the bond substrate should be properly deposited in the bonding area sp of the bonding table 510, the bonding substrate may be broken off from the bonding area sp or deviated from the bonding area sp in the transferring process because the bond substrate has been laid obliquely in the bonding area sp.
If the bond substrate deviates from the bonding region sp, the correctness of the flip chip immersed in the flux can not be guaranteed in the bonding process, and a fault in the electrical connection may occur.
FOLLOW-UP 20 20 ·· ···· »fr ··» ·
Λ · · · · · ··· ·····
As described above, according to the present invention, in the bonding process, to take into account the positional deviation of the flip chip which may occur in the process of picking up or dipping the flip chip, the second vision units 1130 (FIG ) and 1130 (2) in order to exactly match a padding position of the bonding substrate bs in the same manner as in the first sighting units 910 (1) and 910 (2) for collecting positional information of the flip chip by photographing the bottom surface of the flip chip The second sighting units 1130 (1) and 1130 (2) may be attached to the working parts 1110 (1) and 1110 (2) together with the bonding heads 1120 (1) and 1120 (2), respectively, because the bonding heads 1120 (1) and 1120 (2) can be transferred together with the working parts 1110 (1) and 1110 (2), the second vision units 1130 (1) and 1130 (2) can be converted to a given position by the transfer routes 1100 and 1300 tion at the xy level.
The second sighting unit 1130 (1) or 1130 (2) may be arranged in the downward direction to photograph the bonding substrate deposited for bonding the flip chip immersed by the flux immersion unit 400 in the bonding area sp of the bonding table.
The second viewing unit 1130 (1) or 1130 (2) may reflect the positional error of the bond substrate in the bonding process by confirming the adjustment of the bond substrate bs deposited on the bond table 510.
Accordingly, the first vision unit 910 (1) or 910 (2) photographs the bottom surface of the flip chip to form an image for determining a positional error of the flip chip to be bonded
POSSIBLE * * * · · · · · · · · · · · · · · · · · * · * * * * * * * * while the second vision unit 1130 (1) or 1130 (2) obtains an image for determining a position of a bonding substrate while the bonding substrate is in the bonding area sp of the bonding table, ie a bond position of the chip.
In addition, the second viewing unit 1130 (1) or 1130 (2) may be used to obtain an image for determining the generation of an error in the bonding process by photographing a bonded bond substrate in addition to the bond substrate.
In this case, the generation of an error can be confirmed by determining the position of a chip with respect to the bond substrate. The control part of the flip-chip bonding apparatus 1 according to the present invention may determine the position of the operating unit 1120 or 1130 or the bonding table on the basis of the first vision unit 910 (1) or 910 (2) and the second vision unit 1130 (1). or 1130 (2) accurately control photographed images.
In addition, in a manner of skewing (rotating) the chip or the bonding substrate in a method of configuring the bonding head as rotatable and rotating the bonding head 1120 (1) or 1120 (2) around the bonding direction (Θ direction) of the Correct chips to be removed.
Also, the flip-chip bonding apparatus 1 according to the present invention may transfer the bonding head 1120 (1) or 1120 (2), the sighting unit or the like through the first and second transfer paths having an overlapped portal structure to a predetermined position on the xy plane , and if in a working unit in the manner of the bondhead
FOLLOW-UP • · • ♦ ·· · ·
If a z-axis up and down function is provided, the flip-chip bonding device 1 may transfer the operating unit to a predetermined position in the x-y-z space. Such a transfer route structure may cause a problem such as a positional error in thermal expansion or twisting of the transfer routes in accordance with the positional error described above.
The heat generated by the driving device for driving the working part 1110 (1} or 1110 (2) or the moving part 1310a (1) or 1310a (2) may cause a positional error of the working part 1110 (1) or 1110 (2). or the moving part 1310a (1), 1310a (2), 1310b (1), or 1310b (2), that is, the positional error of the bonding head 1120 (1150) attached to the working part 1110 (1) or 1110 (2). 1) or 1120 (2) in the xy plane can be caused by the positional error caused by the thermal expansion of the working part 1110 (1) or 1110 (2) to which the bonding head 1120 (1) or 1120 (2) is attached and the moving part 1310a (l), 1310a (2), 1310b (l) or 1310b (2) connected to both ends of the first transfer line 1100 (1) or 1100 (2), to which the working part 1110 (FIG. 1) or 1110 (2) is mounted to be transferable.
Although position sensors installed in the working part 1110 (1) or 1110 (2) (1110) and the moving part 1310 have positions of the working part 1110 (1) or 1110 (2) (1110) and the moving part 1310a (1) , 1310a (2), 1310b (1) or 1310b (2) by detecting a linear scale (not shown) provided on each of the transfer routes, it is because the heat transmitted through
the driving means provided to drive the working part 1110 (1) or 1110 (2) (1110) and the moving part 1310, the working part 1110 (1) or 1110 (2) (1110) and the can thermally expand the moving part 1310 and the position of the position sensor can change depending on the thermal expansion, impossible to exactly the position of the provided in the working part 1110 (1) or 1110 (2) Bondhead 1120 (1) or 1120 (2) measure up.
Accordingly, the positional error of the working part 1110 (1) or 1110 (2) or the moving part caused by the thermal expansion can reduce the accuracy of the flip-chip bonding process.
Accordingly, the flip-chip bonding apparatus 1 according to the present invention proposes a method of minimizing the amount of thermal expansion as a method of improving the accuracy of the flip-chip bonding process.
Finally, the amount of thermal expansion may be included in a method of minimizing the transfer process or transfer distance of the working part 1110 (1) or 1110 (2) or the moving part 1310a (1), 1310a (2), 1310b (1) or 1310b (FIG. 2) are implemented.
In particular, although the transfer process or the transfer distance of the working part 1110 (1) or 1110 (2) or the moving part 1310a (1), 1310a (2), 1310b (1) or 1310b (2) can be minimized to the position error of the bondhead 1120 (1) or 1120 (2), it is more important to minimize the movement of the moving part because of the thermal expansion of the device
FOLLOW-UP 4
position error generated for driving the working part 1110 (1) or 1110 (2) may be larger than that caused by the thermal expansion of the moving part driving means 1310a (l), 1310a (2), 1310b (l) or 1310b {2 ) generated position error.
Because the moving part attached to the second transfer route has the first transfer route 1100 (1) or 1100 (2) attached in a limited state at the ends thereof due to the weight of the first transfer route 1100 (1) or 1100 (2 ) or the like requires a larger driving force than the working part 1110 (1) or 1110 (2), the amount of heat generated by the driving force may be large.
On the other hand, since the working part 1110 (1) or 1110 (2) attached to the first transfer line 1100 (1) or 1100 (2) is fixed to the bonding head 1120 (1) or 1120 (2) and the second sight unit, it needs no large driving force, so that problems such as the positional error caused by heat and the like can not occur frequently.
Accordingly, the flip-chip bonding apparatus 1 according to the present invention may be configured to control the movement of the moving part 1310a (1), 1310a (2), 1310b (1) or 1310b (2), whereupon both ends of the first transfer route 1100 (1) or 1100 (2) are limited to minimize the first transfer path 1100 (1) or 1100 (2) parallel to the y-axis in the x-axis direction.
As described above, a flip-chip bonding process of the flip-chip bonding device 1 according to the
The present invention relates to a pickup process for picking up a flip chip rotated by a flip chip submitter to reverse the top and bottom surfaces of the flip chip, through the bondhead 1120 (1) or 1120 (2), a dipping process for dipping the flip chip picked up by the bonding head 1120 (1) or 1120 (2) by the flux dipping unit, a photographing process for photographing an image of the lower surface of the flip chip dipped by the flux dipping unit, a bonding process to Correcting the position of the flip-chip for which the photographing process has been completed and dividing it into a flip-chip bonding part for bonding the flip-chip The locations for executing the processes may be reversing unit 210 (1) or 210 (2 ) of the flip-chip submitter, the flux immersion unit 400 (1) or 400 (2), the first vision unit 910 (1) or 910 (2), and the flip-chip bonding portion 500.
As shown in FIG. 1, in the flip-chip bonding apparatus 1 according to the present invention, the flux immersion unit and the first vision unit are on the same axis parallel to the first transfer route 1100 (1) or 1100 (2) (perpendicular to the second transfer route ) to minimize movement of the moving part.
If the flux immersion unit and the first sighting unit are arranged in parallel to the first overpass 1100 (1) or 1100 (2), the moving part needs to. Process of transferring the dipped by the Flussmittei immersion unit flip chip to the first vision unit not to be transferred or driven.
Accordingly, because the moving member need not be transferred or driven, the moving member can prevent the generation of additional heat while the above-described dipping and photographing processes are performed during the flip-chip bonding process and a cooling time of the moving one Reserve partially.
In addition, because the working part 1110 (1) or 1110 (2) and the moving part of the flip-chip bonding device 1 according to the present invention can be accelerated to a speed of up to several meters per second, accurate position control can be achieved of the bonding head 1120 (1) or 1120 (2) due to the transfer inertia of the working part 1110 (1) or 1110 (2) can not be guaranteed if the transfer direction of the working part 1110 (1) or 1110 (2) in the process of transferring the working part 1110 (1) or 1110 (2) to a pickup position, a plunge position, a photographing position and a bonding position where the above-described pickup,
Immersion, photographing and bonding processes is performed.
If the receiving position, immersing position, photographing position and bonding position in the x-axis direction are different from each other, the number of transfers of the moving member for transferring the working part 1110 (1) or 1110 (2), i. of the bonding head 1120 (1) or 1120 (2) in the x-axis direction in the flip-chip bonding process for bonding a flip-chip four.
However, as shown in Figure 1, only the working part 1110 (1) or 1110 (2) along the y-axis direction along the first transfer route 1100 (1) or
2, while the moving part combined with the first transfer line 1100 (1) or 1100 (2) is stopped, and the number of transfers of the moving part in the x-axis direction may be transferred in one method for arranging the flux immersion unit and the first sighting unit under the path for transferring the bonding head 1120 (1) or 1120 (2) attached to the working part 1110 (1) or 1110 (2) through the first transfer route 1100 (1) or 1100 (FIG. 2) be reduced to three.
Because a time for dissipating the heat that can be generated in the driving process of the moving part can be ensured when the number of the X-axis direction moving parts of the moving part is reduced to one, the accuracy can be suppressed by suppressing thermal deformation the drive device for the moving part remain preserved.
Of course, the flux immersion unit and the first sighting unit may be arranged on the same axis parallel to the first transfer route 1100 (1) or 1100 (2) (perpendicular to the second transfer route) to increase the number of transfers and the number of changes in direction of the moving part minimize and thereby minimize the positional error of the working part 1110 (1) or 1110 (2) or the bonding head 1120 (1) or 1120 (2).
According to the embodiment illustrated in FIG. 1, the flip-chip delivery part and the flux immersion unit can be arranged on the same axis parallel to the second transfer route (perpendicular to the first transfer route).
REPLACED 2'β + »* ··
If the flip-chip submitter and the flux immersion unit can be disposed on the same axis parallel to the second transfer route, the bond head 1120 (1) or 1120 (2) may be at the front. Flip-chip delivery member by transferring or driving the second transfer path, while the transfer or the driving of the working part 1110 (1) or 1110 (2) is interrupted, are transferred to the flux immersion unit.
Although the amount of heat generated in the process of transferring the working part 1110 (1) or 1110 (2) may not be large as compared with that of the operating unit, the flip chip delivery part and the flux dipping unit may be arranged on the same axis parallel to the second transfer route in order to minimize the number of transfers and the number of direction changes of the working part 1110 (1) or 1110 (2), and in this case, the number of transfers of the working part 1110 (1) or 1110 (2) in the bonding cycle method of bonding a flip chip in the y-axis direction in a method of arranging the flip-chip submitter and the flux immersion unit under the path for transferring the bonding head 1120 (1) attached to the working part 1110 (1) or 1110 (2) ) or 1120 (2) can be reduced to three by the second transfer route.
Figure 2 is a view of another embodiment of a flip-chip bonding apparatus 1 according to the present invention. The parts which overlap with the parts described with reference to Figure 1 are omitted.
As described above, at the second transfer route, at both ends of the first transfer route 1100, (1) or 1100 (2) requires the one in a restricted one
Are attached, moving parts attached a larger driving force than the working part 1110 (1) or 1110 (2) due to the weight of the first transfer section 1100 (1} or 1100 (2) or the like, and because the amount of heat generated by the driving force can be large, while the number of overpasses or the overpass distance must be minimized.
According to the embodiment illustrated in FIG. 2, the turning unit 210, the flux immersion unit 400, and the first sighting unit 910 may be arranged in a row on the y-axis to reduce the moving distance of the flip-chip bonding part in the x-axis direction it is moved from the turning unit to the bond substrate 500.
As shown in FIG. 2, the flip chip submount, the flux immersion unit, and the first viewing unit forming the flip chip bonding apparatus 1 may be parallel to the first via 1100 (1) or 1100 (2) on the same axis. to be ordered. That is, the process of operating or transferring the moving part in the process of picking up, dipping and photographing the flip chip can be omitted.
In particular, the flip chip submitter includes a pair of inverter units for rotating a flip chip separated and ejected from a wafer to reverse the top and bottom surfaces so that the bonding head can receive the flip chip, and that means in that the turning unit is arranged together with the flux immersion unit and the first sighting unit parallel to the first transfer line 1100 (1) or 1100 (2) on the same axis.
SUBSEQUENT
In addition, the flux immersion unit may be disposed between the inverter unit and the first vision unit, so that the bonding head 1120 (1) or 1120 (2) performing the flip-chip bonding process may be transferred along one direction.
Accordingly, in the case of the flip-chip bonding apparatus 1 shown in FIG. 2, only the working part 1110 (1) or 1110 (2) can be transferred along the first transfer route 1100 (1) or 1100 (2) in the y-axis direction while the operating part 1110 (FIG moving part is stopped in combination with the first transfer section 1100 (1) or 1100 (2), and the number of transfers of the moving part in the x-axis direction may be determined in a method of arranging the flip-chip submitter, the flux part Immersion unit and the first sighting unit parallel to the first transfer line 1100 (1) or 1100 (2) under the path for transferring the bonding head 1120 (1) or 1120 (2) attached to the working part 1110 (1) or 1110 (2) via the second overpass range reduced to two.
In addition, as shown in Figs. 1 and 2, the turning unit, the flux immersion unit, and the first viewing unit of the flip chip submitter are provided in pairs within a working space. Because the bonding head 1120 (1) or 1120 (2) is also provided as a pair, the process void space in the flip-chip bonding process can be minimized.
In addition, the turning unit, the flux immersion unit, and the first viewing unit of the flip chip submitter are within a working space in pairs
NACHGERE1C! 1, and because the pairs of turning units, flux immersion units, and first sighting units are provided at respective positions toward the first transfer section 1100 (1) or 1100 (2) (ie, at the same height in the y-axis direction or the same Coordinates on the y-axis) and at symmetrical positions in the direction of the second transfer path (symmetrical or the same distance in the y-axis direction from the center of the second transfer path), the control variables of the flip-chip bonding device can be simplified and can Controllability of the flip-chip bonding device can be improved.
If the pairs of the turning units, the flux immersion units and the first sighting units are provided at symmetrical positions in the direction of the second overpass route, the turning units, the flux immersion units and the first sighting units may be provided. Viewing units are each arranged at a predetermined distance from each other, and although the first transfer sections 1100 (1) and 1100 (2) at which each of the working part 1110 (1) or 1110 (2) with the bonding head 1120 (1) or 1120 ( 2) is approached, the physical interference can be reduced to some extent.
Figure 3 is an enlarged view of a working part. As shown in FIG. 3, the second sighting unit and the bonding head 1120 (FIG. 1) may be attached to the working part 1110 (FIG. 1) in parallel to the first transfer path 1100 (FIG. 1). This serves to reach the bonding area sp of the bonding substrate of the flip-chip bonding part earlier than the bonding head 1120 (1) for easy photographing.
FOLLOW-UP: ST
*
The working part 1110 (1) having the bonding head 1120 (1) is attached to the first transfer section 1100 (1) and can be transferred in the longitudinal direction (y-axis direction) of the first transfer section 1100 (1). As described above, the first vision unit 910 (1) can photograph an image of the lower surface of the flip chip picked up and transferred from the bonding head 1120 (1), and even if the image of the lower surface of a flip chip is photographed, photograph at least two points.
However, if the entire image of a single flip chip is out of the field of view of the first view unit 910 (FIG. 1), it may not be possible to photograph two or more points to obtain position information of the transferred flip chip.
To solve this problem, the bonding head 1120 (FIG. 1) of the flip-chip bonding apparatus 1 according to the present invention has a rotation function, and the first sighting unit 910 (1) may be configured to rotate various parts of the flip transferred through the bonding head 1120 (1) To shoot sequentially.
That is, as shown in FIG. 3, the bonding head 1120 (FIG. 1) may be configured to pass over the first sighting unit 910 (1) while being rotated by a predetermined angle while the flip-chip is being rotated by the lens Bonding head 1120 (1) is recorded.
For example, if the entire image of a chip forming an inspection target is out of the field of view of the first vision unit 910, images of the bottom surface of the chip may be photographed and inspected while the bondhead
1120 is rotated at a predetermined angle so that two edges of the chip can be photographed by the first vision unit 910 without making an x-axis movement.
Specifically, the bonding head 1120 (1) may pass over the first vision unit 910 (1) while being rotated by a predetermined angle so that two points of 2 edges of the chip can be sequentially photographed by the first vision unit 910 (1) the flip-chip is picked up by the bonding head 1120 (1).
Specifically, the bonding head 1120 (FIG. 1) may be rotated so that both vertices of the flip chip can be detected and moved within a field of view at each photographing time of the first vision unit while the flip chip is being picked up, and the flip chip can be preferably rotated so that the y-axis direction of the first transfer path is parallel to the axis passing through both corners of the flip-chip.
Two images for the inspection can be obtained from a flip-chip in a method of photographing a first image when a first vertex area p1 (fc) of the rotated flip chip is detected within the field of view of the first vision unit and a second image is photographed, when a second vertex area p2 (fc) of the flip chip is detected within the field of view of the first vision unit. While photographing the first and second images, the working part 1110 (FIG
SUBSEQUENT
Speed transferred or photographed while the transfer is interrupted.
However, in view of the efficiency (UPH aspect or the like) of the bonding operation, it is preferable to perform inspection by photographing in the process of transferring the flip chip at a predetermined speed (for example, at a uniform speed), instead of performing the inspection by photographing while the transfer is interrupted in the process of dipping the flip chip into a flux, transferring the flip chip to the first vision unit, and performing the inspection by photographing through the bonding head.
When the bonding head dips the flip chip to the flux immersion unit and the dipped flip chip on the first vision inspection unit is slowed or stopped by photographing, vibration from the device may be generated depending on the stop and the speed change, if the load applied to the drive means (eg a motor) is high. However, if the bonding head dips the flip chip to the flux immersion unit and the dipped flip chip is transferred by photographing at a uniform speed for the inspection performed on the first vision unit, no load is applied to the drive device (for example, a motor). and vibrations from the device can not be generated, which is advantageous in view of the overall efficiency of the bonding process.
Because the bonding head unit needs to be stopped in the bond area, the speed should be gradual next
REDUCED, as will be described below with reference to FIG. 7, may be reduced.
An image photographed in this method is used as the position information of the flip chip, and an oblique position or the like can be corrected in the bonding process of the flip chip bonding member.
If the photographing is completed by the first viewing unit 910 (FIG. 1), the bonding head 1120 (FIG. 1) may again rotate the picked-up flip-chip in the bonding direction of the flip-chip bonding member.
Figure 4 is a view showing the two exemplary transfer paths of a bonding head of a flip-chip bonding device 1 according to the present invention.
The turning units 210 (1) and 210 (2), the flux immersion units 400 (1) and 400 (2), and the first sighting units 910 (1) and 910 (2) may be provided in pairs at symmetrical positions in the x-axis direction and after the process of picking up, dipping and photographing the flip chip by the turning unit 210 (1) or 210 (2), the flux immersion unit 400 (1) or 400 (2) and the first sighting unit 910 (1) or 910 (2) using the bond head provided on each working part, the flip chip may be bonded to the bond substrate through the flip chip bonding part 500.
Accordingly, each of the trajectories of the bondhead in the xy plane may have a symmetrical figure with respect to the y-axis. In addition, the process of bonding a flip
FOLLOW-UP · *
As described above, chips may be divided into four detailed processes performed at different positions in the xy plane, and if it is assumed that the bonding head is transferred along the shortest path between the positions for executing the processes, the Path of the bond head have a rectangular shape. In this case, because the flip-chip bonding apparatus 1 according to the present invention, the flux immersion unit 400 (1) or 400 (2) and the first vision unit 910 (1) or 910 (2) are parallel to the first transduction path (y-axis). arranges, in order to minimize the thermal expansion, in particular of the moving part, the transfer path of the bonding head may have a parallel to the first transfer section (y-axis) section.
According to the embodiments shown in Figs. 4 (a) and 4 (b), the transfer path of the bonding head for a work cycle has a rectangular shape, and the moving part is transferred three times along the second transfer route while a work cycle is performed.
That is, if the process of picking up a flip chip is a starting point of an operation, the coordinates of the flip-chip bonding head in the x-axis direction change as follows: x2 - > x3 - > x3 - > xl. However, because the x-axis coordinates of the bondhead are all the same at x3 while the dipping and photographing processes are being executed, the number of X-axis directional transfers of the moving part is reduced from four to three during the one working cycle, so that a time for discharging the heat generated due to the continuous driving or transferring of the drive means for the moving part can be ensured. Because in addition the problem
of jolts or vibrations generated by changing the direction of the bonding head, it is advantageous for the accurate photographing process and the position correction by the photographing, and it is easy to carry out the process of transferring the bonding head and the photographing process simultaneously.
On the other hand, the transfer position of the working part along the first transfer route reflects a position in the y-axis direction, and as shown in Figs. 4 (a) and 4 (b), it is understood that the position in the y-axis direction after y2 - > yl - > y3 - > y4 is changed four times
Both of the webs shown in Figs. 4 (a) and 4 (b) show that a web is changed depending on the position of the turn unit associated with the flip chip feeder member.
In addition, since the bonding position of the flip-chip bonding part 500 is endlessly changed on a bond substrate, the transfer path for bonding each flip chip is continuously changed depending on the bonding position on the flip-chip bonding part 500.
Figure 5 is a view of two other exemplary transfer paths of a bondhead of a flip-chip bonding device 1 according to the present invention. The parts that overlap with the parts described with reference to FIG. 4 are omitted.
In particular, the transfer path illustrated in FIG. 5 (a) may be a transfer path of the bondhead of the flip-chip bonding device 1 shown in FIG
··· * * * • · + · ··· Μ · ··· * «· · · ·« «
the transfer path illustrated in FIG. 5 (b) may be a transfer path of the bondhead of the flip-chip bonding device 1 shown in FIG.
Although the transfer path shown in Fig. 5 (a), like the transfer path shown in Fig. 4, has a rectangular shape, this shows an example in which the number of transfers of the moving part in the x-axis direction is three and the number of transfers of the working one Partly in the y-axis direction is also reduced to three.
Accordingly, when the number of X-axis direction transfers and the number of Y-axis directional transfers of the moving member and the working member are decreased by one, the heat generated by the continuous driving of the moving member and the working member can be reduced the driving means for the moving part are discharged, and because the thermal deformation of the driving means of the moving part and the working part can be prevented, a positional error can be prevented. In addition, vibration and shock applied to the bonding head or the like when the moving part and the working part are transferred can be reduced to some extent.
The transfer path of the bondhead shown in FIG. 5 (b) has a triangular shape. Because the turning unit 210 (1) or 210 (2), the flux immersion unit 400 (1) or 400 (2) and the first sighting unit 910 (1) or 910 (2) are arranged in parallel to the first transfer route, the number of times Transitions of the operating unit in the x-axis direction reduced to two.
Another embodiment will be described which uses the embodiment shown in FIG. Reference may be made to Figure 5 (b).
The turning unit 210 (1) or 210 (2), the flux immersion unit 400 (1) or 400 (2) and the first sighting unit 910 (1) or 910 (2) may be arranged in a row on the y-axis, to reduce the x-axis transfer path or the number of transfers between the working part 1110 (1) or 1110 (2) and the bond substrate.
To describe this in further detail, it should be noted that the present invention includes the turning unit 210 (1) or 210 (2), the working part 1110 (1) or 1110 (2), the flux immersion unit 400 (1) or 400 (2) provides the first vision unit 910 (1) or 910 (2) and the first relay path 1100 (1) or 1100 (2) in pairs at symmetrical positions with respect to the y-axis of the flip-chip bonding part to divide the flip-chip bonding part 500 and that the working parts 1110 (1) and 1110 (2) perform the flip-chip bonding by half-dividing the bonding substrates on the flip-chip bonding part.
That is, as shown in Figs. 1 and 2, the left side working part 1110 (Fig. 1) is transferred from the working parts along a transfer path including the turning unit 210 (Fig. 1) on the left side, the flux immersion unit 400 (1) on the left side, the first vision unit 910 (1) on the
| POSSIBLE LEFT side and the left half surface of the bond substrate (hereinafter referred to as "first region" of the bond substrate), while the working part 1110 (2) on the right side is transferred along a transfer path including the turning unit 210 (2) the right side, the flux immersion unit 400 (2) on the right side, the first sighting unit 910 (2) on the right side and the right half surface of the bonding substrate (hereinafter referred to as "second area" of the bonding substrate), and each of the bonding heads 1120 (1) and 1120 (2) performs a bonding operation.
Accordingly, if the turning unit 210 (1) on the left side, the flux immersion unit 400 (1) on the left side, and the first sight unit 910 (1) on the left side in a row on the y axis about the center of the first In the region of the bond substrate (approximately at a quarter of the left end of the bond substrate with respect to the length of the bond substrate in the x-axis direction), minimizing the transfer path of the working part 1110 (1) on the left side along the x-axis to be obtained. In the same manner, the turning unit 210 (2) on the right side, the flux immersion unit 400 (2) on the right side, and the first sighting unit 910 (2) on the right side may be arranged in a row on the y-axis Center of the second region of the bond substrate (approximately three-quarters from the left end of the bond substrate with respect to the length of the bond substrate in the x-axis direction).
Although in this case, no transfer path of the bonding cycle is shown separately in the xy plane, whereupon the bonding head 1120 (1) or 1120 (2) of the working part around the turning unit 210 (1) or 210 (2), the flux immersion unit 400 (1) or 400 (2), the first sighting unit later passed around 910 (1) or 910 (2) and the flip-chip bonding part 500, the transfer orbit can be expressed as a triangle or a straight section, which is much smaller is as in Figure 5 (b).
Accordingly, since the transfer or driving of the moving member is interrupted when the bonding head is in the recording, dipping or photographing process, a sufficient cooling time can be ensured, and the problem of the positional error caused by the thermal expansion of the moving member can be considerable be mitigated. In this case, the number of transfers in the y-axis direction is four, in which there is no change.
However, because no relatively large driving force is required to drive the moving member, only a small amount of heat is generated by driving the moving member. Therefore, since the effect of the positional error caused by heat is insignificant, the actual gain obtained by reducing the number of times the two-or-one-way transfer of the moving part in the x-axis direction is large.
To summarize Figures 4 and 5, it should be noted that a trajectory of the bonding cycle in the xy plane is formed as a triangle or rectangle, wherein the bonding head of the working part is the flip-chip submitter, the flux immersion unit 400 (FIG ) or 400 (2), the first sighting unit 910 (1) or 910 (2) and the flux immersion unit 400 (1) or 400 (2) orbits, wherein at least one side of the web forming triangle or rectangle parallel to the first transfer route or to the second transfer line can be.
42
It is confirmed that, when the bonding head is transferred along the side of the triangle or the rectangle parallel to the first transfer route forming the web, the bonding head sequentially passes through the flux immersion unit 400 (1) or 400 (2) and the first one The vision unit 910 (1) or 910 (2) or sequentially passes through the flip-chip delivery part, the flux immersion unit 400 (1) or 400 (2), and the first vision unit 910 (1) or 910 (2).
The position of at least one vertex among the vertices of the triangle or rectangle forming the trajectory may vary in each bonding cycle, and the varying position of the crest may correspond to the flip-chip bonding portion 500.
The fact that at least one side of the triangle or rectangle forming the track of the bondhead is parallel to the first or second transfer path means that there is a section where either the operating unit or the operating unit does not operate as described above ,
Figure 6 is a view showing two other examples of a transfer path of a bonding head of a flip-chip bonding apparatus according to the present invention. The parts that overlap with the parts described with reference to FIGS. 4 and 5 are omitted.
The control part of the flip-chip bonding apparatus according to the present invention can drive the driving means of the working part so that the working part can be transferred at a uniform speed while being supplied later. It is from the flux immersion unit 400 {1) or 400 (2) to the... first vision unit 910 (1) or 910 (2) or transferred over it. Although, as described above, the first sighting unit 910 (1) or 910 (2) may photograph the lower surface of the flip-chip that passes over the first viewing unit 910 (1) or 910 (2) while the bonding head is moving through the moving part is stopped, the transferring process for transferring the bonding head and the photographing process of the first sighting unit 910 (1) or 910 (2) may be simultaneously performed in the interest of the bonding efficiency.
That is, the first vision unit 910 (1) or 910 (2) can perform the photographing process while the bonding head is being transferred without being stopped.
Because the second portion B in Figs. 6 (a) and 6 (b) is a process for transferring the bonding head from the flux immersion unit 400 (1) or 400 (2) to the first vision unit 910 (1) or 910 (2) , the bonding head can be transferred at a uniform speed as described above.
However, the bonding operation should be performed on the bonding head 1120 when the bonding head is stopped. Accordingly, in FIGS. 6 (a) and 6 (b), the working part in the y-axis direction in the third section C should be delayed behind the second section B. Although the working part on the flip-chip bonding part can stop abruptly and can be driven at a steady speed, it can of course be controlled in a process for gradually reducing the speed of the working part, instead of stopping the working part abruptly to stop the working part Bond head to minimize jerk.
[NACHOgP, EICHT • ♦ + · ♦ · · • (4 «ff ··· · #« · • 4 «f ···» ·
Because in Figs. 6 (a) and 6 (b), the stopped moving part is up to | x3 - xl | or | x2 - xl | should be transferred along the x-axis, the working part should be accelerated and transferred from the stopped state and delayed on the flip-chip bonding part and stopped.
That is, the path of the bonding head may be a curved line and not a straight line and may have the shape of a line curved outward from the entire transfer path because the working part or the moving part in the third section C is different from the fourth Section D have a different rate of change rate.
That is, the trajectory of the bonding head in the third section C may be formed as a curved trajectory, although the initial velocity of the working part is high, the velocity is reduced, and the velocity of the moving part is patterned from a zero state is increased to a certain extent and then decreases.
The first section A, in which the bonding head is transferred from the turning unit 210 (1) or 210 (2) to the flux immersion unit 400 (1) or 400 (2), may be configured to drive only the moving part while the operating part is stopped, or to drive only the working part, while the moving part is stopped, as described above.
According to the embodiment shown in Fig. 6 (b), since the flux immersion unit 400 (1) or 400 (2) and the bonding head are arranged in line on the turning unit 210 (1) or 210 (2), the bonding head may be positioned after the Change the REPLACED | 45
Direction in the fourth section D in the first section A to be accelerated to a uniform speed, which is the transfer speed of the bonding head in the photographing process.
Figure 7 is a block diagram of a flip-chip bonding apparatus 1 according to the present invention. The flip-chip bonding apparatus 1 according to the present invention may include a bonding head 1120 (1) or 1120 (2) for receiving, transferring and bonding a flip chip, first and second transfer paths 1100 and 1300 for attaching and transferring the bonding head 1120 (FIG ) or 1120 (2) along a predetermined transfer path, first and second vision units 910 and 1130 for photographing the flip chip or a bond substrate of the flip chip picked up by the bonding head 1120 (1) or 1120 (2), a flip chip And a control part for controlling the bonding head 1120 (1) or 1120 (2), a transfer part 600, and the first and second vision units 910 and 1130 for correcting an error of the bond position of the flip chip based on having an image photographed by the first and second vision units 910 and 1130 and controlling a bonding process.
Here, the image of the chip or the bond substrate photographed by the first vision unit 910 and the second vision unit 1130 is compared and processed by a processing device 810 of the control part based on comparison information or an algorithm stored in the memory 860 of the control part, whereby a control signal for the accurate Bonding of the chip is generated and the bonding head 1120 (1) or 1120 (2) or the flip-chip bonding part 500 can be precisely controlled. Subsequent 46 • «• Μ * • · ♦ ·
A distance, angle or direction that should be corrected in the bonding process in accordance with a position error and a directional error of a picked-up flip chip or an imposed bond substrate may be examples of the control signal.
In addition, the flip-chip bonding apparatus 1 according to the present invention may further include a wafer feeder 100, a flip-chip feeder part 200, a flux immersion unit 400 and a flip-chip bonding part 500 as described above, and a bond substrate. Output part for discharging a bonded bond substrate, and each of the components receives a control signal sent from the control part 800 of the flip-chip bonding device 1 and returns state information of the component so that the bonding process can continue without a predetermined disturbance or interruption.
Accordingly, each of the components should be understood as a concept having needed sensors and drive units, and the measurement information or state information provided by the components is stored or updated in the memory 860 of the controller and generates a new control signal by a processing unit 810 of FIG control part.
The bonding head 1120 (1) or 1120 (2) is attached to the working part 1110 (1) or 1110 (2), which is transferably attached to the first transfer line 1100 (1) or 1100 (2), and both ends of the first one Overpass 1100 (1) or
POSSIBLE 47 • · • «··· 1100 (2) are attached to the second transfer route by the moving part.
As will be described with reference to FIGS. 1 and 2, the working part 1110 (1) or 1110 (2) of the first transfer route 1100 (1) or 1100 (2) and the moving part of the second transfer route each have drive means, and The control part for controlling the driving means may drive the driving means of the working part 1110 (1) or 1110 (2) and stop the driving means of the moving part while the working part 1110 (1) or 1110 (2) or the bonding head 1120 (1 ) or 1120 (2) from the flux immersion unit to or through the first sighting unit.
In this case, the flux immersion unit and the first vision unit may be arranged on the same axis parallel to the first transfer route 1100 (1) or 1100 (2).
The working part 1110 (1) or 1110 (2) or the moving part have drive means for transferring the working part 1110 (1) or 1110 (2) and the moving part on the first transfer line 1100 (1) or 1100 (2) and the second transfer route, and the control part for controlling the drive means of the working part 1110 (1) or 1110 (2) and the moving part can drive the driving means of the working part 1110 (1) or 1110 (2} and the driving means of the moving part stops while the working part 1110 (1) or 1110 (2) is being transferred from the flux-immersion unit to or through the first vision unit, and thus during the bonding cycle in which the bonding head 1120 (1) or
2) of the working part 1110 (1) or 1110 (2) the flip-chip delivery part, the flux ^ immersion unit that circulates the first vision unit and the flip-chip bonding portion, the moving portion is driven less frequently than the working portion 1110 (1) or 1110 (2).
Although the embodiment shown in Figure 8 and other figures below is similar to the embodiment described above with reference to Figure 2, the turning unit 210, the flux immersion unit 400 and the first sighting unit 910 are arranged in parallel to the first transfer path parallel to the first transfer path y axis, the bonding apparatus may be configured such that the positions for exporting the steps of receiving a flip chip, dipping the flip chip in a flux, and inspecting a pickup position in a web of the unidirectionally transferred bond head or the bonding device may be configured to reciprocate the bonding head by changing the direction of the transfer path in a straight line as needed.
Accordingly, the embodiment shown in Figure 8 and other figures below is the latter case. Of the parts described with reference to Figure 8 and other figures which follow, the parts which overlap the parts described with reference to Figures 1 to 7 are omitted.
The embodiments illustrated in FIGS. 1 to 7 focus on a method for minimizing the frequency of driving the working part or the moving part for transferring the bonding head in the xy-
POSSIBLE * ♦ «·« »» · ♦ ♦ · · ♦ ······························································································ 49
Plane, the frequency of changing the drive direction or position error of the working part or the moving part, while the embodiment described below is a specific embodiment, which includes a method of increasing the utilization of a space by reducing the distance between components of the bonding device and for releasing of the problem of interference generated between the components by decreasing the distance, in addition to minimizing the distance and the number of passes of the bondhead.
In the flip-chip bonding apparatus shown in Fig. 8 and other following figures, the first vision unit and the flux immersion unit may be provided on the same axis parallel to the x-axis direction to increase the frequency or distance of the movement of the bonding head in the x-axis direction or the first vision unit, the flux immersion unit and the inverter unit may be provided on the same axis parallel to the y-axis direction to reduce the frequency or the distance of the movement of the bonding head in the x-axis direction.
The working part 1110 (1) or 1110 (2) of the embodiment shown in Figs. 8 and 9 may include a bonding head 1120 (1) or 1120 (2) for receiving a chip fc whose upper and lower surfaces are turned by the turning unit 210 (Fig ) or 210 (2) and a second sighting unit 1130 (1) or 1130 (2) spaced from the bonding head 1120 (1) or 1120 (2) in a direction by a predetermined distance d.
In addition, the flip-chip bonding device 1 has at least one alignment information providing part which has a
SUBSEQUENT
Reference mark FM, and the adjustment information providing part may provide information about the position of the reference mark to the second vision unit 1130 (1) or 1130 (2) provided in the working part 1110 (1) or 1110 (2).
At this time, the working part 1110 (1) or 1110 (2) is formed so as to be above the turning unit 210 (1) or 210 (2) and the flux immersion unit 400 (1) or 400 (2) and the first sighting unit 910 (1) or 910 (2) and the bonding part 500, and between the bonding part 500, the first vision unit 910 (1) or 910 (2), the flux immersion unit 400 (1) or 400 (2) and the turning unit 210 (1) or 210 (2) performs translational movements.
Specifically, the working part 1110 (1} or 1110 (2) is installed to move in the y-axis direction along the first transfer route 1100 (1) or 1100 (2} and in the x-axis direction along the second transfer route 1300 (1) or 1300 (2), as shown in FIG.
In addition, the bonding head 1120 (1) or 1120 (2) and the second sighting unit 1130 (1) or 1130 (2) are provided in the working part 1110 (1) or 1110 (2) to work together with the working part 1110 (1). or 1110 (2) to be transferred to a predetermined position on the xy plane when the working part 1110 (1) or 1110 (2) is transferred.
In addition, the flip-chip submitter 200, the flux submersible 400 (1) or 400 (2), the inverter 210 (1) or 210 (2), and the bonding member 500 may be placed in a space on the first transfer path 1100 (FIG. 1) or 1100 (2) and
POSSIBLE, the second transfer line 1300 (1) or 1300 (2) formed xy plane can be arranged.
Referring to FIG. 8, the turning unit 210 is (1) or 210 (2), the flux immersion part 400 (1) or 400 (2), the working part 1110 (1) or 1110 (2) and the first one Vision unit 910 (1) or 910 (2) may be provided in pairs having the same structure at symmetrical positions with respect to the y-axis, and that the working parts 1110 (1) and 1110 (2) are respectively at the second transfer routes 1300 (FIG. 1) and 1300 (2) may be mounted in parallel with each other so as to move along the y-axis Hereinafter, for convenience of explanation, only a bonding head 1120 (1), a turning unit 210 (1), a flux immersion unit 400 will be used (1) and a first vision unit 910.
Referring to FIG. 9, the bonding head 1120 (FIG. 1) has an adsorption head 1121 for receiving a chip by directly applying a vacuum adsorption force to the chip and a connector 415 for connecting the adsorption head 1121 to the main body of the bonding head 1120 (FIG Transferring the Vakuumadsorptionskraft may have on the adsorption head 1121. The adsorption head 1121 may be configured to rotate the picked-up chip fc clockwise or counterclockwise with respect to the z-axis. Therefore, the adsorption head 1121 can control the position of the chip, controlled by the control part, by Θ (theta).
The second sighting unit 1130 (FIG. 1) may be installed at a predetermined distance d in a direction spaced from the bonding head 1120 (FIG. 1) of the working part 1110 (FIG. 1). The second viewing unit 1130 (FIG. 1) may be provided to accommodate the
SUBSEQUENT
1) in a position higher than the adsorption area of the adsorption head 1121 of the bonding head 1120 (FIG. 1), so that no spatial interference with the second sighting unit 1130 (FIG. 1) may occur when the bonding head 1120 (FIG Pick up chip or dip the chip fc in a flux f.
The second vision unit 1130 (FIG. 1) may obtain position information about the fiducial FM from the above-described calibration information providing part, obtain position information of each chip fc of the wafer w, and obtain information on a reference bonding position for mounting the chip fc on a bonding substrate bs from the bonding part 500.
The positional information thus obtained by the second vision unit 1130 (1) or 1130 (2) is transmitted to the control part, and the control part can obtain by calculating the positional information and moving the bonding head 1120 (1) or 1120 (2) at the position of the chip perform x-axis correction, y-axis correction, and Θ (theta) correction.
In addition, a first sighting unit 910 (1) or 910 (2) for photographing the adsorption head 1121 of the bonding head 1120 (1) or 1120 (2) and the chip fc in the upward direction from the lower part of the bonding head 1120 (1) or 1120 (FIG. 2) may be provided on the path of movement of the working part 1110 (1) or 1110 (2) reciprocating between the flux immersion unit 400 (1) or 400 (2) and the bonding part 500. REPLACED | φ * • φ ♦ φ • φΦΦ * · t «« · «I · · Φ · ΦΦΦ Φ Φ Φ Φ * * * · * ^ * Φ · Φ * * * * *
The first vision unit 910 (1) or 910 (2) is a camera for collecting positional information of the chip fc used by the bonding head 1120 (1) or 1120 (2), and particularly, the first vision unit 910 (1) or 910 (2) photographically determine whether the center of the adsorption head 1121 of the bonding head 1120 (1) or 1120 (2) is aligned with the center of the chip fc, whether the distance of the center of the adsorption head 1121 of the bonding head 1120 (1) or 1120 (2 ) deviates from the center of the chip fc, whether the angle of the chip fc is different from the adsorption head 1121 of the bonding head 1120 (1) or 1120 (2) and photograph an alignment state of a bump formed on the chip fc and the like.
At this time, the first sighting unit 910 (1) or 910 (2) may be disposed under the transfer path of the bonding head 1120 (1) or 1120 (2) to photograph in an upward direction, and as described above, the first viewing unit 910 may be provided (1) or 910 (2) detect position information of the transferred chip fc by photographing the lower surface of the chip fc picked up by the bonding head 1120 (1) or 1120 (2).
Although the first vision unit 910 (1) or 910 (2) can determine a skew (rotation) and a shift in a specific direction of the chip based on the initially input position information of the chip by photographing only one point of the bottom surface of the transferred chip fc , Preferably, a more accurate image can be extracted by photographing a range of two or more dots.
If the chip is within the field of view (FOV) of the first vision unit 910 (1) or 910 (2), the
POSSIBLE »···· * · · · * · · ···« ··· · ··· «· · ··· * ··· * * 4 * · · * ··» · ·· «
In addition, the position of the chip is obtained from an image captured by photographing two dots at a time (one-shot photograph). However, if the chip does not fit within the field of view (FOV) of the first vision unit 910 (1) or 910 (2), two spots can be photographed with two shots. As described above, the chip fc whose lower surface has been immersed in a flux by the flux immersion unit 400 (1) or 400 (2) is transferred to the bonding portion 500 while being received by the bonding head 1120 (1), and a bonding substrate bs to which the chip fc is attached may be prepared on the bonding part 500.
In this case, the control part controls the turning unit 210 (1) or 210 (2), the bonding head 1120 (1) or 1120 (2) and the flux immersion unit 400 (1) or 400 (2), and the control part can, in particular, position of the chip with respect to the reference bonding position (an installation area) of the bonding substrate bs by the bonding part 500 based on the first vision unit 910 (1) or 910 (2), the second vision unit 1130 (1) or 1130 (2), and a Adjusting sight unit 12 continuously correct detected position information.
That is, the control part performs x-axis correction, y-axis correction and Θ (theta) correction on the position information of the chip fc on the basis of the first view unit 910 (1) or 910 (2 ), the second vision unit 1130 (1) or 1130 (2) and the alignment vision unit 12 can perform detected position information.
In addition, the controller may determine the position of the chip fc by calculating the skew (error value) of a device when each of the devices (e.g.
SUBSEQUENT
The turning unit 210 (1), the bonding head 1120 (1), the flux immersion unit 400 (1), the bonding part 500, the flip chip supplier part 200, the wafer feeder 100, and the first and second transfer paths) Forming a flip-chip bonding device 1 thermally deformed by repeated processes, accurately calculating the position of the reference bonding region of the bonding substrate bs and setting reference coordinates of the bonding head 1120 (1) when bonding is performed based on the position information of at least one alignment information Correcting part detected by the second vision unit 1130 (1) or 1130 (2).
As described above, the bonding head 1120 (1) is transferable to a predetermined position in the xy plane and may be transferred along a gantry structure for this purpose. At this point, vibrations are generated by rapid and repeated transfer of the bonding head 1120 (FIG. 1), and even a portal drive motor for driving a portal is overloaded, so that thermal deformation may occur. The accuracy and reliability of the bonding process may be affected by the vibrations and the thermal deformation, and it is preferable to reduce the frequency of the transfers or the transfer distance of the bonding head 1120 (FIG. 1) in a specific axis direction, and it is particularly preferable to have the number to reduce the overpasses in the x-axis direction.
As with the embodiments described above, in the embodiment shown in Figs. 10 and 11, the flux immersion unit 400 (1) or 400 (2) and the first vision unit 910 (1) or 910 (2) may each be on one
POSSIBLE 56 • ι »······························································································································································································································································· and the turning unit 210, the flux immersion unit 400 (1) or 400 (2), and the first sighting unit 910 (1) or 910 (2) may each be provided on a certain axis L parallel to the y-axis direction. The number of X-axis directional transitions of the bonding head 1120 (1) can be reduced by one or two times by such a structure.
Since the number of X-axis direction transfers is reduced, overloading of the portal drive member can be prevented, thermal distortion due to overloading can be suppressed, and vibrations generated within the apparatus can be reduced.
Referring to Figs. 8 to 10, it should be noted that the first vision unit 910 (1), the flux immersion unit 400 (1) and the inverter unit 210 (1) can be spaced from each other by a predetermined distance in the y-axis direction.
The first vision unit 910 (1) photographs the chip fc to confirm position information of the chip and a state of applying the flux, and the bonding head 1120 (1) can transfer the chip fc to the bonding part 500 after completion of the photographing.
In this case, if the first sighting unit 910 (1) and the flux immersion unit 400 (1) are not respectively provided on a certain axis L parallel to the y-axis direction, the bonding head should be transferred at least once along the x-axis direction to pass through the first Subsequent |
• · • V g'y * ♦ * · * ♦ »· p» ·
1 to be photographed after the chip fc has been dipped in a flux, and such x-axis transfer induces thermal deformation or vibration as described above.
In addition, when the first vision unit 910 (FIG. 1), the flux immersion unit 400 (FIG. 1) and the inverter 210 are not respectively provided on a certain axis L parallel to the y-axis direction, the bonding head should be translated at least nine times along the x-axis direction For receiving the chip fc from the inverter unit 210 (1), dipping a bump formed on the lower surface of the chip fc into the flux and photographing it by the first sighting unit 910 (1} after the chip fc is immersed in the flux Such transfer in the x-axis direction causes thermal deformation or vibration as described above.
For this, in the flip-chip bonding apparatus 1 according to the present invention, the first vision unit 910 (1) and the flux immersion unit 400 (1) are respectively provided on a certain axis L parallel to the y-axis direction, and thermal deformations of the bonding apparatus 1 and the generation of vibrations can be effectively prevented by reducing the number of X-axis directional overpasses.
In addition, the first vision unit 910 (1), the flux immersion unit 400 (1), and the inverter unit 210 (1) are respectively provided on a certain axis L in parallel with the y-axis direction, and thermal deformations of the bonding apparatus 1 and the generation of vibrations can occur [subsequently made effective by reducing the number of transfers in the x-axis direction effectively prevented.
In addition, a recess 410a for receiving flux f is provided at a flux receptacle 410 of the flux immersion unit 400 (FIG. 1), and when the flux receptacle 410 slidably advances into the flux, the recess 410a and the first sight unit 910 (FIG ) are each provided on a certain axis L parallel to the y-axis direction.
Here, referring to FIG. 10, it should be noted that the flux sweeper 412 may be arranged along the x-axis direction at a certain distance from a certain axis L parallel to the y-axis direction. Only when the flux receptacle 410 slidably advances, the recess 410a and the first sighting unit 910 (FIG. 1) for providing a working space for immersion in the flux can be respectively provided on a certain axis L parallel to the y-axis direction.
In the flip-chip bonding device 1 having such a structure, the first vision unit 910 (FIG. 1) can form an image without transfer in the x-axis direction or stop in the process of transferring the bondhead 1120 (FIG. 1) along a certain axis L parallel to the y Photograph the direction of the axis.
In addition, in the flip-chip bonding device 1 having such a structure, the processes of picking up the chip, dipping the chip in the flux and photographing the chip in the process of transferring the bonding head 1120 (FIG y-axis direction are executed.
POSSIBLE 59 * · ♦ • »• • • • • •« «• ·« «« «
That is, since each of the processes in the process of transferring the bonding head 1120 (1) in the y-axis direction without succession in the x-axis direction can be successively performed, the thermal deformation and the generation of vibrations of the bonding apparatus 1 can be effectively prevented.
In addition, the flip-chip bonding apparatus 1 according to an embodiment of the present invention can reduce the transfer distance in a specific axis direction, and for example, the transfer distance in the y-axis direction can be reduced. As described above, the first sighting unit 910 (1), the flux immersion unit 400 (1), and the inverting unit 210 (1) are spaced from each other by a predetermined distance along the y-axis direction, and may include the first viewing unit 910 (1), the flux immersion unit 400 (1) and the inverter unit 210 (1) are arranged close to each other to reduce the transfer distance in the y-axis direction.
Hereinafter, a structure for arranging the flux immersion unit 400 (1) and the inverting unit 210 (1) close to each other to reduce the transfer distance of the bonding head 1120 (1) in the y-axis direction will be described in detail with reference to the accompanying drawings.
The flux immersion unit 400 (FIG. 1) may include a flux receptacle 410 for receiving a flux f for immersing the chip fc, a flux sweeper 412 for flattening the flux f, and a second drive part 413 for slidingly moving the flux receptacle 410.
[SUBSEQUENTLY [60 ♦ * 99 60 ♦ * 99 9 9 9 * 9 9 * 9 9
That is, the flux immersion unit 400 (1) has a structure in which the flux receptacle 410 slidably moves to dive in the flux and flatten the flux.
It should be noted for comparison that the prior art flux immersion unit 400 (FIG. 1) has a problem in that, because the flux receptacle 410 is in engagement with the flux sweeper 412 using a grip, the flux is present flatten the flux receptacle 410, due to the amount of grip during the process disturbances occur. Even if no flux immersion operation is performed, the flux immersion unit 400 (1) should constantly flatten the flux in real time due to a special work environment such as the liquid state of the flux or the like. However, as described above, the bonding head reciprocates between the first vision unit 910 (1), the second vision unit 1130 (1), and the correction unit 700 (1) to inspect whether or not a setting value of the bonding head 1120 (FIG. 1), an error occurs and a skew value is corrected, and because at that point, perturbations occur between the flux immersion unit 400 (1) and the handle, and the flux immersion unit 400 (1) from the first vision unit 910 (1) and the correction unit 700 (1) should be disconnected to avoid interference, there is a limit to the dense arrangement.
Further, it is difficult to use the turning unit 210 (FIG. 1) and the flux immersing unit 400 (FIG. 1) as a result of the driving part (including a plurality of electric elements and a plurality of electric elements)
SUBSEQUENT
♦ # • «• • • • • • • •
Vacuum line) of the turning unit 210 {1) close to each other. According to the present invention, the flux immersion unit 400 (1), the first vision unit 910 (1) and the correction unit 700 (1) can be arranged at maximum density without causing interference to the flux immersion unit 400 (1). While the bonding head 1120 (FIG. 1) performs a correction operation, and the moving distance of the bonding head 1120 (1) in the y-axis direction can be reduced by densely arranging the turning unit 210 (1) and the flux immersing unit 400 (1) Total UPH value can be reduced.
Referring to FIGS. 14 and 15, the flux immersion unit 400 (1) has a main body 414 having a second drive part 413 and an attachment unit 420 for attaching the flux discharger 412 to the main body 414, and the main body 414 is a lower case 415 which rests on an installation surface and may include an upper housing 416, which according to one embodiment is attached to the lower housing 415. The flux receptacle 410 may slidably move through a space created by the lower case 415 and the upper case 416, and the attachment unit 420 may be provided to the upper case 416 or the lower case 415.
At this point, the flux receptacle 410 may move back and forth with respect to the flux sweeper 412.
When the flux receptacle 410 slidably advances, it may be pushed out of the main body 414.
[nachgerioht 62 • »· ··
That is, as the flux receptacle 410 slidably advances for immersion in the flux, the flux receptacle 410 is pushed out of the main body 414 and the flux receptacle 410 can be inserted into the main body 414 as the flux receptacle 410 flattenes the flux sliding forward and backward.
When the flux receptacle 410 is pushed out of the main body 414, the flux receptacle 410 and a first driving part 211 (1) of the turning unit 210 (1) can be arranged so that at least some areas of them overlap the xy plane.
Referring to FIG. 15, as the flux receptacle 410 slidably advances, a first space S1 and a second space S2 may be provided at the top and bottom of the flux receptacle 410.
Referring to FIG. 12, at this point, the first driving part 211 (1) of the turning unit 210 (1) can be disposed in the second space S2 and has a housing 213 (1) disposed in the second space 'and a cable and a vacuum line connected to the turning unit 210 (1) can be provided inside the housing 213 (1). That is, because a plurality of full-length members and the vacuum line are provided with respect to the turn unit 210 (FIG. 1) within the single housing 213 (FIG. 1) to be located in the second space S2 formed below the flux receptacle 410 The dead space of the bonding device 1 can be reduced and the space utilization can be improved.
SUBSCRIBE 63 63 • · • ·· ♦ »t · · · · · · *«
As described above, as the flux receptacle 410 slidably advances to the flux, the recess 410a, the first sighting unit 910 (1), and the inverting unit 210 (1) may each lie on a certain axis L parallel to the y axis. Axial direction can be provided, and the Flußababreicher 412 can be arranged by a predetermined distance along the x-axis direction parallel to the y-axis direction of the given axis L spaced.
In addition, the turning unit 210 (1) and the flux immersing unit 400 (1) may be arranged close to each other by arranging the first driving part 211 (1) of the turning unit 210 (1) in the second space S2 formed below the flux receiving 410 along the y-axis and the flux immersion unit 400 (FIG. 1) and the inverting unit 210 (FIG. 1) may be installed so that the turning unit 210 (FIG. 1) and the recess 410a of the flux receptacle 410 can be arranged on a certain axis L parallel to the y-axis direction ,
Accordingly, by the structure described above, the number of X-axis direction transfers can be reduced, the Y-axis moving distance can be reduced, and at the same time the space utilization of the bonding apparatus 1 can be improved.
It should be noted with reference to FIGS. 12 and 16 that a first space S1 or a second space S2 is provided above or below the flux receptacle 410, for example, and the bonding head 1120 (1) can enter the first space S1 when the first space S1 Flux receptacle 410 is slidably advanced for immersing a chip fc in the flux.
• · · · ♦ ♦ · ♦♦♦ • · ·
• · * ···
Further, when the flux receptacle 410 slidingly moves backward, the bonding head 1120 (FIG. 1) may enter the first space S1. If flux acquisition is sliding forward and backward, the flux can be flattened.
If it is assumed that the flux sweeper 412 moves in place of the slidably moving flux receptacle 410, the above-described first space may disappear as the flux sweeper 412 for flattening the flux moves slidably to the recess 410a of the flux receptacle 410. In this structure, the bondhead 1120 (FIG. 1) may not enter the flux receptacle 410 until flux flattening by the flux sweeper 412 has been completed. In this way, if the entry time of the bondhead 1120 (1) is limited by the interference with the flux sweeper 412, the UPH value of the overall device is affected. In addition, the time for flattening should be reduced to prevent interference between the bondhead 1120 (FIG. 1) and the flux sweeper 412.
Because the bonding head 1120 (FIG. 1) may enter the first space S1 in either case of fluxing or flattening of the flux, if the flux receptacle 410 of the flux immersion unit 400 (1) has a sliding moving structure, the Waiting time for the entrance of the bonding head 1120 (FIG. 1) is removed, sufficient time for flattening the flux can be secured, and at the same time, the UPH value of the entire apparatus can be improved.
[Subsequent Μ * * «* · ·« · · 65
In this case, the mounting unit 420, a rail member 421 for attaching a dip plate 410, a first support member 422 or 424, which is coupled by a hinge hl with the rail member 421 and the upper portion of the Flussmittelabstreichers 412 holds, and a second holding member 423, which by Joint h2 is coupled to the first holding member 422 and the front of the Flussmittelabstreichers 412 holds.
According to one embodiment, the first retaining element 422 or 424 is coupled to the rail member 421 by the hinge hl, and may include a lower member 424 for pressing a projecting portion 412a of the flux discharger 412 and an upper member 422 coupled to the second retaining member 423 by the hinge h2 is, have. At this point, a portion of the lower member 424 may be inserted into the second support member 423.
At this time, the attachment unit 420 may perform a function of exerting a specific adhesion force (pressing force) for flattening the flux between a pushing member 412 and the flux receptacle 410. For this purpose, the mounting unit 420 may include a first elastic member 425 disposed between the first holding member 422 or 424 and the rail member 421, and a second elastic member 426 disposed between the second holding member 423 and the first holding member 422 or 424 , exhibit.
According to one embodiment, the first elastic element 425 may be arranged between the upper element 422 and the lower element 424 of the first holding elements 422 and 424 and
| FOLLOW-UP 66 ♦ «ft ft ft ft · · · · · · · ·« «« «« «
The second elastic element 426 may be arranged between the upper element 422 and the second retaining element 423.
In addition, the first elastic member 425 and the second elastic member 426 may exert elastic force on the flux scrapper 412 from different directions, and according to an embodiment, the first elastic member 425 may have elastic force in the z-axis direction and the second elastic member 426 may have elastic force Apply force in the x-axis direction, while the second holding member 423 is attached to the rail member 421.
Because the elastic forces are applied from different directions, a constant compressive force can be maintained in the flux scrapper 412 and in the flux receptacle 410, and the reliability of the flux flattening process can be ensured.
At this time, a locking protrusion 423a is provided on the second holding member 423, and a locking step 421a in combination with the locking protrusion 423a may be provided on the rail member 421. At this point, the locking step 421a may be disposed on the side of the main body 414. Because the coupling parts 423a and 421a of the attachment unit 420 are not provided on the main body 414 as described above, but disposed on the side, interference with the bonding head 1120 (1) can be prevented.
It should be noted with reference to FIGS. 12 and 16 that, as described above, the flux receptacle 410 is removed from the flux scraper 412 for immersion in the liquid
FOLLOW-UP 67 • · · · · · · · · · · · · · · · · · ···································
• ♦ • ·
Fluxing lubricant can move forwardly and can slide forward and backward for flattening of the flux with respect to Flux Sweeper 412.
As the flux receptacle 410 slidably advances from the flux sweeper 412 at this point, the flux receptacle 410 moves in a direction away from the second drive portion 413, and as the flux receptacle 410 slides sliding back from the flux sweeper 412, the flux receptacle 410 moves toward to the second drive part 413 out.
Referring to Fig. 12, it is noted that a solder bump pattern 11 is provided on the chip fc at a predetermined pitch P and that a flux-f containing recess 410a may be provided at the flux receptacle 410 of the flux dipping unit 400 (Fig. 1). As described above, the flux receptacle 410 may relate to the
Flux remover 412 move forwards and backwards. If the flux receptacle 410 moves forward from the flux sweeper 412 for dipping in the flux (see FIG. 16 (a)), the bond head 1120 (FIG. 1) receiving the chip fc may be raised to the recess 410a of the flux receptacle 410 to direct the flux f onto the flux receptacle Apply solder bump pattern 11. If the application of the flux or the immersion in the flux for one of the chips fc is completed, the flux receptacle 410 will then slide forward and backward relative to the flux sweeper 412 to flatten the flux (see Figure 16 (b)).
POSSIBLE 68 68 • · «« ► · »» * · «* * · # 4 > * * · A # · ♦♦ · »···« φ »· · • *» * • ·· *
Here, the flux immersion unit 400 {1) having a structure capable of slidably moving the flux receptacle 410 has the effect of flattening the flux of the flux receptacle 410 so that the flux can be uniformly applied.
More specifically, referring to FIG. 12, if the dipping of a chip fc into the flux f is completed, a pattern of a concave portion 31 corresponding to the solder bump pattern 11 having a predetermined pitch P is formed in the flux f contained in the recess 410a , This pattern of the concave portion 31 may be referred to as a first dip area.
In this case, if the flux is applied to the next chip on the concave parts 31, due to the concave parts 31, the correct amount of the flux f can not be evenly applied to the solder bumps of the next chip. That is, even after completion of the sliding movement of the flux receptacle 410 for flattening the flux, the concave parts 31 may not be uniformly flattened. In particular, depending on the amount or condition of the flux, or the adhesive force of the flux discharger and the flux acceptor, although the flux has been flattened by the sliding movement of the flux receptacle 410, not all the concave portions 31 may be evenly flattened with only one flattening operation.
The flux collector may be controlled to slidably move to a greater distance, which is less than the pitch P of the solder bump pattern (eg, up to one-half of the distance of the subsequently added 69)
• »♦ · * · • ·
"Solder bump pattern), or that it moves less far to a distance smaller than the distance, so that the concave parts 31 of the first dip area corresponding to the immersion of the previous chip fc into the flux correspond to the concave parts 31 of a second dip area do not overlap the next chip in the flux.
Because the immersion of the next chip into the flux is performed in a region (flattened region) different from the concave parts 31 formed by the solder bumps 11 of the preceding chip fc by the sliding movement structure of the flux receptacle 410, an uncertainty prevailing in the FIG Flattening process may be removed, and the reliability of the continuous multi-chip flux immersion process can be improved accordingly.
Referring to Figs. 12 and 17, it should be noted that the flip-chip bonding device 1 may additionally include a pressure control device 215 for easily detecting whether or not a chip fc is picked up.
For example, the print controller 215 may be connected to the inverter 210 (FIG. 1), and it may be easily detected by the printer controller 215 as to whether a chip fc is being picked up.
In addition, the flip-chip bonding device 1 may include a pressure sensor 214 provided between the bonding head 1120 (FIG. 1) and the pressure control device 215.
FOLLOW-UP • 4 70 • • • • 4 4 ♦ «• · ** ♦ · ♦ ·« »4 4 4 I • 4 ·· ♦ · *
44 I
As described above, the bonding head 1120 {1} and the inverter 210 (1) perform a recording function while the chip fc is being picked up, and it is important to correctly detect whether the chip fc has actually been picked up. In addition, because the adsorption and dissolution of the chip fc are achieved in a relatively short time, it is very important in the process to determine whether the chip fc has actually been picked up or released.
Hereinafter, an example of the inverter unit 210 (1) will be described for the purpose of explanation.
Referring to FIG. 17, the pressure sensor 214 for detecting a suction pressure between the turning unit 210 (1) and a piab 216 is provided as a vacuum generator providing the suction pressure to the inverter unit 210 (1), and the pressure controller 215 between the turning unit 210 (1) and the piab 216, which provides the suction pressure for the turning unit 210 (1) may be provided.
At this point, to properly detect whether the chip fc is being picked up, the pressure control device 215 controls the suction force between the turning unit 210 (FIG. 1) and the pressure control device 215 to be smaller than the suction force between the pressure control device 215 and the piab 216 1, before the chip fc is picked up at the turning unit 210 (FIG. 1), and when the chip 10 has been picked up at the turning unit 210 (FIG. 1), the pressure control device 215 controls the suction force between the turning unit 210 (FIG. 1) and the pressure control device 215 so that it is equal to the suction force between the pressure control device 215 and the Piab 216.
| REPLACED 71 * • «* * * * *« «« * * * ·· ♦ * «» ♦ · * ♦ # *
In other words, the pressure control device 215 controls the flow of the air flowing into the inverter unit 210 (1) to control the suction pressure of the inverter unit 210 (1) to be equal to or similar to the suction pressure of the outside incoming air.
Specifically, the vacuum line between the Piab 216 and the inverter 210 (FIG. 1) may be divided by the pressure controller 215 into a vacuum line between the inverter 210 (FIG. 1) and the pressure controller 215 and a vacuum line between the pressure controller 215 and the Piab 216 it is preferable to arrange the pressure control device 215 such that the length between the turning unit 210 (1) and the pressure control device 215 is smaller than the length between the pressure control device 215 and the piab 216, and the pressure sensor 214 is preferably attached to the vacuum line between the turning unit 210 (FIG. 1) and the pressure control device 215.
When the Piab 216 sucks the air in the vacuum line, the adsorption of the chip fc.
When the pressure control device 215 does not exist in the prior art, the pressure difference in the vacuum line between a state in which the chip fc is received and a state in which the chip fc is released is small, so that it is difficult determine whether the chip fc has been properly picked because the vacuum pressure generated by the piab 216 while the chip 10 is not picked up is much smaller than the pressure of the air sucked by the inverter unit 210 (FIG. 1) (for example, atmospheric pressure).
READY 72 72 • * * * * #
The suction pressure applied to the vacuum passage between the pressure control device 215 and the piab 216 by the pressure control device 215 is the same as that of the prior art regardless of whether the chip fc is picked up, and the suction pressure between the turning unit 210 (FIG. 1) and the pressure control device 215 may be maintained similar to the pressure of the air sucked by the inverter 210 (FIG. 1) (for example, similar to the atmospheric pressure). At this point, the pressure sensor 214 can easily detect the difference between the suction pressures of the inverter 210 (1) and the pressure controller 215 because the suction pressure between the inverter 210 (1) and the pressure controller 215 is similar to the pressure applied by the inverter 210 (1). sucked air is kept when the chip fc is picked up or peeled off. That is, it is difficult in the prior art to determine whether a chip has been picked up because the pressure of the incoming air is considerably less than the vacuum pressure formed. However, because the vacuum pressure formed according to the present invention is similar to the pressure of the inflowing air through the use of the pressure control device 215, the pressure difference can be easily determined even if the pressure of the inflowing air is small, so that it is easy to determine whether the chip fc was recorded or resolved.
Therefore, the pressure sensor 214 is provided between the turning unit 210 (FIG. 1) and the pressure control device, and can detect whether the chip has been picked up or not.
It is undesirable to form a vacuum pressure using the piab 216 without the pressure control device 215, which is similar to the pressure of the inflowing air, because much time is required to form a vacuum state, and
Vacuum can be easily generated by the use of the pressure control device 215.
In the flip-chip bonding apparatus according to the present invention, the positional error caused by the thermal expansion of components caused by the heat generated in the driving part of each of the transfer routes can be minimized.
In addition, in the flip-chip bonding apparatus according to the present invention, by minimizing the movement of the driving means that generates much heat, time for cooling the components overheated by the heat generation can be ensured.
In addition, in the flip-chip bonding device according to the present invention, by minimizing an abrupt acceleration to a high speed and the number of changes in the direction of the bonding head, shocks or the like caused by vibrations or the inertia of the bonding head can be minimized.
In addition, in the flip-chip bonding apparatus according to the present invention, since the positional error caused by the thermal expansion of components caused by the heat generated in the driving part of each of the overpass lines can be minimized, errors of one
Semiconductor manufacturing process can be minimized.
Because in the flip-chip bonding device according to the present invention, in particular, the number of movements and the
SUBSEQUENT
Moving distance of the bonding head can be reduced in a specific Ächssenrichtung, the flip-chip bonding device according to an embodiment of the present invention can reduce the thermal expansion and vibration generated due to the transfer of the bonding head.
In addition, in the flip-chip bonding device according to the present invention, the space utilization can be improved and reduced by the transfer of components between adjacent work spaces and the distance between components located in the adjacent work spaces.
Therefore, in the flip-chip bonding device according to the present invention, the UPH value of the device can be improved while ensuring a sufficient flux flattening time.
Although the present invention has been described with reference to the respective exemplary embodiments, it is not limited by the embodiments but only by the appended claims. It should be understood that those skilled in the art may change or modify the embodiments without departing from the scope and spirit of the present invention.
SUBSEQUENT

权利要求:
Claims (33)
[1]


1. A flip-chip bonding apparatus comprising: a turning unit for picking up a chip from a wafer and turning the chip upside down; a working part having a wafer A bonding head for receiving the chip turned by the turning unit, wherein the bonding head can be transferred along the z-axis direction and rotated with respect to the z-axis, a flux immersion unit for immersing the lower face of the chip received by the bonding head in a flux a first vision unit for photographing an image of the lower surface of the chip dipped by the flux dipping unit, a second vision unit for photographing an image of the upper surface of a bonding substrate to which the chip is to be mounted, a flip-chip bonding portion for bonding a chip on a bond substrate having one, corresponding to a result of that of the first view unit and the second view unit it performed inspection, corrected position, a first transfer line for attaching and transferring the working part along a y-axis direction and POSSIBLE • · · > ···· MM »III, | A pair of second transfer paths parallel to an x-axis direction perpendicular to the first Transfer path are arranged to attach a moving part, which is connected to both ends of the first transfer route, and to transfer the moving part in the x-axis direction perpendicular to the transfer direction of the first transfer route, wherein the flux immersion unit and the first sighting unit on the same Axle are arranged parallel to the first transfer route.
[2]
2. Apparatus according to claim 1, characterized in that the turning unit, the flux immersion unit and the first sighting unit are provided in pairs at symmetrical positions with respect to the y-axis and the first route with the working part is attached to the second transfer route so that a pair of the first transfer routes can be driven independently.
[3]
3. Apparatus according to claim 1, characterized in that the turning unit and the flux immersion unit are arranged on the same axis parallel to the second transfer path.
[4]
4. The device according to claim 1, characterized in that the turning unit, the flux immersion unit and the first sighting unit are arranged on the same axis parallel to the first transfer path.
[5]
5. The device according to claim 1, characterized in that the turning unit, the flux immersion unit and the FOLLOWING ···· ···· tttt ·· > * »· · · *! In order to reduce the moving distance of the bonding head in the x-axis direction as it moves from the turning unit to the bonding substrate, first sighting units are sequentially arranged in the y-axis direction.
[6]
A device according to claim 1, characterized in that the chip passes above the first vision unit while it is being scanned by the bonding head, and the first vision unit inspects the chip by photographing an image of the bottom surface of the chip.
[7]
7. The device according to claim 6, characterized in that, when the size of the chip is larger than the field of view of the first viewing unit, the bonding head is rotated by a predetermined angle, so that 2 edges of the chip can be photographed by the first viewing unit, without to be moved in the x-axis direction.
[8]
An apparatus according to claim 7, characterized in that the images of the lower surface of the chip for inspection are sequentially photographed when the bonding head passes over the first vision unit while being rotated by a predetermined angle.
[9]
The apparatus according to claim 1, further comprising a control part for controlling the driving means of the working part and the moving part, characterized in that the working part and the moving part each have driving means such that the working part and the moving part Part can be transferred along the first transfer line and the second transfer line, wherein the control part drives the drive means of the working part and the POSSIBLE ···· Φ ··· · «! The driving part of the moving part stops while the working part is transferred from the flux immersion unit to or through the first sighting unit.
[10]
The apparatus according to claim 1, further comprising a control part for controlling the driving means of the working part and the moving part, characterized in that the working part and the moving part respectively have driving means such that the working part and the moving part Part can be transferred along the first transfer line and the second transfer route, wherein the control part stops the drive means of the moving part, while the bonding head of the working part is transferred from the turning unit of the flux immersion unit to the first sighting unit or via this.
[11]
11. The device according to claim 9, characterized in that the control part drives the drive means of the working part so that the working part can be transferred at a uniform speed while being transferred from the flux immersion unit to the first viewing unit or via this.
[12]
12. The device according to claim 9 or 10, characterized in that during a bonding cycle in which the bonding head of the working part rotates the turning unit, the flux immersion unit, the first vision unit and the flip-chip bonding part, the moving part less frequently is driven as the working part.
[13]
13. The device according to claim 1, characterized in that a path on an xy plane of the bonding cycle, in which the REPLACED

Bonding head of the working part, the turning unit, the flux immersion unit, the first vision unit and the flip-chip bonding part circulates, is formed in a triangular or rectangular shape and at least one side of the web forming triangle or rectangle parallel to the first transfer path or to the second Transfer route is.
[14]
14. The device according to claim 13, characterized in that when the bondhead is transferred along the side of the triangle or rectangle parallel to the first transfer path forming the web, the bondhead is sequentially through the turning unit, the flux immersion unit, the first Visual unit and the flip-chip bond part is running.
[15]
15. The device according to claim 9, characterized in that during a bonding cycle in which the bonding head of the working part rotates the turning unit, the flux immersion unit, the first sighting unit and the flip-chip bonding part, the moving part is rotated twice or three times Time is driven.
[16]
The apparatus according to claim 9, characterized in that the control part controls the drive means of the working part so that the working part is driven at a uniform speed while passing through the flux immersion unit and the first vision unit, and that the working part is delayed as it is transferred to the flip-chip bond portion.
[17]
17. A flip-chip bonding apparatus comprising: a turning unit for turning a chip to reverse the upper and lower surfaces of the chip;

a first driving part for driving the turning unit, a working part provided so as to be transferable to a predetermined position in the xy plane, and a bonding head for receiving the chip whose upper and lower surfaces have been turned by the turning unit, a flux dipping unit having a flux receiving means for receiving a dipping means of the chip, a flux scraper for flattening the flux and a second driving part for slidably moving the flux receptacle, a first sighting unit for photographing the chip, a second sighting unit for photographing a bonding substrate to which the chip is to be attached, and a flip-chip bonding part for installing the chip on a bonding substrate, the first vision unit and the flux immersion unit being respectively provided on an axis parallel to the y-axis direction, for the number of the movements or the movement down of the bondhead along the x-axis direction.
[18]
18. A flip-chip bonding apparatus comprising: a turning unit for turning a chip to reverse the upper and lower surfaces of the chip, FOLLOWING • 9 9 · · · · ·



81 comprises a first driving part for driving the turning unit, a working part provided so as to be transferable to a predetermined position in the xy plane, and a bonding head for receiving the chip, the upper one thereof and bottom surface by the turning unit, a flux immersion unit having a flux receiving portion for receiving a chip dipping flux, a flux scraper for flattening the flux, and a second driving portion for slidably moving the flux receptacle, a first sighting unit for photographing Chips, a second vision unit for photographing a bond substrate to which the chip is to be attached, and a flip-chip bonding portion for installing the chip on a bond substrate, wherein the first vision unit, the flux immersion unit, and the turn-around unit are respectively parallel to the same axis y-axis direction are provided, to reduce the number of movements or the moving distance of the bonding head along the x-axis direction.
[19]
19. The device according to claim 17 or 18, characterized in that the flux receiving slidably moves with respect to the Flussmittelabstreicher forward and backward. ΓNACHGEREICHT
[20]
20. The device according to claim 19, characterized in that a recess for receiving flux is provided at the flux receiving and the recess and the first viewing unit are each provided on the same axis parallel to the y-axis direction.
[21]
The apparatus of claim 19, characterized in that, as the flux receiving means slidably advances, a first space and a second space are respectively provided in an upper portion and a lower portion of the flux receptacle, and the bonding head is allowed to enter the first space.
[22]
22. The device according to claim 21, characterized in that when the flux receiving for the flattening of the flux slidably moves backwards, the bonding head can enter the first space.
[23]
23. The device according to claim 21, characterized in that the first drive part is arranged in the second space.
[24]
24. The device according to claim 23, characterized in that the first drive part has a housing arranged in the second space and a cable and a vacuum line, which are connected to the turning unit, are provided within the housing.
[25]
The apparatus according to claim 19, characterized in that said flux immersion unit comprises a main body having a second driving part and an attachment unit for attaching the flux discharger to the main body, and the flux receiving is advanced from the main body as the flux receiving slidably advances. REPLACED · ♦ Μ • ♦ «• ♦ · • 53. · ♦ · «···· • · · ♦ · ·« ♦ «· ♦ ··· · * · ♦ *« «
[26]
The apparatus according to claim 25, characterized in that, when the flux receiving means is advanced from the main body, the flux receiving means and the first driving part of the turning unit are arranged so that at least some of their areas overlap on the xy plane.
[27]
27. The device according to claim 25, characterized in that the attachment unit comprises a rail member for attaching the Flußmittelaufnähme, a first holding member which is coupled via a hinge with the rail member and holding an upper portion of the Flussmittelabstreichers, and a second holding element, via a hinge is coupled to the first holding element and holds the front of the Flußmittelabstreichers,
[28]
28. The device according to claim 27, characterized in that a locking projection is provided on the second holding element and a lock step combined with the locking projection is provided on the rail element.
[29]
29. The device according to claim 27, characterized in that the attachment unit comprises a first elastic element which is arranged between the first holding element and the rail element, and a second elastic element which is arranged between the second holding element and the first holding element, and the first and second elastic members exert elastic force on the flux scraper from different directions.
[30]
30. Apparatus according to claim 17, characterized in that the first vision unit photographs an image while the "T (read:

• «

Bonding head is moved along the same axis parallel to the y-axis direction.
[31]
The apparatus according to claim 18, characterized in that the processes of picking up the chip, dipping the chip in the flux and photographing the chip are carried out while the bonding head is moved along the same axis parallel to the y-axis direction.
[32]
32. The apparatus of claim 17, further comprising: a first transfer route for transferring the bondhead in the y-axis direction and a second transfer route for transferring the bondhead in the x-axis direction, wherein the first and second transfer routes have an overlapped portal structure.
[33]
33. The apparatus of claim 17, further comprising: a vacuum generator for providing a suction pressure to the turning unit; a pressure controlling device for controlling the flow of the inflowing air of the turning unit to control the suction pressure of the turning unit to be equal to or similar to that Suction pressure of the incoming air from the outside, and

···················································································································································· • ♦ * | A pressure sensor provided between the turning unit and the pressure control device detects whether the chip is picked up or not. Vienna, 11 July 2013 Applicant by: Haffner and Keschmann Patentanwälte GmbH POSSIBLE REVIEW I

类似技术:

---

公开号 | 公开日 | 专利标题

---

AT512859B1|2018-06-15|Semiconductor chip Turning and fastening device

---

DE112009000667B4|2018-12-06|Dispensing device and method for dispensing material onto a substrate

---

US8233700B2|2012-07-31|Solder printing inspection apparatus and component mounting system

---

DE60112416T2|2006-06-01|DEVICE AND METHOD FOR MOUNTING COMPONENTS

---

DE112008002467B4|2013-08-22|Method for the removal of semiconductor chips from a wafer table and the mounting of the semiconductor chips on a substrate

---

DE10296993T5|2004-08-05|Device and method for assembling electronic components

---

US8156642B2|2012-04-17|Component mounting method

---

AT514134A2|2014-10-15|Flip-chip contacting device and method

---

DE112004000042T5|2005-08-04|Electronic component mounting apparatus and electronic component mounting method

---

KR100609260B1|2006-08-08|Substrate alignment method and apparatus

---

DE112011103582T5|2013-08-29|Assembly device for electronic components and operational procedure for the assembly of electronic components

---

DE112007000408T5|2009-01-02|Assembly procedure, assembly program and component mounting device

---

DE69433718T2|2004-08-19|Manufacturing method for a semiconductor device, where bumps are used for bonding two components

---

DE112007002637T5|2009-10-15|Method for assembling components

---

KR101275133B1|2013-06-17|Flip chip bonding device

---

DE102018109512A1|2018-10-31|Apparatus and method for mounting components on a substrate

---

EP1802192A1|2007-06-27|Method for mounting a flip chip on a substrate

---

JP3771424B2|2006-04-26|Apparatus and method for arranging two members

---

WO2002102127A1|2002-12-19|Device for assembling components on a substrate

---

KR20140003281A|2014-01-09|Semionductor chip bonding system

---

US7170045B2|2007-01-30|Apparatus having at least two image recording devices and its method for placing at least one component in a desired position on a substrate

---

EP2009979A2|2008-12-31|Device and method for populating substrates with components

---

DE102017125932A1|2019-05-09|Method for bonding electrical, electronic, optical, opto-electrical and / or mechanical components to substrates and an associated bonding device

---

JP2009152461A|2009-07-09|Mounting substrate manufacturing method

---

EP1925023A1|2008-05-28|Method and device for depositing electronic components on a substrate

同族专利:

---

公开号 | 公开日

---

AT512859A3|2015-05-15|

---

CN103560093A|2014-02-05|

---

TWI506749B|2015-11-01|

---

AT512859B1|2018-06-15|

---

TW201405747A|2014-02-01|

---

CN103560093B|2016-07-06|

引用文献:

---

公开号 | 申请日 | 公开日 | 申请人 | 专利标题

---

CN105171308A|2015-08-30|2015-12-23|深圳英飞自动化设备有限公司|Automatic welding fixture of semiconductor chip|

---

AT514134A3|2013-03-28|2017-05-15|Hanmi Semiconductor Co Ltd|Flip-chip contacting device and method|JP3132353B2|1995-08-24|2001-02-05|松下電器産業株式会社|Chip mounting device and mounting method|

---

US6874225B2|2001-12-18|2005-04-05|Matsushita Electric Industrial Co., Ltd.|Electronic component mounting apparatus|

---

US7033842B2|2002-03-25|2006-04-25|Matsushita Electric Industrial Co., Ltd.|Electronic component mounting apparatus and electronic component mounting method|

---

JP4334892B2|2003-03-20|2009-09-30|パナソニック株式会社|Component mounting method|

---

JP4057457B2|2003-04-15|2008-03-05|株式会社ディスコ|Flip chip bonder|

---

JP2007173801A|2005-12-22|2007-07-05|Unaxis Internatl Trading Ltd|Method of fitting flip chip to substrate|

---

JP5077936B2|2006-08-31|2012-11-21|ボンドテック株式会社|Mounting apparatus and mounting method|

---

JP4361572B2|2007-02-28|2009-11-11|株式会社新川|Bonding apparatus and method|

---

KR101082827B1|2010-03-19|2011-11-11|아메스산업|Flip chip mounting device having a pickup unit integrated with a vision camera|CN104148865A|2014-08-27|2014-11-19|昆山元崧电子科技有限公司|Auxiliary welding equipment of sensors|

---

KR20170074121A|2015-12-21|2017-06-29|제이티|Flip chip mounting appratus|

---

CN108605431B|2016-01-22|2020-10-30|华封科技有限公司|Component packaging apparatus and method thereof|

---

US11189507B2|2016-03-14|2021-11-30|Capcon Limited|Chip packaging apparatus and method thereof|

---

KR20180026297A|2016-09-02|2018-03-12|제이티|Flip device handler having the same|

---

JP6705727B2|2016-09-26|2020-06-03|ファスフォードテクノロジ株式会社|Flip chip bonder and method for manufacturing semiconductor device|

---

DE102016123362B3|2016-12-02|2018-03-08|Asm Assembly Systems Gmbh & Co. Kg|Picking machine with a displacement device for moving a receiving device for a carrier with Bestückmedium and a method for loading|

---

CN108172532B|2017-12-25|2020-12-25|北京中电科电子装备有限公司|Flip chip bonding device|

---

CN109060307B|2018-09-18|2021-02-09|罗昕明|Flip LED chip detection device|

法律状态:

优先权:

---

申请号 | 申请日 | 专利标题

---

KR1020120050068A|KR101275133B1|2012-05-11|2012-05-11|Flip chip bonding device|

---

KR1020120108058A|KR101360007B1|2012-09-27|2012-09-27|Flip chip bonding apparatus|

---