• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Method for producing a metallized substrate (1), wherein the substrate (1) at least partially, preferably completely, consists of aluminum and / or an aluminum alloy, wherein on at least one surface (2) of the substrate (1) a conductor paste (3) is applied, in a first firing phase (B1), the conductor paste (3) is exposed to a substantially continuously increasing firing temperature (T), wherein the firing temperature (T) is increased to a predetermined maximum firing temperature (Tmax) less than about 660 ° C, in one second firing phase (B2) the conductor paste (3) for a predetermined period (tB) is substantially the predetermined maximum firing temperature (Tmax) is exposed, in a cooling phase (A) the conductor paste (3) is cooled and in a post-treatment phase, a surface (4 ), the conductor paste (3) mechanically aftertreated, preferably brushed, is.
    公开号:AT512041A4
    申请号:T527/2012
    申请日:2012-05-04
    公开日:2013-05-15
    发明作者:
    申请人:Mikroelektronik Ges Mit Beschraenkter Haftung Ab；
    IPC主号:
    专利说明:

    The invention relates to a method for producing a metallized substrate, wherein the substrate consists at least partially, preferably completely, of aluminum and / or an aluminum alloy.
    The material aluminum is becoming increasingly important, especially in the field of power electronics. Due to its relatively low weight and low cost, aluminum is often used as a heat sink for electronic components such as power electronics modules (e.g., LEDs, IGBTs or MOSFETs) or directly as a live conductor, particularly as a power or bus bar. Aluminum has for these purposes both a very high thermal conductivity of about 235 W / (m * K) and a very high electrical conductivity of about 37 * 106 A / (V * m). A chemical property of aluminum is a very fast forming in the air thin oxide layer, which forms by contact with oxygen in the atmosphere as a result of an oxidation process on the surface of an aluminum body. On the one hand, this oxide layer on the one hand offers protection against corrosion, but on the other hand makes it more difficult to join aluminum with other materials by means of soldering, welding or other known joining techniques.
    The object of the invention is therefore to specify an improved method for producing a metallized substrate which consists predominantly of aluminum and / or an aluminum alloy. In particular, it is intended to make it possible to make the surface of the substrate solderable in order to be able to establish electrical contact with the substrate.
    This object is achieved by the features of claim 1. Advantageous embodiments of the invention are specified in the dependent claims.
    According to the invention, it is thus provided that a conductor paste is applied at least in some areas on a surface of the substrate, in a first
    Firing phase, the conductor paste is exposed to a substantially continuously increasing firing temperature, wherein the firing temperature is increased to a predetermined maximum firing temperature less than about 660 ° C, in a second firing phase, the conductor paste for a predetermined period is substantially exposed to the predetermined maximum firing temperature, in a cooling phase the conductor paste is cooled and in a post-treatment phase, a surface of the conductor paste mechanically aftertreated, preferably brushed, is.
    By the given method steps, the surface of a substrate, in particular an aluminum substrate, can be reliably metallized. The areas where the conductor paste is applied by the specified method and sintered according to the method steps, for electrical contacting of the substrate instead of prevailing in this area, oxidized surface of the substrate, this electrically conductive layer, at least partially by the orders and sintering the conductor paste is achieved can be used subsequently, for example, for soldering an electronic component or for soldering a heat sink, the heat sink itself may in turn consist of aluminum.
    The substrate may at least partially, preferably completely, consist of an aluminum material with the highest possible aluminum content. An EN AW-1050A or EN AW-1060A aluminum material according to European Standard EN 573, which contains at least 99.5% by weight or 99.6% by weight aluminum, is preferably used. In spite of somewhat lower liquidus temperatures and lower thermal conductivity compared to the aforementioned substantially pure aluminum materials, it is also possible to use aluminum alloys, for example aluminum alloys comprising manganese or magnesium, e.g. EN AW-3003 (AlMnICu), EN AW-3103 (AIMn1), EN AW-5005 (AIMg1) or EN AW-5754 (AIMg3).
    The proposed method gives the possibility of selectively metallizing individual areas of the surface of an aluminum-based substrate, wherein the metallized areas in the form of a sintered conductor paste are directly materially connected to the substrate and thereby high electrical conductivity and high thermal conductivity from conductor paste to substrate and vice versa. In addition, the metallized regions constitute solderable regions, by means of which the substrate can be connected in a known manner to further components. For example, using conventional solders such as eutectic Sn-Pb, Sn-Ag-Cu or Sn-Au solders, individual electronic components can be soldered to the metallized regions. For improved heat dissipation, the metallized areas can also solder potential-free terminals of components such as high power LED modules or power electronics modules onto an aluminum substrate without having to use an intervening insulating dielectric layer and expensive silver-based thermal grease lower thermal resistance can be achieved. Due to the reduced thermal resistance and the increased thermal conductivity, the sizes of the components connected to the substrate can be reduced or these can be operated at higher power outputs. For soldering the components to the metallized areas, conventional soldering agents (see above) can be used. It can therefore be dispensed with special aluminum solders, which often contain halogens and other harmful substances.
    Another use of the proposed method is to metallize aluminum bus bars to improve the reliability of the connections with associated power cables. By metallizing the surface of an aluminum busbar with a copper-based conductor paste in particular intermetallic diffusion and electrochemical reactions can be prevented with connected copper power cables.
    According to a particularly preferred embodiment it can be provided that the conductor paste is applied to the surface of the substrate by a screen printing process. The screen printing technique is an established method for producing printed conductors on substrates. In the field of power electronics, the following is defined as: • · · · · · · · · · · · · · · · · · · · · · · ·· 4
    Substrate often a so-called "Insulated Metal Substrate" (IMS) used, which comprises a core of aluminum and which is surrounded by an electrically insulating or dielectric layer. The aluminum core is used in this case for improved heat conduction. The printed conductors themselves, which are applied to the insulating layer, for example by means of screen printing technology, are not electrically contacted with the aluminum core.
    However, an object of the invention is to achieve a direct electrical contacting of conductor tracks arranged on the substrate with the substrate itself. This is made possible by the proposed method, the conductor tracks or conductor surfaces can be arranged directly on the substrate without having to form an insulating layer therebetween. A bond between sintered conductor paste and substrate is achieved by which the sintered conductor paste is electrically and thermally contacted directly to the substrate. In this case, conventional conductor pastes in the form of thick-film pastes or sintering pastes can be used. Due to the porosity of thick film pastes different thermal expansions of conductor paste and substrate can be compensated, which can increase the reliability of the connection between the conductor paste and substrate, especially in severe thermal cycling such as in the automotive sector.
    Due to the additive nature of screen printing technology, in which layers are built up on a substrate, the use of exposure and etching processes can be dispensed with for metallizing a substrate surface, which leads to cost advantages of the proposed method.
    A thick-film conductor paste usually comprises at least a metal powder as an electroconductive agent, an inorganic powder (e.g., glass frits) as an adhesive, and organic binders and solvents. The organic binders and solvents lead to a paste-like consistency with certain rheological properties, which are also influenced by the other constituents of the conductor paste. • * * ft φφ ft ft ft ft ft ft ftp ft ft ft ft ft ft 5
    With respect to the constituent of the electroconductive metal powder, it may be preferable to use a conductor paste comprising a copper powder. Of course, it is also possible to use a conductor paste comprising a silver and / or gold powder. The use of copper powder is, however, significantly cheaper.
    With respect to the constituent of the inorganic powder, it may be preferable to use a conductor paste comprising a glass of the PbO-B2C > 3-SiO 2 system and / or a glass comprising B 12 O 3. As a result, a very good adhesion of the conductor paste to the substrate can be achieved during the sintering process in the proposed method despite the prevailing, relatively low firing temperatures.
    After printing a conductor paste, for example by a screen printing method known in the art, the conductor paste essentially remains on the corresponding areas due to its theological properties, without flowing appreciably. In order to optimally prepare the conductor paste applied to the surface of the substrate for firing or sintering, it can preferably be provided that the conductor paste is dried in a drying phase at a temperature of about 80 ° C. to about 200 ° C., preferably 100 °, before the first firing phase C is dried to 150 ° C, more preferably at a maximum of 130 ° C, preferably for a period of about 5 minutes to about 20 minutes. As a result of this drying phase, the solvents present in the conductor paste dissolve essentially completely. Preference is given to known drying methods such as infrared or hot air drying. Through the drying process and the associated dissolution of the solvents in the conductor paste, the conductor paste undergoes a certain volume shrinkage. However, this can be counteracted in advance by a correspondingly thicker orders of conductor paste.
    The firing or sintering of the conductor paste in the first and / or second firing phase of the proposed method can preferably be carried out in a kiln, wherein the firing temperature prevails in the kiln.
    Of course, the drying phase and / or the cooling phase can also take place in the kiln. Preferably, a kiln with a conveyor may be used.
    Depending on the material combination of substrate and conductor paste used, a suitable firing profile can be used. A particular embodiment provides that in the first firing phase, the firing temperature is at least temporarily increased by about 40 ° C / min to about 60 ° C / min. Furthermore, it can be provided that in the first firing phase, the firing temperature to a maximum firing temperature of about 580 ° C, preferably about 565 ° C, more preferably about 548 ° C, is increased.
    Heating the conductor paste above about 400 ° C to 450 ° C causes all organic ingredients, such as organic binders, to substantially completely dissolve and the inorganic components (e.g., glass powder or glass frits) to soften. In addition, the sintering process of the metal powder starts at these temperatures. The softened glass components of the conductor paste subsequently lead to a good adhesion of the conductor paste on the substrate.
    The maximum firing temperature is basically limited by the melting temperature of aluminum, which is about 660 ° C. When using a silver based conductor paste, the maximum firing temperature is preferably about 565 ° C, and when using a copper based conductor paste, the maximum firing temperature is preferably about 548 ° C. These temperatures result from the melting temperatures of possible resulting eutectic aluminum-copper or aluminum-silver alloys.
    With regard to the respective maximum firing temperature, suitable glass constituents are to be selected for a conductor paste whose corresponding glass transition temperature (TG) or melting temperature (Ts) are adapted to this maximum firing temperature. The glass transition temperature or melting temperature of the glass constituent of the corresponding conductor paste should • • * fr fr fr fr * fr * fr * fr * k *% * * «I * fr * * * * * * * * Accordingly, they must be correspondingly below the specified maximum firing temperatures in order to ensure optimum adhesion of the conductor paste to the substrate. Glasses of the Pb0-B20a-SiO2 system or glasses comprising Bi203 are particularly suitable.
    It has proven to be particularly advantageous if the firing of the conductor paste takes place in the second firing phase for about 5 minutes to about 30 minutes. Basically, the longer the period of time in the second firing phase (at maximum firing temperature), the denser the conductor paste will sinter and thus have better properties for further processing (e.g., soldering and welding). However, with excessively long time periods in the second firing phase, the cycle time in a typical stoving oven is correspondingly extended, which can negatively impact the overall throughput.
    In a further advantageous embodiment, it can be provided that in the second combustion phase, the predefinable maximum firing temperature is kept substantially constant.
    Preferably, it can also be provided that the conductor paste in the first firing phase and / or the second firing phase is exposed to a protective gas atmosphere comprising nitrogen. A protective gas atmosphere (e.g., nitrogen) is advantageous for the firing of copper wiring pastes to inhibit the oxidation of the wiring material (there may be a residual oxygen content of several ppm depending on the firing phase). The organic binders of such a material or the conductor paste can be designed so that they can be reduced under a nitrogen atmosphere. For silver wiring pastes, in turn, a conventional air-atmosphere may be advantageous because there is no significant deterioration of the wiring surface due to oxidation. The organic binders used in this case can be oxidized via the atmospheric oxygen.
    In a preferred embodiment of the invention, it can be provided that, during the cooling phase, the firing temperature is at least temporarily reduced by about 20 ° C./min. To about.... *. * I * * * * * * * * * * * * ··· · »« Is reduced by about 40 ° C / min, preferably by about 30 ° C / min. Cooling is preferably carried out to ambient temperature. The slower the cooling, the lower the mechanical effects of the connection between conductor paste and substrate due to different thermal expansion coefficients of the materials used.
    Due to the typical oxidation of the sintered conductor paste, which during the firing or. Sintering process is carried out by the prevailing high temperatures, it is provided that the surface of the conductor paste after cooling is appropriately post-treated mechanically to facilitate further processing, for example, for subsequent soldering or welding process.
    According to a preferred embodiment it can be provided that the conductor paste is applied with a thickness of about 10 pm to about 100 pm to the surface of the substrate. Of course, it is also possible to apply conductor pastes having a thickness of less than 10 pm or conductor pastes having a thickness of more than 100 pm to the surface of the substrate. It can also be provided that the proposed method is applied several times in succession in order to increase the overall resulting thickness of the conductor paste.
    Further details and advantages of the present invention will be explained with reference to the following description of the figures. Showing:
    1 shows a section through a substrate with conductor paste arranged thereon and
    Fig. 2 is a firing profile of the firing temperature with respect to time for an embodiment of the proposed method.
    Fig. 1 shows a (not to scale) cross-section through a substrate 1 of substantially pure aluminum or a high purity aluminum alloy after performing a proposed method. The substrate 1 consists for example of an aluminum material with the quality EN AW-1050A according to European standard EN 573, containing at least 99.5 wt .-% aluminum. The • *
    ι. · * 4 4 4 «t · ·· I • · · * 4« 4 * * 4 · 4 «4 4 · 4 · ♦ ·« 9
    Substrate 1 has a thickness Ds of about 2 mm and a substantially planar surface 2. In general, the substrate 1 may have a thickness Ds of at least 1 mm, while a maximum reasonable thickness Ds may be limited by the further processing of the substrate 1.
    On the surface 2 of the substrate 1, a copper-based conductor paste 3 was screen-printed, i.e., copper-based. the conductor paste 3 used contains a copper powder as an electrically conductive component. The substrate 1 together with conductor paste 3 was treated according to a proposed method corresponding to the focal profile of FIG. 2 to obtain a solderable aluminum substrate 1. The thickness DL of the baked conductor paste 3 after application of the proposed method is about 35 μm in this example. The thickness D1 of the baked or sintered conductor paste 3 can be, for example, about 20 pm to about 40 pm for copper conductor paste and about 10 pm to about 20 pm for silver conductor paste. In order to improve the soldering properties of the conductor paste 3 fired or sintered in the proposed method, the surface 4 of the sintered conductor paste 3 was mechanically aftertreated, for example brushed.
    Fig. 2 shows a possible firing profile for the proposed method. The diagram shown represents the time course of the firing temperature T in a kiln, in which the first firing phase Bi, the second firing phase B2 and the cooling phase A were performed. In the first firing phase Bi, starting from an ambient temperature of about 22 ° C., the firing temperature T is continuously increased up to a predefinable maximum firing temperature Tmax of about 542 ° C. The time profile of the firing temperature T in the first firing phase Bi is substantially S-shaped with a substantially linear portion in which the firing temperature T was increased at a rate Rb of about 46 ° C / min.
    After reaching the predeterminable maximum firing temperature Tmax, the conductor paste 3 and the substrate 1 were exposed to the predetermined maximum firing temperature Tmax of about 542 ° C. for a presettable period t.sub.0 of about 9 min in the second firing phase B2 and the conductor paste 3 was fired or sintered.
    In the subsequent cooling phase A, the firing temperature T has been reduced continuously, the firing temperature T decreasing over the time t in a substantially S-shaped course. Approximately, the reduction rate Ra of the firing temperature T in the cooling phase A averaged about 33 ° C / min.
    Innsbruck, May 2, 2012
    权利要求:
    Claims (13)
    [1]
    I I »· · # # # · · · · · · · · · t φ φφ φφ φφ φφ φφ 1 700 1. 1. 1. 1. 1. 1. 1. 1. 1. 1. 1. (1) consists at least partially, preferably completely, of aluminum and / or an aluminum alloy, characterized in that on at least one surface of a conductor (2) of the substrate (1) a conductor paste (3) is applied, in a first firing phase (Bi) the conductor paste (3) is exposed to a substantially continuously increasing firing temperature (T), wherein the firing temperature (T) is increased to a predeterminable maximum firing temperature (Tmax) less than approximately 660 ° C, in a second firing phase (B2) the conductor paste (3 ) is exposed for a predeterminable time period (ts) substantially to the predefinable maximum firing temperature (Tmax), in a cooling phase (A) the conductor paste (3) is cooled and in a post-treatment phase a surface (4) d he conductor paste (3) mechanically aftertreated, preferably brushed, is.
    [2]
    2. The method according to claim 1, characterized in that the conductor paste (3) by a screen printing process on the surface (2) of the substrate (1) is applied.
    [3]
    3. The method according to claim 1 or 2, characterized in that a conductor paste (3) comprising a copper powder is used.
    [4]
    4. The method according to any one of claims 1 to 3, characterized in that a conductor paste (3) comprising a glass of the Pb0-B203-SiO 2 system and / or a glass comprising B12O3 is used.
    [5]
    5. The method according to any one of claims 1 to 4, characterized in that the conductor paste (3) before the first firing phase (Bi) in a drying phase at a temperature of about 80 ° C to about 200 0C, preferably from 100 ° C to 150 ° C, more preferably at a maximum of 130 ° C, is dried, preferably for a period of about 5 minutes to about 20 min. B • • b b b ft »ft · ft ·. • ft * ft * ft * ft * ♦ · · · * 2
    [6]
    6. The method according to any one of claims 1 to 5, characterized in that at least the firing of the conductor paste (3) in the first firing phase (Bi) and / or the second firing phase (B2) takes place in a kiln, wherein in the kiln, the firing temperature ( T) prevails.
    [7]
    7. The method according to any one of claims 1 to 6, characterized in that in the first combustion phase (B-0, the firing temperature (T) is at least temporarily increased by about 40 ° C / min to about 60 ° C / min.
    [8]
    8. The method according to any one of claims 1 to 7, characterized in that in the first combustion phase (BO the firing temperature (T) to a maximum firing temperature (Tmax) of about 580 ° C, preferably about 565 ° C, more preferably about 548 ° C, is increased.
    [9]
    9. The method according to any one of claims 1 to 8, characterized in that the burning of the conductor paste (3) in the second firing phase (B2) takes place for about 5 minutes to about 30 minutes.
    [10]
    10. The method according to any one of claims 1 to 9, characterized in that in the second combustion phase (B2), the predefinable maximum firing temperature (Tmax) is kept substantially constant.
    [11]
    11. The method according to any one of claims 1 to 10, characterized in that the conductor paste (3) in the first firing phase (B0 and / or the second firing phase (B2)) is exposed to a protective gas atmosphere comprising nitrogen,
    [12]
    12. The method according to any one of claims 1 to 11, characterized in that in the cooling phase (A) the firing temperature (T) at least temporarily by about 20 öC / min to about 40 ° C / min, preferably by about 30 ° C / min , is reduced. ** # * · Φ ··· * * ··· · · tlτ I · · «*« ··· ΦΦ Μ Φ · ΦΙ · Φ ·· 3
    [13]
    13. The method according to any one of claims 1 to 12, characterized in that the conductor paste (3) is applied with a thickness of about 10 pm to about 100 pm on the surface (2) of the substrate (1). Innsbruck, May 2, 2012
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    申请号 | 申请日 | 专利标题
    ATA527/2012A|AT512041B1|2012-05-04|2012-05-04|Method for producing a metallized substrate|ATA527/2012A| AT512041B1|2012-05-04|2012-05-04|Method for producing a metallized substrate|
    KR1020147030225A| KR20150080908A|2012-05-04|2013-04-08|Method for producing a metallised substrate consisting of aluminium|
    RU2014148786/02A| RU2602844C2|2012-05-04|2013-04-08|Method for producing a metallized substrate consisting of aluminium|
    KR1020167030776A| KR101976250B1|2012-05-04|2013-04-08|Method for producing a metallised substrate consisting of aluminium|
    JP2015509253A| JP6185564B2|2012-05-04|2013-04-08|Method for producing metallized substrate made of aluminum|
    PCT/AT2013/000059| WO2013163663A1|2012-05-04|2013-04-08|Method for producing a metallised substrate consisting of aluminium|
    CN201380023448.9A| CN104271300B|2012-05-04|2013-04-08|The method for being used to prepare the substrate of metallization consisted of aluminum|
    CA2871937A| CA2871937C|2012-05-04|2013-04-08|Method for producing a metallized substrate consisting of aluminum|
    EP13724147.7A| EP2844414B1|2012-05-04|2013-04-08|Method of producing a metallised substrate consisting of aluminium|
    TW102113873A| TWI541947B|2012-05-04|2013-04-19|Method of producing a metallised substrate|
    US14/525,651| US20150044360A1|2012-05-04|2014-10-28|Method for producing a metallised substrate consisting of aluminium|
    JP2017062575A| JP6348630B2|2012-05-04|2017-03-28|Method for producing metallized substrate made of aluminum|
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