• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Grinding tool (1), in particular cutting disc, with a matrix (2), in particular with a sintered metal matrix, and diamonds (3) embedded in the matrix (2), wherein at least the majority of the diamonds (3) each comprise at least one wear-promoting particle (4 ) and / or at least one antiperspirant particle (5) is assigned, wherein the at least one wear-promoting particle (4) or the at least one antiperspirant particle (5) is also embedded in the matrix (2).
    公开号:AT511967A4
    申请号:T1778/2011
    申请日:2011-12-01
    公开日:2013-04-15
    发明作者:
    申请人:Swarovski Tyrolit Schleif；
    IPC主号:
    专利说明:

    70639 31 / he 1
    The invention relates to a grinding tool, in particular a cutting disk, with a matrix, in particular with a sintered metal matrix, and diamonds embedded in the matrix. Furthermore, a method for producing the grinding tool according to the invention is to be specified.
    Such grinding tools are state of the art and are described, for example, in AT 506 578 B1. The abrasive action of these tools is based on the diamonds sticking out of the matrix a little and in contact with the object to be ground.
    The abrasive effect can be adversely affected essentially by two effects: First, it can lead to premature breaking out of the diamond from the matrix. On the other hand, the effect was observed that the areas - seen in the abrasive direction - "enforce" in front of the diamond during the grinding process and thus lost the possibility of engagement of the diamonds.
    The object of the present invention is to avoid these disadvantages and to provide a comparison with the prior art improved grinding tool of the type mentioned, and a method for producing the same, wherein the grinding tool according to the invention is characterized in particular by an improved grinding action and increased life.
    This object is achieved by the features of the two independent claims 1 and 11, respectively.
    It is thus provided according to the invention that at least the majority of the diamonds are each assigned at least one wear-promoting particle and / or at least one wear-inhibiting particle, wherein the at least one wear-promoting particle or the at least one wear-inhibiting particle is likewise embedded in the matrix. 2
    If the grinding tool has a preferred grinding direction, it is advantageous if in each case the at least one wear-promoting particle is embedded in the matrix in the direction of the grinding in front of the diamond assigned to it, or if in each case the at least one wear-inhibiting particle behind the grinding direction Diamonds, which it is assigned, embedded in the matrix. The at least one wear-promoting particle then ensures that the region of the bond of the diamond in the matrix-seen in the grinding direction of the grinding tool-wears out sufficiently in front of the diamond, thus preserving the possibility of engagement of the diamond. Conversely, the at least one wear-inhibiting particle in each case causes the wear of the rear region, seen in the grinding direction of the grinding tool, to reduce the binding of the diamond in the matrix and thereby prevent premature break-out of the diamond from the matrix.
    The described effect of the respective at least one wear-promoting particle or of the at least one wear-inhibiting particle can furthermore be increased by the fact that the at least one wear-promoting particle has a smaller distance from the grinding contact surface of the grinding tool than the diamond to which it is assigned , or in each case the at least one wear-resistant particles with respect to the diamond to which it is associated, has a greater distance from the sliding contact surface. In this way, during the abrading of the grinding tool taking place during the grinding process, the at least one wear-promoting particle initially comes into contact with the object to be ground, thereby breaks out and releases the diamond arranged slightly below. If this diamond is additionally assigned a wear-inhibiting particle which is arranged somewhat below the diamond, then this anti-wear particle causes a stabilization of the bond of the diamond in the matrix.
    According to a preferred embodiment it can be provided that the at least one wear-promoting particle at least partially, preferably entirely, consists of pre-sintered granules, preferably of a binder phase and 3 embedded molybdenum disulfide and / or graphite powder. The binder phase may consist at least partially, preferably entirely, of copper, cobalt, iron, bronze or nickel. In alternative embodiments, the at least one wear-promoting particle is at least partially, preferably wholly, glass spheres, mineral granules (ceramics or ceramic fracture) or mineral fracture (e.g., soapstone, limestone, chamotte, silicates, carbonates, nitrides, sulfides).
    The at least one wear-inhibiting particle is preferably at least partially, preferably entirely, of hard metal grit, corundum, silicon carbide and / or boron nitride.
    Furthermore, it has proven to be advantageous if the at least one wear-promoting particle and / or the at least one wear-inhibiting particle has a particle size between 250 μm and 600 μm. It is thus slightly smaller than the preferred grain size of diamonds from 350 pm to 700 pm.
    It is also proposed that the grinding tool comprises at least one grinding segment, wherein the at least one grinding segment is arranged on at least one carrier body, preferably made of steel. In this case, the at least one abrasive segment can be attached to the at least one carrier body, e.g. welded or soldered.
    Protection is also desired for a method for producing the grinding tool according to the invention, the method being characterized in that - in a first method step, a matrix layer is formed from a powdery, sinterable material, - in a second method step diamonds in a predetermined setting pattern on the matrix layer in a third method step, at least one wear-promoting particle and / or at least one wear-inhibiting particle is placed on the matrix layer at a predetermined distance relative to at least the majority of the diamonds; in a fourth method step, the diamond and the respectively is pressed at least one verschißißfördernden particles or each provided at least one anti-wear particles matrix layer, and - in a final process step, a sintering process is performed.
    In an advantageous embodiment of the method, further matrix layers are successively applied as long as possible before the concluding process step, and the second, third and fourth process steps are repeated in each case until a predetermined width has been reached.
    Furthermore, it can be provided that, prior to the second method step, recesses for receiving the diamonds and / or the respectively at least one wear-promoting particle or the respectively at least one wear-inhibiting particle are formed in the matrix layer.
    Finally, with regard to short process times, it has turned out to be advantageous if at least the second and third process steps are carried out simultaneously.
    Further details and advantages of the present invention will be explained in more detail below with reference to the description of the figures with reference to the exemplary embodiments illustrated in the drawings. Show:
    Fig. T is a schematically illustrated plan view of a preferred
    Embodiment of the grinding tool according to the invention in the form of a cutting disk,
    2a is a schematically illustrated plan view of a first preferred embodiment of a grinding segment, 5th
    2b shows a schematically illustrated perspective view of the first preferred embodiment of the grinding segment from FIG. 2a, FIG. 3 shows a schematically illustrated plan view of a second preferred embodiment of a grinding segment,
    4 is a schematic plan view of a third preferred embodiment of a grinding segment,
    5 is a schematic plan view of a fourth preferred embodiment of a grinding segment,
    6 shows a schematically illustrated flow chart for illustrating a preferred embodiment of the method for producing the grinding tool according to the invention; and FIGS. 7a-7d show a schematically illustrated sequence of two method steps in which first the diamonds and subsequently wear-promoting particles are placed on a matrix layer.
    Fig. 1 shows a preferred embodiment of a grinding tool 1 according to the invention in the form of a cutting disc. This is generally a circular, flat disc, which is usually used as part of an angle or cutting grinder for workpiece machining. In addition, cutting discs are also used in wall and floor cutting machines. A distinction is made between different types of cutting discs, which in dargesteilten case is a so-called diamond cutting disc, which is used in particular for the processing of natural stone, concrete or asphalt. In detail, the cutting disc 1 consists of a support body 7 in the form of a steel disc (Trennscheibenbiatt), on the outer circumference of a series of abrasive segments 6 are arranged. The abrasive segments 6 are welded to the outer edge 11 of the carrier body 7. The carrier body 7 further comprises receiving or mounting holes 10 for installation of the cutting wheel 1 in a Winkei- or cut-off machine or in a wall or joint cutting machine.
    The individual abrasive segments 6 are separated by slots 12. In use, the blade 1 is rotated, wherein the blade 1 has a preferred grinding direction D. Cutting discs are usually used for separating material sections and therefore have a very narrow sliding contact surface S, which extends over the end face of the cutting wheel 1.
    In Fig. 2a, one of the abrasive segments 6 is shown enlarged in a first preferred embodiment. The basic component of the grinding segment 6 is a sintered metal matrix 2, in which a plurality of diamonds 3 are embedded. The diamonds 3 have a grain size Kd of 350 μm to 700 μm. The distance between the centers of the diamonds 3 is 1 to 2 mm. In this first preferred embodiment of the grinding segment 6, the majority of the diamonds 3 are each assigned a wear-promoting particle 4, the wear-promoting particles 4 being embedded in the matrix 2 before the diamonds 3, as seen in the grinding direction D. In addition, they have a smaller distance Af to the sliding contact surface S with respect to the diamonds 3 to which they are associated. The grain size Kf of the wear-promoting particles 4 is 250 μm to 600 μm. It should also be pointed out that individual diamonds 3, in particular in the edge region of the grinding segment 6, are each assigned no wear-promoting particle 4. The distance of the center point of the diamonds 3 to the center of the respectively assigned wear-promoting particles 4 corresponds approximately to the particle size Kf of the wear-promoting particles 4.
    FIG. 2b schematically shows a perspective view of the grinding segment 6 from FIG. 2a. It can be seen that the abrasive segment 6 in this case consists of four layers 2 ', which are arranged one above the other and constructed in much the same way as the upper layer facing the observer. The layer structure is indicated by the three dashed dividing lines. The width of the grinding segment 6 is provided with the reference symbol b.
    FIGS. 3, 4 and 5 show three further preferred embodiments of the grinding segment 6. In contrast to the first exemplary embodiment to be seen in FIGS. 2 a and 2 b, the embodiment to be seen in FIG. 3 is characterized in that the plurality of diamonds 3 are each assigned two wear-promoting particles 4. In this way, the wear-promoting effect of these particles 4 (cf., description introduction) is further increased. It should be noted that in this embodiment, both wear-promoting particles 4 - seen in the grinding direction D of the grinding tool - before the diamond, they are assigned, embedded in the matrix 2 and that one of the two particles 4 with respect to the diamond 3 a smaller Distance Af to the sliding contact surface S and the other of the two particles 4 has a greater distance Af to the sliding contact surface S.
    The exemplary embodiment shown in FIG. 4 is characterized in that the diamonds 3 are each assigned a wear-inhibiting particle 5, wherein these wear-inhibiting particles 5 each - seen in the grinding direction D - behind the diamond 3, which they are assigned, in the matrix. 2 are embedded. In addition, they have a greater distance Ah to the sliding contact surface S with respect to the diamonds to which they are assigned. The grain size Kh of the wear-inhibiting particles 5 is in turn between 250 pm and 600 pm.
    The fourth exemplary embodiment of the grinding segment 6, which can be seen in FIG. 5, is finally characterized in that the plurality of diamonds 3 are each assigned at least one wear-promoting particle 4 and a wear-inhibiting particle 5, wherein the wear-promoting particle 4 in each case in the grinding direction D before Diamonds 3, with which it is associated, is embedded in the matrix 2 and the wear-inhibiting particles 5 are each embedded in the matrix 2 in the grinding direction D behind the diamond 3 to which it is associated.
    6 shows, in a schematic flow diagram, the five essential method steps for producing the grinding tool according to the invention. In a first method step i, a matrix layer of a pulverulent, sinterable material is formed. In a second method step ii diamonds are placed in a predetermined setting pattern on the matrix layer. In a third method step iii, depending on the embodiment, at least one wear-promoting particle and / or at least one wear-inhibiting particle are placed on the matrix layer at a predetermined distance relative to at least the majority of the diamonds. In a fourth method step iv, the matrix layer provided with the diamonds and the respective at least one wear-promoting particle or the respectively at least one wear-resistant particle is pressed and finally sintered in a concluding process step v.
    Furthermore, in the preferred embodiment of this method further matrix layers are successively applied before the concluding process step v and the second, third and fourth process steps ii, iii and iv are repeated until a predetermined width b is reached (see also FIG. , In addition, in the preferred embodiment of the method prior to the second method step ii, recesses for receiving the diamonds and the respective at least one wear-promoting particle or the respectively at least one wear-inhibiting particle are formed in the matrix layer.
    With regard to the first method step i, it should be noted that the matrix layer is formed by initially pouring the powdery sinterable material over a portioned portion into a segmented form. After pouring, the surface is scraped to obtain a flat surface. Subsequently, the metal powder layer is slightly pressed. In the course of this pressing, the recesses for receiving the diamonds and the respectively at least one wear-promoting particle or each a wear-inhibiting particle in the matrix layer are formed at the same time, said recesses being e.g. have the shape of conical or truncated pyramids.
    With regard to the second and the third method steps ii and iii, it should be noted that the diamonds and the wear-promoting particles or the wear-inhibiting particles are easily pressed into the metal powder when placed on the matrix layer.
    With regard to the time sequence of the method steps described, it should be noted that, depending on the type and number of setting devices used, the second and third method steps ii and iii are also carried out simultaneously. Basically, in the context of the invention, either two different setting devices are preferably used, one for the diamonds and the other for the wear-promoting and / or wear-inhibiting particles, or there is only a single jig that holds both the diamonds and the wear-promoting and / or or in the latter case, the setting of the diamonds and the wear-promoting and / or wear-inhibiting particles is carried out successively or simultaneously.
    In the case of FIGS. 7a to 7b, the method is carried out with the aid of a common setting device 13, wherein the diamonds 3 and, in the case shown, the particles 4 which promote wear, are successively placed on the matrix layer 2. FIGS. 7a to 7d schematically show an exemplary implementation of the second and the third method step. Not shown is the preceding first method step, in which the metal matrix layer 2 is formed and then recesses 8 and 9 are formed for receiving the diamonds 3 and their associated wear-promoting particles 4.
    In the illustrated setting device 13 is substantially a perforated plate 14 which is provided with holes 15, wherein the bores 15 are penetrated by pins 17 which are connected to a die plate 16. In the interior 19 of the perforated plate 14, a negative pressure is generated, which propagates to the mouths of the bores 15, so that there each one diamond 3, a wear-promoting particle 4 or a wear-inhibiting particles 5 (not shown) can be held. In order to place the sucked diamonds 3, the wear-promoting particles 4 or the wear-inhibiting particles 5 on the preformed metal powder layer 2, the perforated plate 14 is moved so close to the metal powder layer 2, that there is still no suction of powder. If the diamonds 3, the particles 4 or the wear-inhibiting particles 5 were simply dropped from the height determined in this way, the diamonds 3, the wear-promoting particles 4 or the wear-inhibiting particles 5 would not be uniform 3, the wear-promoting particles 4 and the -% 10 wear-inhibiting particles 5 ejected by moving the punch plate 14 in a suitable guide 18 by means of the pins 17. In the illustrated setting device 13, the diamonds 3, the wear-promoting particles 4 or the wear-inhibiting particles 5 are therefore not pressed into the metal powder, as may also be provided (see above).
    Following the setting of the diamonds 3 (Figures 7a and 7b) and the setting of the wear-promoting particles 4 in the illustrated case next to the majority of the diamonds 3 (Figures 7c and 7d), the diamonds 3 and the wear-promoting particles 4 are provided Metal powder layer 2 pressed, if necessary, applied a further metal powder layer 2 and the second, third and fourth process step repeated and finally completed the grinding segment in a sintering process.
    Innsbruck, on November 30, 2011
    权利要求:
    Claims (14)
    [1]
    1. A grinding tool (1), in particular a cutting disk, with a matrix (2), in particular with a sintered metal matrix, and embedded in the matrix (2) diamonds (3), characterized in that at least the plurality the diamond (3) is assigned in each case at least one wear-promoting particle (4) and / or at least one wear-inhibiting particle (5), the at least one wear-promoting particle (4) or the at least one wear-inhibiting particle (5) likewise being introduced into the matrix ( 2) is embedded.
    [2]
    2. Grinding tool (1) according to claim 1, wherein the grinding tool (1) has a preferred grinding direction (D), characterized in that in each case the at least one wear-promoting particles (4) in the grinding direction (D) in front of the diamond (3), which it is associated with, embedded in the matrix (2)
    [3]
    3. grinding tool (1) according to claim 1 or 2, wherein the grinding tool (1) has a preferred grinding direction (D), characterized in that in each case the at least one anti-wear particles (5) in the grinding direction (D) behind the diamond (3) to which it is associated, is embedded in the matrix (2).
    [4]
    4. grinding tool (t) according to one of claims 1 to 3, wherein the grinding tool (1) has a sliding contact surface (S), which faces the object to be ground in the use state, characterized in that in each case at least one verschißißfördernde particles (4) relative to the diamond (3) to which it is associated, a smaller distance (Af) to the sliding contact surface (S).
    [5]
    5. grinding tool (1) according to one of claims 1 to 4, wherein the grinding tool (1) has a sliding contact surface (S), which faces the object to be ground in the use state 2, characterized in that in each case at least one wear-inhibiting particles (5 ) relative to the diamond (3) to which it is associated, a greater distance (Ah) to the sliding contact surface (S).
    [6]
    6. grinding tool (1) according to one of claims 1 to 5, characterized in that the at least one wear-promoting particles (4) at least partially, preferably entirely, from pre-sintered granules, preferably from a binder phase and embedded molybdenum disulfide and / or graphite powder.
    [7]
    7. grinding tool (1) according to claim 6, characterized in that the binding phase consists at least partially, preferably entirely, of copper, cobalt, iron, bronze or nickel.
    [8]
    8. grinding tool (1) according to one of claims 1 to 7, characterized in that the at least one anti-wear particles (5) at least partially, preferably entirely, from hard metal grit, corundum, silicon carbide and / or boron nitride.
    [9]
    9. grinding tool (1) according to one of claims 1 to 8, characterized in that the at least one wear-promoting particles (4) and / or the at least one anti-wear particles (5) a grain size (Kf, Kh) between 250 μιτι and 600 pm having.
    [10]
    10. grinding tool (1) according to one of claims 1 to 9, characterized in that the grinding tool (1) comprises at least one abrasive segment (6), wherein the at least one abrasive segment (6) on at least one support body (7), preferably made of steel , is arranged.
    [11]
    11. A method for producing a grinding tool (1) according to any one of claims 1 to 10, characterized in that 3 - in a first process step (i) a matrix layer (2 ') is formed from a powdery, sinterable material, - in a second Method step (ii) diamonds (3) are placed in a predetermined setting pattern on the matrix layer (2 '), - in a third method step (iii) in each case at least one wear-promoting particle (4) and / or at least one wear-inhibiting particle (5) in one a predetermined distance relative to at least the plurality of diamonds (3) is placed on the matrix layer (2 '), - in a fourth method step (iv) with the diamonds (3) and the respective at least one wear-promoting particles (4) or in each case at least one antiperspirant particle (5) provided matrix layer (2 ') is pressed, and - in a final process step (v) a sintering Pro zess is performed.
    [12]
    12. The method according to claim 11, characterized in that prior to the final process step (v) as long successively applied further matrix layers (2 ') and in each case the second, third and fourth process step (ii, iii, iv) are repeated until a predetermined width (b) is reached.
    [13]
    13. The method according to claim 11 or 12, characterized in that prior to the second method step (ii) recesses (8, 9) for receiving the diamond (3) and / or the respective at least one wear-promoting particle (4) or of each at least a wear-inhibiting particle (5) are formed in the matrix layer (2 ').
    [14]
    14. The method according to any one of claims 11 to 13, characterized in that at least the second and third process step (ii, iii) are carried out simultaneously. Innsbruck, on November 30, 2011
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    同族专利:
    公开号 | 公开日
    AU2012344710A1|2014-06-26|
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    EP2785495B1|2019-05-01|
    WO2013078487A1|2013-06-06|
    US9751191B2|2017-09-05|
    US20170120421A1|2017-05-04|
    EP2785495A1|2014-10-08|
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    AU2012344710B2|2016-02-25|
    引用文献:
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    US9259855B2|2011-07-13|2016-02-16|Tae Ung Um|Diamond tool|DE102019117796A1|2019-07-02|2021-01-07|WIKUS-Sägenfabrik Wilhelm H. Kullmann GmbH & Co. KG|Cutting tool with buffer particles|
    AT522810A1|2019-07-16|2021-02-15|Tyrolit Schleifmittelwerke Swarovski Kg|Sanding segment for a sanding roller|
    KR102182704B1|2019-12-31|2020-11-25|주식회사 르본인터내셔널|A lapping process for precise and rapid lapping|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA1778/2011A|AT511967B1|2011-12-01|2011-12-01|GRINDING TOOL AND METHOD FOR THE PRODUCTION THEREOF|ATA1778/2011A| AT511967B1|2011-12-01|2011-12-01|GRINDING TOOL AND METHOD FOR THE PRODUCTION THEREOF|
    EP12816639.4A| EP2785495B1|2011-12-01|2012-11-28|Grinding tool and method for producing same|
    AU2012344710A| AU2012344710B2|2011-12-01|2012-11-28|Grinding tool and method for producing same|
    PCT/AT2012/000299| WO2013078487A1|2011-12-01|2012-11-28|Grinding tool and method for producing same|
    US14/288,785| US9579774B2|2011-12-01|2014-05-28|Grinding tool and method for producing same|
    US15/405,533| US9751191B2|2011-12-01|2017-01-13|Grinding tool including a matrix and at least one wear-promoting particle embedded in the matrix|
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