• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a device (1) for holding a planar substrate (4), in particular for a wafer or eWLB, with a support (2) forming a support surface (3) for the substrate (2), which supports at least one in the area of the support surface (3). 3) for the substrate (2) provided recess (5), and with at least one with this recess (6) flow-connected holding means for fixing the substrate (2) on the device (1) by means of an intermediate support (2) and substrate ( 4) generated negative pressure. In order to be able to grasp a multiplicity of differently geometrically extending substrates, it is proposed that the support (2) has at least one recess (6) with an elastic seal (7) protruding from a rim (8) of the recess (6) a relative to the edge (8) of the recess retracted or highest with this matching position (9, 10) is designed to be movable.
    公开号:AT511627A1
    申请号:T969/2011
    申请日:2011-07-01
    公开日:2013-01-15
    发明作者:
    申请人:Mechatronic Systemtechnik Gmbh；
    IPC主号:
    专利说明:

    (00 083PAT) jel
    The invention relates to a device for holding a planar substrate, in particular for a wafer or eWLB, with a bearing for the substrate support surface forming support having at least one provided in the region of the support surface for the substrate recess, and at least one flow-connected with this recess Holding means for fixing the substrate to the device by means of a negative pressure generated between the support and the substrate.
    "Vacuum chucks" or holders for wafers or other substrates are known from the prior art (US2010 / 0013169A1) which bind them by means of negative pressure or hold them against their support. Often these also fulfill the task of pulling the substrates into a planar extension. For this purpose, the support surface of the support recesses, which are fluidly connected to the holding means for generating a negative pressure. So that warped substrates can be drawn plan - relatively strong warped substrates are additionally subjected to compressed air to press them on the support surface and thus to allow a full-surface suction of the substrates to the holder. Such compressed air constructions are structurally complex and also have an increased risk of contamination of the pressurized substrate surface, which can disadvantageously lead to damage of the wafers or eWLB (Embedded Wafer Level Ball Grid Array).
    The invention is therefore based on the object to improve a device for holding a flat substrate of the type described in such a structurally simple manner that thus comparatively heavily warped substrates in
    -2- a certain shape can be brought while still the risk of damage to the substrates remains small.
    The invention solves this problem by the fact that the support has at least one recess with an elastic seal, which is formed by a recessed from the edge of the recess, in a respect to the edge of the recess retracted or highest with this matching position movable.
    If the support has at least one recess with an elastic seal, which is designed to be movable from a position recessed to the edge of the recess into a position coinciding with the edge of the recess or highest, this position not only increases the risk of damaging the substrate be kept low by a possible selective deformation of the substrate in the region of the seal, because the seal can retract under the support surface or the edge of the recess when the substrate is attracted to the support surface by negative pressure. In addition, by the above seal and a comparatively strong deviating from the desired geometric shape substrate can be picked up by the device or holder and held sufficiently. Namely, the gasket can equalize or bridge distances between the support surface and the substrate and thus ensure a gas-tight seal. Even comparatively strong deflections (bow), undulations (warp), deviating flatnesses (flattness) and / or thickness deviations (total thickness variation) on the substrate can thereby be compensated, as a result of which a secure hold of the substrate on the device can be ensured. In addition, strong geometric deviations can not hinder full-surface suction of the substrate to the support, so that any substrates can be steadily brought into a desired, predetermined by the edition extent. The device can therefore be distinguished in particular from the prior art in that a comparatively high geometric tolerance with a reduced risk of damage on the sensitive substrate side can be used in a structurally simple manner and it is nevertheless possible to bring substrates into a desired shape or to direct what may be, for example, a Planziehen and / or an alignment. This can be comparatively advantageous in particular in warped or bent substrates.
    In general, it should be understood that the seal may also be provided in a recess which is flow connected to the means of dispensing to create a vacuum between the substrate and the support. A recess can therefore fulfill two technical functions, on the one hand a holding function and on the other hand a technical function with respect to the above.
    Constructive simplicity may result if the elastic seal is made passively movable by the substrate, especially since the motive forces for descaling the seal can be co-generated in a substrate-free condition for the shape of the substrate by suction of the substrate.
    Particularly favorable conditions for attaching the substrate to the device may result if the seal substantially comprises the recess having recess of the support. Likewise, this can increase the tolerance of the device with respect to deformed, for example warped or bent, substrates, since enlarged sealing surfaces can form an extended gastight connection with the substrate. If the seal completely surrounds the recess for sucking the substrate, then a closed suction region can be made possible so that secure fastening can be possible even with comparatively strongly deformed substrates with reduced pressure conditions. The device is therefore not only particularly stable against deviations in the geometry of the substrate but can also avoid damage to the substrate with reduced loads.
    The tolerance to geometric deviations on the substrate can be further increased if the recess for the seal separates the bearing surface into two contact surface portions.
    If the recess for the seal adjoins a marginal bearing surface portion, then the substrate can be brought into a desired shape up to its edge region. Comparatively large bends or warping, which can lead to handling problems especially in the edge areas of the substrate, are compensated so.
    Simple construction conditions may result if the recess having the seal and at least one recess connected in flow with the retaining means are concentric. In addition, the production of such a device is relatively easy to carry out, so that a cost-effective device can be created.
    If the seal is designed as a hose seal, then the deformability of the seal can also be exploited to provide a small load on the substrate. In addition, so that the dimensions of the recess for the seal can be kept low and thus a cost advantage in the production can be made possible.
    In order to secure comparatively large substrates together with their faults to the device or to compensate for their geometrical deviations, the support can have a plurality of recesses which separate the support into a plurality of contact surface portions with seals. Constructively simple, these recesses can be radially offset from each other. Between these recesses with seals further recesses may be provided, which are fluidly connected together with a holding means.
    If at least one recess of a bearing surface portion separated from the other recesses flow-connected to the holding means, then, for example, so different suction pressures between support and substrate can be introduced, so that a particularly gentle straightening of the substrate can be made possible. An advantageous Planziehen or aligning
    -5-
    Substrates can thus result even in strongly warped or bent substrates.
    In the figures, for example, the subject invention is illustrated with reference to several embodiments. Show it
    1 is a side view of a first device with substrate in a sectional view, Fig. 2 is an enlarged detail view of Fig. 1,
    Fig. 3 is a plan view of the device of Fig. 1 without substrate and Fig. 4 is a fragmentary sectional view of another device for holding a substrate.
    1 has a support 2, which forms a support surface 3 for a planar substrate 4, in particular an eWLB. As can be seen according to FIG. 1, the substrate 4 is spherically bent and therefore only partially touches the support surface 3. In order to fix the substrate 4 to the device or to bring it into a desired extent, the support 2 has recesses 5 on, which are fluidly connected to a vacuum line 13 of otherwise not shown holding means for generating negative pressure. Thus, the substrate 4 can be sucked and fixed to the support surface 3, whereby a possibly deviating from the desired shape of the substrate 4 is adapted to the course of the support surface 3. However, in order to be able to receive, fasten or plan shapes comparatively strong spherical bends (concave and / or convex form), the support 2 has at least one recess 6 with an elastic seal 7. In this way, a gas-tight connection of the support 2 to the substrate 4 can be ensured, so that the substrate 4 can be attracted to the support 2 with the aid of negative pressure. The special feature of this seal 7, however, is that this seal 7 is formed by a relative to the edge 8 of the recess 6 protruding layer 9 in a relation to the edge 8 of the recess 6 retracted position 9 or at most with this edge 8 same position 10 movable , The different layers 9 and 10 are shown in particular in FIG. 2. As a result of this retracting seal 7, stresses on the substrate 4 during attraction
    -6- hen this substrate 4 are neglected to the support surface 3, which not only create a particularly tolerant to deflections (Bow), ripples (Warp), deviating flatness (flattness) and thickness variations (Total Thickness Variation) of the substrate operating device, but Also, a comparatively low risk of damage to the substrate may have. The device according to the invention is therefore particularly suitable for comparatively strongly warped or bent substrates on the one hand for their secure mounting and on the other hand for straightening them to a desired geometric shape.
    The elastic seal 7 is passively moved when tightening the substrate 4 to the support surface 3, so that the substrate 4, the seal 7 elastically deformed. On further constructive measures for retracting the seal 7 can be dispensed with, which can provide a cost-effective device 1.
    According to FIG. 3, it can be seen that the seal 7 completely comprises the recess 5 of the rest 2 having the negative pressure. In this way, a particularly gas-tight connection between device 1 and substrate 4 can be created. In addition, the tolerance of the device 1 with respect to geometric variations on the substrate 4 can be increased even further.
    A particular flatness of the attached substrate 4 itself in the edge region of the substrate 4 can be created when the recess for the seal adjoins an edge-side contact surface portion 11. Since the seal thereby separates the bearing surface 3 into at least two bearing surface portions 11 and 12, the outer bearing surface 11 can also improve the attraction of the substrate to the bearing surface 4 as a floating bearing.
    The recesses 5 and 6 are concentric. The seal 7 is designed for high ductility as a hose seal. For larger substrates 4, the support 2 may have a plurality of radially offset recesses 6 with seals 7, which is shown in more detail in FIG. 4 • t * t «t« * * * tt · «· · # ·» «• ♦ wt «·» · T · · «I f« · t · «· 7 has been. As a result, a plurality of contact surface portions 11, 12 and 14 can be created. Advantageously, the recesses 6, 6 'are radially offset from each other.
    The recesses 5 'are fluidly connected via a separate vacuum line 13' to the holding means. Thus, between the recesses 6, 6 'with seals 7, T and recesses 5', 5 are provided, which can be acted upon with different negative pressure conditions. A comparatively gentle holding and / or straightening of substrates 1 can thus be set or ensured.
    权利要求:
    Claims (9)
    [1]
    Patent Attorney Dipl.-Ing. Friedrich Jell Hittmairstraße 11, A-4020 Linz (00 083PAT) Claims 1. A device for holding a planar substrate (4), in particular for a wafer and / or eWLB, with a support surface (3) for the substrate (2). forming support (2) having at least one in the region of the support surface (3) for the substrate (2) provided recess (5), and at least one with this recess (6) flow-connected holding means (13) for fixing the substrate (2 ) on the device (1) with the aid of a negative pressure generated between the support (2) and the substrate (4), characterized in that the support (2) has at least one recess (6) with an elastic seal (7) which extends from one the edge (8) of the recess (6) projecting in a relation to the edge (8) of the recess (6) retracted or highest with this matching layer (9, 10) is designed to be movable.
    [2]
    2. Apparatus according to claim 1, characterized in that the elastic seal (7) through the substrate (7) is formed passively movable.
    [3]
    3. Device according to claim 1 or 2, characterized in that the seal (7) substantially, preferably completely, the negative pressure having recess (5) of the support (2).
    [4]
    4. Apparatus according to claim 1, 2 or 3, characterized in that the recess (6) for the seal (7), the support surface (3) in two bearing surface portions (11, 12) separates.
    [5]
    5. Apparatus according to claim 4, characterized in that the recess (6) for the seal (7) to a marginal bearing surface portion (11) connects. 2
    [6]
    6. Device according to one of claims 1 to 5, characterized in that at least one of the seal (7) aulweisende recess (6) and at least one flow-connected with the holding means recess (5) extend concentrically.
    [7]
    7. Device according to one of claims 1 to 6, characterized in that the seal (7) is designed as a hose seal.
    [8]
    8. Device according to one of claims 1 to 7, characterized in that the support (2) a plurality, the support (2) in a plurality of bearing surface portions (11, 12, 14) separating recesses (6, 6 ') with seals (7, T), which recesses (6, 6 ') in particular radially offset from each other.
    [9]
    9. Apparatus according to claim 8, characterized in that at least one recess (5 or 5 ') of a bearing surface portion (11, 12 or 14) separated from the other recesses (5' and 5) with the holding means (13) is fluidly connected , Linz, June 30, 2011 Mechatronic Systemtechnik GmbH

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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    WO1996014965A1|1994-11-09|1996-05-23|Sapim Amada S.P.A.|Device for gripping and handling pieces of sheet material and manipulator of pieces of sheet material comprising this device|
    DE19753226A1|1996-12-03|1998-06-04|Smc Kk|Workpiece attraction device|
    US6517130B1|2000-03-14|2003-02-11|Applied Materials, Inc.|Self positioning vacuum chuck|
    JPS57177536A|1981-04-27|1982-11-01|Hitachi Ltd|Vacuum attracting stand and method for vacuum attraction|
    US5870271A|1997-02-19|1999-02-09|Applied Materials, Inc.|Pressure actuated sealing diaphragm for chucks|
    US6939206B2|2001-03-12|2005-09-06|Asm Nutool, Inc.|Method and apparatus of sealing wafer backside for full-face electrochemical plating|
    US20070026772A1|2005-07-28|2007-02-01|Dolechek Kert L|Apparatus for use in processing a semiconductor workpiece|
    US8336188B2|2008-07-17|2012-12-25|Formfactor, Inc.|Thin wafer chuck|JP2014072510A|2012-10-02|2014-04-21|Disco Abrasive Syst Ltd|Chuck table|
    KR102005649B1|2014-12-12|2019-10-01|캐논 가부시끼가이샤|Substrate holding apparatus, lithography apparatus, and article manufacturing method|
    US20170053822A1|2015-08-23|2017-02-23|Camtek Ltd.|Warped wafers vacuum chuck|
    JP6851382B2|2016-01-13|2021-03-31|アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ|A holding configuration for holding the board, a carrier for supporting the board, a vacuum processing system, a method for holding the board, and a method for releasing the board.|
    US10468288B2|2016-10-19|2019-11-05|Kla-Tencor Corporation|Methods and systems for chucking a warped wafer|
    EP3756215A4|2018-02-20|2021-11-10|Applied Materials, Inc.|Patterned vacuum chuck for double-sided processing|
    KR20190116037A|2018-04-03|2019-10-14|에스케이하이닉스 주식회사|Wafer chunking apparatus and wafer test equipment having the same|
    US10978326B2|2018-10-29|2021-04-13|Taiwan Semiconductor Manufacturing Co, , Ltd.|Semiconductor wafer storage device|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA969/2011A|AT511627B1|2011-07-01|2011-07-01|DEVICE FOR HOLDING A SURFACE SUBSTRATE|ATA969/2011A| AT511627B1|2011-07-01|2011-07-01|DEVICE FOR HOLDING A SURFACE SUBSTRATE|
    EP12748380.8A| EP2727138B1|2011-07-01|2012-07-02|Device for holding a planar substrate|
    US14/130,349| US9558984B2|2011-07-01|2012-07-02|Device for holding a planar substrate|
    PCT/AT2012/050092| WO2013003877A1|2011-07-01|2012-07-02|Device for holding a planar substrate|
    SG10201605420XA| SG10201605420XA|2011-07-01|2012-07-02|Device for holding a planar substrate|
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