• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    An electronic device (1, 1a, 1b) comprising a housing (11) and an electronic module (3), the housing (11) having a housing element (2) within which the electronic module (3) is arranged, and wherein the housing element (2) has an opening, wherein the opening (10) is closed by a closure element (8, 8a, 8b), which consists of potting compound, and that the closure element (8, 8a, 8b) the housing element (2) only partially completed.
    公开号:AT14902U1
    申请号:TGM49/2015U
    申请日:2015-02-24
    公开日:2016-08-15
    发明作者:Jamie Kelly；Ian Wilson；Menezes Cristiano De
    申请人:Tridonic Gmbh & Co Kg；
    IPC主号:
    专利说明:

    description
    ELECTRONIC EQUIPMENT HOUSING WITH MOLDING CAP
    The invention relates to an electronic device having a housing. The housing is closed with a closure element made of potting compound at an opening.
    For tightly sealing housings of electronic devices, a variety of different techniques are known. In particular in the field of electronic components, it is known to arrange one or more electronic components in a housing element, so that connection lines protrude from the housing element. A seal is achieved by casting the entire volume of the housing member. Thus, the electronic components are completely enclosed by the potting compound.
    For example, the German utility model DE 20 2007 003 687 U1 shows a housing in which a circuit board is arranged with a plurality of electronic components. The entire area of the housing element around the components is surrounded by a potting compound. Connection cables are connected to connections with the circuit board and protrude out of the housing. However, the potting compound does not extend to the area of the terminals. The case shown there is disadvantageous, since no complete sealing of the connecting lines takes place through the potting compound. Furthermore, a large amount of potting compound is required there, which leads to high production costs.
    The invention is based on the object to provide an electronic device, which at the same time has a very good seal against environmental influences and only causes low production costs.
    The object is achieved for the device by the features of the independent claim 1. Advantageous developments are the subject of the dependent claims.
    An inventive electronic device has a housing and an electronic module. The housing has a housing element, within which the electronics module is arranged. The housing element in this case has an opening which is closed by a closure element made of potting compound. The closure element fills the housing element only partially. This ensures that a very good seal (eg. According to protection IP67) against moisture, dust and other environmental influences is achieved with low required amount of potting compound. In addition, a low weight of the electronic device is achieved by the low amount of potting compound used.
    Preferably, the opening is formed to introduce the electronics assembly through the opening in the housing member. So a very simple production can be achieved.
    Preferably, the closure element closes the opening of the housing element from tight. This ensures reliable protection against environmental influences.
    Advantageously, the housing element next to the opening via no other openings. An inner space of the housing element is sealed by the closure element against an outer space of the housing element. This achieves a particularly good seal against environmental influences.
    Preferably, the housing member on an inner side (concave and / or convex) holding elements, which hold the closure element in position in the opening of the housing element. Thus, a particularly durable and tight closure of the housing element is achieved by the closure element.
    Preferably, the electronics module is connected to at least one connection with at least one connecting line. The connection lead leads from the electronics module through the closure element to outside the housing. The closure element thereby closes tightly around the connecting line. This protects the electronic module from environmental influences while at the same time making it easy to contact the electronics module.
    Preferably, the closure element comprises the at least one connecting line so tight that the closure element forms a strain relief of the at least one connecting line relative to the at least one connection. So can be dispensed with an additional strain relief, which further reduces the manufacturing cost.
    Preferably, the closure element fills the housing element only in the region of the opening. The closure element does not touch the electronic assembly. In this way, a particularly simple production is achieved since it is not necessary to pay attention to thermal stresses between the closure element and the electronics assembly.
    Alternatively, the closure element fills the housing element in the region of the opening and in the region of the at least one connection. The closure element closes off an end of at least one connecting line tightly. Thus it is achieved that e.g. between an insulation and a core of the connecting line also no moisture, etc. can penetrate into the interior of the housing member. In addition, the electronics module is additionally fixed by the closure element in the housing element.
    Preferably, the potting compound of the closure element polyurethane or epoxy resin or similar materials. These are also preferably enriched with additives for different purposes to form the potting compound depending on the application.
    Preferably, an interior of the housing element is filled with a dehumidified atmosphere and / or protective atmosphere. Thus, an additional extension of the life of the electronic device is achieved.
    The electronic device according to the invention is, for example, an operating device for lighting, such as electronic ballasts, transformers for halogen lamps or an LED converter for a LED bulb.
    Preferably, the electronic device is a voltage converter. In this case, the electronics package is a voltage converter assembly. So very well sealed voltage transformers can be produced with low production costs.
    The invention will be described by way of example with reference to the drawing, in which an advantageous embodiment of the invention is shown. In the drawings: FIG. 1 shows a first embodiment of the electronic device according to the invention in a sectional view; FIG. 2 shows a second embodiment of the electronic device according to the invention in a sectional view, and [0022] FIG. 3 shows a third embodiment of the electronic device according to the invention in an external view.
    First, the structure and operation of various embodiments of the electronic device according to the invention will be described with reference to FIGS. 1-2. Finally, with reference to Fig. 3 further discussed the structure and operation of an embodiment of the device according to the invention. Identical elements have not been repeatedly shown and described in similar figures.
    In Fig. 1, a first embodiment of the inventive electronic device 1a is shown. The electronic device 1a in this case has a housing 11, which has a housing element 2 and a closure element 8a. Within the housing element 2 while an electronic module 3 is arranged. The electronic assembly 3 has, for example, a circuit board and a plurality of components. In this case, a cavity 5 is arranged between the housing element 2 and the electronic module 3.
    In the example shown here, the board of the electronic module 3 does not touch the housing element 2. Alternatively, the board of the electronic package 3 may contact the inside of the case member 2 and optionally be held in position by a groove of the inside of the case member 2. Alternatively, a fixation of the electronics assembly 3 by spacers is conceivable.
    The electronic module 3 has terminals 6a, to which the electronic module 3 is connected to connecting lines 7. The housing element 2 in this case has an opening 10 which is closed by a closure element 8a. The closure element 8a is a potting compound which closes and seals the opening 10. The connecting lines 7 are guided through the closure element 8a. The closure element 8a is arranged close to the connecting lines 7 and seals the passage of the connection lines 7 with respect to an outer space of the housing 11. In this case, the closure element 8a is preferably arranged so tightly on the connection lines 7 that the closure element 8a forms a strain relief of the connection lines with respect to the connections 6a. The housing element 2 also has retaining elements 9, which hold the closure element 8a in position in the opening 10.
    The closure element 8a is arranged in the embodiment shown here only in the region of the opening 10 and does not touch the electronic assembly 3. That only a small amount of potting compound is needed to form the closure element 8a. A hermetic seal of the interior of the housing 11 with respect to an exterior space is achieved.
    The opening 10 is formed so large that the electronic module 3 can be inserted through the opening 10 in the housing element 2.
    The housing element 2 has next to the opening 10 via no further opening. Thus, by sealing the opening 10 by means of the closure element 8a, a complete sealing of the interior of the housing 11 with respect to the exterior space is achieved. Otherwise, any other openings are preferably also sealed according to the invention.
    2, an alternative embodiment of the electronic device 16 according to the invention is shown. In the exemplary embodiment illustrated here, the closure element 8b is arranged in the region of the opening 10 of the housing element 2, as in the exemplary embodiment illustrated in FIG. In addition, however, the closure element 8b also extends in the region of the terminals 6b, which correspond to the terminals 6a of FIG. The connections 6b are shown here in white only for the sake of clarity. This is not to be understood as a recess in the potting compound. By covering the terminals 6b and thus also the ends of the connection lines 7, a closure of the ends of the connection lines 7 is achieved. Thus, an even better sealing of the interior of the housing 11 is achieved with respect to the outer space, since now even through the connecting lines 7, e.g. between an insulation and a core of a connecting line, no environmental influences can penetrate into the interior of the housing 11.
    The interior of the housing element 2 is preferably further filled with a dehumidified atmosphere or a protective atmosphere.
    In Fig. 3, finally, an external view of an embodiment of the electronic device 1 according to the invention is shown. It can be clearly seen here that the housing 11 has only one opening 10, which is closed by the closure element 8.
    The potting compound is preferably polyurethane or epoxy resin. This may be enriched with additives, e.g. cause a better adhesion of the closure element on the housing element.
    In addition, the potting compound may be added additives which avoid thermal stresses. In particular, additives are available which bring about an adaptation to the thermal expansion of the housing element.
    In addition, the connection lines may be provided in the region of the outlet from the closure element on the outside of the housing 11 with a kink protection, which is also held by the closure element in position. Thus, a sharp kinking of the cable can be avoided at this point.
    For the production of the electronic device, first the electronic module 3 and the housing element 2 are manufactured separately from each other. At the terminals 6a, 6b of the electronic module 3, the connecting lines 7 are then attached. In a third step, the electronic module 3 is inserted into the housing element 2. In a fourth step, the region of the opening 10 of the housing element 2 and optionally the area around the connections 6b are filled with potting compound to form the closure element 8, 8a, 8b. In this case, the housing 11 is preferably placed vertically, so that the opening 10 faces downward. By way of a cannula guided through the not yet solidified potting compound, it is optionally possible to provide the interior of the housing 11 with a dehumidified atmosphere or a protective atmosphere. In this case, the cannula is then removed again, closing the resulting hole by the uncured potting compound. After hardening of the potting compound, the closure element 8, 8a, 8b has formed.
    The present invention is not limited to the illustrated embodiment. As already mentioned, various electronic devices can be constructed according to the invention. Any number of connection lines can be guided by the closure element. The housing element can also be made of different materials. Even an arrangement of only one electronic component within the housing element is conceivable. All features described above or features shown in the figures can be combined with each other in any advantageous manner within the scope of the invention.
    权利要求:
    Claims (12)
    [1]
    claims
    An electronic device (1, 1a, 1b) having a housing (11) and an electronic module (3), wherein the housing (11) has a housing element (2) within which the electronics module (3) is arranged , and wherein the housing element (2) has an opening (10), characterized in that the opening (10) is closed by a closure element (8, 8a, 8b) which consists of potting compound, and in that the closure element (8, 8a , 8b) only partially fills the housing element (2).
    [2]
    2. Electronic device (1, 1a, 1b) according to claim 1, characterized in that the opening (10) is designed to introduce the electronics assembly (3) through the opening (10) in the housing element (2).
    [3]
    3. Electronic device (1, 1a, 1b) according to claim 1 or 2, characterized in that the closure element (8, 8a, 8b) closes the opening (10) of the housing element (2) tight.
    [4]
    4. Electronic device (1, 1a, 1b) according to one of claims 1 to 3, characterized in that the housing element (2) next to the opening (10) has no further opening, and that an interior of the housing element (2) by the closure element (8, 8a, 8b) is sealed against an outer space of the housing element (2).
    [5]
    5. Electronic device (1, 1a, 1b) according to one of claims 1 to 4, characterized in that the housing element (2) on an inner side holding elements (9), which are adapted to the closure element (8, 8a, 8b ) in position in the opening (10) of the housing element (2).
    [6]
    6. Electronic device (1, 1a, 1b) according to one of claims 1 to 5, characterized in that the electronics module (3) is connected to at least one connection (6a, 6b) with at least one connecting line (7), which from the electronics module (3) through the closure element (8, 8a, 8b) passes through outside the housing (11), and that the closure element (8, 8a, 8b) around the at least one connecting line (7) around seals ,
    [7]
    7. Electronic device (1, 1a, 1b) according to claim 6, characterized in that the closure element (8, 8a, 8b), the at least one connecting line (7) so closely comprises that the closure element (8, 8a, 8b) a Strain relief of at least one connecting line (7) relative to the at least one terminal (6a, 6b) forms.
    [8]
    8. Electronic device (1a, 1b) according to one of claims 1 to 7, characterized in that the closure element (8a) fills the housing element (2) only in the region of the opening (10), and that the closure element (8a) the electronics Assembly (3) not touched.
    [9]
    9. Electronic device (1b) according to one of claims 1 to 7, characterized in that the closure element (8b) fills the housing element (2) in the region of the opening (10) and in the region of the at least one connection, and in that the closure element (8) 8b), a housing-side end of the at least one connecting line (7) tightly seals.
    [10]
    10. Electronic device (1, 1a, 1b) according to one of claims 1 to 9, characterized in that the potting compound of the closure element (8, 8a, 8b) is formed of polyurethane or epoxy resin, which is preferably enriched with additives.
    [11]
    11. Electronic device (1, 1a, 1b) according to one of claims 1 to 10, characterized in that an interior of the housing element (2) is filled with a dehumidified atmosphere and / or a protective atmosphere.
    [12]
    12. The electronic device (1, 1a, 1b) according to any one of claims 1 to 11, characterized in that the electronic device (1, 1a, 1b) is a voltage converter, and that the electronic assembly (3) is a voltage converter assembly (3) is. For this 1 sheet drawings
    类似技术:
    公开号 | 公开日 | 专利标题
    EP1806564B1|2014-09-10|Case closure for electronics enclosure and method for its manufacture
    EP3132506B1|2018-12-26|Cable outlet
    DE102010037193A1|2012-03-01|Cable strain relief
    AT14902U1|2016-08-15|Electronic device housing with potting compound closure
    WO2004055947A1|2004-07-01|Electrical connector
    DE102011052576B3|2012-12-06|Electrical device with sealing element, sealing element for an electrical device and method for sealing a housing
    EP2012395A2|2009-01-07|Electrical connector with bumper and/or cable insertion point made of elastic material
    DE4225267C2|1998-05-07|Sealing device for an electronic switching device
    AT14653U1|2016-03-15|Protective sleeve for sealing a connecting cable to a housing
    EP1870909A1|2007-12-26|Ribbon cable
    DD156210A1|1982-08-04|UNIVERSAL MUFF FOR REMOTE AND POWER CABLES
    DE102009046870B4|2017-05-24|Electronic switching device with connection cable
    DE2900763A1|1980-07-17|PROCEDURE, IN PARTICULAR CABLE AND FLAT PLUG GUIDANCE
    DE102013014794B4|2019-03-14|Device for covering and / or sealing a wall breakthrough and spout with a jacket of elastomeric material
    DE202012012274U1|2013-02-11|Temperature measuring device
    EP3018780B1|2020-07-01|Electrical connection cable for lamp module
    DE4207850C2|1997-11-27|Electrical device socket
    DE19533723A1|1997-03-13|Arrangement with two-part housing and at least one plug connector for electronics equipment
    DE202009008500U1|2009-08-27|Cable locking plug
    DE4441829B4|2007-04-26|Electrical connector
    AT15525U1|2017-11-15|Electronic component and method for its production
    DE19802175A1|1999-08-05|Transformation device
    DE102013226236A1|2015-06-18|Electrical assembly
    DE102019103288A1|2020-08-13|Electronic device for an endoscope and an endoscope
    DE10228948A1|2004-01-22|Electrical device has encapsulated housing for electrical circuitry, and arrangement| for electrically connecting circuits in housing to electrical arrangements for connection outside housing
    同族专利:
    公开号 | 公开日
    DE202014104730U1|2016-01-07|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    DE2336726C2|1973-07-19|1982-02-11|Robert Bosch Gmbh, 7000 Stuttgart|Pressure-tight connection of an electrical device|
    US4213106A|1977-09-30|1980-07-15|Murata Manufacturing Co., Ltd.|Tuning apparatus and method of producing the same|
    JPH06150840A|1992-10-30|1994-05-31|Sony Corp|Cathode-ray tube|
    EP2184962A2|2008-11-07|2010-05-12|Egston System Electronics Eggenburg Gmbh|Electrical device with an electrical component assembly and a housing|
    EP2615893A1|2012-01-12|2013-07-17|Hydrelis|Sealed assembled housing containing electronics|
    WO2014146614A1|2013-03-22|2014-09-25|Dow Corning Holding Co., Ltd.|Sectioned potting in power converters|
    DE3733693C2|1986-10-28|1998-10-01|Hofsaes Geb Zeitz Ulrika|Temperature switching device|
    DE202007003687U1|2007-03-09|2008-07-10|Pepperl + Fuchs Gmbh|Arrangement with housing, electronic components and potting compound|
    DE102011107110B4|2011-07-12|2013-04-18|Marcel P. HOFSAESS|Method for surrounding an electrical component with a protective housing and electrical component with a protective housing|JP6384383B2|2015-03-30|2018-09-05|株式会社デンソー|Electronic equipment|
    DE102016123917A1|2016-12-09|2018-06-14|Endress+Hauser SE+Co. KG|Electronics assembly|
    DE102020104144A1|2020-02-18|2021-08-19|Dr. Ing. H.C. F. Porsche Aktiengesellschaft|Housing bushing|
    法律状态:
    2019-10-15| MM01| Lapse because of not paying annual fees|Effective date: 20190228 |
    优先权:
    申请号 | 申请日 | 专利标题
    DE202014104730.1U|DE202014104730U1|2014-10-01|2014-10-01|Electronic device housing with potting compound closure|
    [返回顶部]